Light curing molding ink set, and method for manufacturing light cured article

Patent metadata

Field	Value
Publication number	US-11111401-B2
Application number	US-201615759796-A
Country	US
Kind code	B2
Filing date	Sep 15, 2016
Priority date	Sep 15, 2015
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

There is provided a light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material and a resin composition for a supporting material used for shaping the supporting material, wherein surface tension Mt (mN/m) of the resin composition for a modeling material is greater than surface tension St (mN/m) of the resin composition for a supporting material, and the surface tension Mt and the surface tension St satisfy the [0<Mt −St<5] expression, and this light curing molding ink set can afford a light cured article having the good dimensional accuracy.

First claim

The invention claimed is:

1. A light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material and a resin composition for a supporting material used for shaping the supporting material,
wherein surface tension Mt (mN/m) of the resin composition for a modeling material is greater than surface tension St (mN/m) of the resin composition for a supporting material, and the surface tension Mt and the surface tension St satisfy the following (i) expression:
0< Mt−St< 5  (i).

2. The light curing molding ink set according to claim 1 , wherein the surface tension Mt is 26.0 to 33.3 mN/m.

3. The light curing molding ink set according to claim 1 , wherein the resin composition for a modeling material contains a water-insoluble monofunctional ethylenic unsaturated monomer (A), a di- or more-functional polyfunctional ethylenic unsaturated monomer (B), a photopolymerization initiator (C), and a surface adjusting agent (D).

4. The light curing molding ink set according to claim 3 , wherein a content of the water-insoluble monofunctional ethylenic unsaturated monomer (A) is 19 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.

5. The light curing molding ink set according to claim 3 , wherein a content of the di- or more-functional polyfunctional ethylenic unsaturated monomer (B) is 15 to 60 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.

6. The light curing molding ink set according to claim 3 , wherein a content of the water-insoluble monofunctional ethylenic unsaturated monomer (A) is 19 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material, and a content of the di- or more-functional polyfunctional ethylenic unsaturated monomer (B) is 15 to 60 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.

7. The light curing molding ink set according to claim 3 , wherein the resin composition for a modeling material further contains an oligomer.

8. The light curing molding ink set according to claim 7 , wherein a content of the oligomer is 10 to 45 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.

9. The light curing molding ink set according to claim 1 , wherein the surface tension St is 24.0 to 33.0 mN/m.

10. The light curing molding ink set according to claim 1 , wherein the resin composition for a supporting material contains a water-soluble monofunctional ethylenic unsaturated monomer (E), polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group (F), a photopolymerization initiator (C), and a surface adjusting agent (D).

11. The light curing molding ink set according to claim 10 , wherein a content of the water-soluble monofunctional ethylenic unsaturated monomer (E) is 20 to 50 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.

12. The light curing molding ink set according to claim 10 , wherein a content of the oxyethylene group and/or an oxypropylene group (F) is 20 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.

13. The light curing molding ink set according to claim 10 , wherein a content of the water-soluble monofunctional ethylenic unsaturated monomer (E) is 20 to 50 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material, and a content of the oxyethylene group and/or an oxypropylene group (F) is 20 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.

14. The light curing molding ink set according to claim 10 , wherein a number average molecular weight Mn of the oxyethylene group and/or an oxypropylene group (F) is 100 to 5,000.

15. A method for manufacturing a light cured article using the light curing molding ink set as defined in claim 1 by a manufacturing method for light curing molding using an ink-jet scheme, comprising:
a step (I) of discharging a resin composition for a modeling material and a resin composition for a supporting material from an ink-jet head, so that a resin composition layer in which a layer composed of the resin composition for a modeling material and a layer composed of the resin composition for a supporting material are arranged contiguously,
a step (II) of photocuring the resin composition for a modeling material and the resin composition for a supporting material constituting the resin composition layer, respectively, thereby, obtaining a modeling material and a supporting material, and
a step (III) of removing the supporting material, thereby, obtaining a light cured article.

Assignees

• Maxell Holdings Ltd
• Mimaki Eng Co Ltd

Inventors

• Kitou katsuyuki
• Izumo Taeko
• Okawa Masakatsu
• Hongo Kenta

Classifications

• C09D11/40

  Ink-sets specially adapted for multi-colour inkjet printing · CPC title

• C09D11/38

  characterised by non-macromolecular additives other than solvents, pigments or dyes · CPC title

• C09D11/322

  Pigment inks · CPC title

• C09D11/101 Primary

  Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing · CPC title

• B29C64/40

  Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title