Integrally molded body and method of producing same

US11110685B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11110685-B2
Application numberUS-201716468198-A
CountryUS
Kind codeB2
Filing dateNov 30, 2017
Priority dateDec 12, 2016
Publication dateSep 7, 2021
Grant dateSep 7, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An integrally molded body has a bonding resin (C) interposed between a board (A) and a member (B), one surface of the board being a design surface, wherein: inside the member (B), a first bonding section disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C), is provided; and at least at a part of the design surface-side surface of the integrally molded body, a region where the board (A), the member (B), and the bonding resin (C) are exposed is provided. A plurality of structures can be bonded with high bonding strength and allows for the bonding boundary thereof to have favorable smoothness, thereby making it possible to mitigate warping and reduce weight and thickness even when the molded body has a board constituent member.

First claim

Opening claim text (preview).

The invention claimed is: 1. An integrally molded body comprising: a board (A), a member (B), and an injection molded bonding resin (C) interposed between the board (A) whose one surface is a design surface and the member (B), wherein, inside the member (B), a first bonding section is disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the injection molded bonding resin (C), and at least a part of the design surface-side surface of the integrally molded body has a region where the board (A), the member (B), and the injection molded bonding resin (C) are exposed, wherein 1) the board (A) has a member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and 2) the board (A) has a sandwich structure sandwiching both surfaces of a core layer with skin layers each of which includes the member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and the core layer is selected from a thermoplastic resin, a foam, and a porous base material comprising discontinuous fibers and a thermoplastic resin, wherein a thermoplastic resin layer (D) is further provided on an outer surface of the board (A), and the board (A) and the injection molded bonding resin (C) are bonded via the thermoplastic resin layer (D). 2. The integrally molded body according to claim 1 , wherein the first bonding section is formed over an entire circumference of an outer peripheral edge section of the board (A). 3. The integrally molded body according to claim 1 , wherein the board (A) and the member (B) include a region overlapping via the injection molded bonding resin (C). 4. The integrally molded body according to claim 1 , wherein the injection molded bonding resin (C) is a thermoplastic resin. 5. The integrally molded body according to claim 1 , wherein the member (B) is a metal frame. 6. The integrally molded body according to claim 1 , wherein the member (B) is a fiber reinforced resin comprising reinforcing fibers and a resin. 7. The integrally molded body according to claim 1 , wherein the member (B) is a frame member having a standing wall shape portion in at least a part of the member (B). 8. The integrally molded body according to claim 1 , wherein a fitting portion, into which the injection molded bonding resin (C) enters, is provided in a part of the core layer composed of either the foam or the porous base material comprising discontinuous fibers and a thermoplastic resin. 9. The integrally molded body according to claim 1 , wherein a stepped portion is provided between the first bonding section and a region other than the first bonding section of the board (A) whose core layer is the porous base material, and the stepped portion has an inclined surface of 10° to 90° with respect to the in-plane direction of the board (A). 10. The integrally molded body according to claim 9 , wherein the porosity of the porous base material in the first bonding section is lower than the porosity of the porous base material in the region other than the first bonding section. 11. A method of producing the integrally molded body accordingly to claim 1 comprising at least steps [1] and [2]: [1] placing a board (A), whose one surface is a design surface, inside a member (B) having a frame shape, at a condition where at least a part of the board (A) is apart from the member (B), and [2] bonding and integrating the board (A) and the member (B) with each other at least at an outer peripheral edge section of the board (A) by injection molding a bonding resin (C) into a space between the board (A) and the member (B). 12. The method according to claim 11 , wherein at least a part of the surface of the integrally molded body on the design surface side is formed as a region where the board (A), the member (B), and the bonding resin (C) are exposed, by injection molding the bonding resin (C) into the space from an opposite side of the design surface. 13. An integrally molded body comprising: a board (A), a member (B), and an injection molded bonding resin (C) interposed between the board (A) whose one surface is a design surface and the member (B), wherein, inside the member (B), a first bonding section is disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the injection molded bonding resin (C), at least a part of the design surface-side surface of the integrally molded body has a region where the board (A), the member (B), and the injection molded bonding resin (C) are exposed, wherein 1) the board (A) has a member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and 2) the board (A) has a sandwich structure sandwiching both surfaces of a core layer with skin layers each of which includes the member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and the core layer is selected from a thermoplastic resin, a foam, and a porous base material comprising discontinuous fibers and a thermoplastic resin, the board (A) and the member (B) include a region overlapping via the injection molded bonding resin (C), and the overlapping region is formed by disposing the member (B) to overlap in parallel under the board (A) via the bonding resin (C), wherein a thermoplastic resin layer (D) is further provided on an outer surface of the board (A), and the board (A) and the injection molded bonding resin (C) are bonded via the thermoplastic resin layer (D).

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What does patent US11110685B2 cover?
An integrally molded body has a bonding resin (C) interposed between a board (A) and a member (B), one surface of the board being a design surface, wherein: inside the member (B), a first bonding section disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C), is provided;…
Who is the assignee on this patent?
Toray Industries
What technology area does this patent fall under?
Primary CPC classification B32B5/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 07 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).