Electronic device which can be adhered to skin and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11109796-B2
Application number	US-201816223541-A
Country	US
Kind code	B2
Filing date	Dec 18, 2018
Priority date	Dec 18, 2018
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

Exemplary embodiments relate to a skin-adherable electronic device including a semiconductor circuit unit including a circuit element including an electrode and an interconnect, and a semiconductor device including an insulating layer and an active layer; and a flexible patch that can adhere to skin and including a plurality of through-holes, wherein the insulating layer includes a plurality of through-holes corresponding to the plurality of through-holes of the flexible patch, and a method of manufacturing the same. When the active layer is made of a piezoelectric material, the electronic device may be used as a skin sensor that can acquire skin deformation and/or elasticity information.

First claim

What is claimed is:

1. A skin-adherable electronic device, comprising:
a semiconductor circuit unit—the semiconductor circuit unit including a circuit element including at least one of an electrode and an interconnect; and a semiconductor device including an insulating layer and an active layer; and
a flexible patch including a plurality of through-holes, wherein the flexible patch can adhere to skin,
wherein the insulating layer includes a plurality of through-holes corresponding to at least some of the plurality of through-holes of the flexible patch and the interconnect includes a plurality of through-holes corresponding to the plurality of through-holes of the insulating layer,
wherein the at least some of the plurality of through-holes of the flexible patch, the plurality of through-holes of the insulating layer and the plurality of through-holes of the interconnect include circular through-holes and dumbbell through-holes,
wherein the through-holes of the flexible patch, the through-holes of the insulating layer and the through-holes of the interconnect are aligned to form apertures, and
wherein skin surfaces are exposed to an air at the apertures when the said device adheres to a skin.

2. The skin-adherable electronic device according to claim 1 , wherein spaces between the plurality of through-holes are less than 60 μm respectively.

3. The skin-adherable electronic device according to claim 1 , wherein the plurality of through-holes of the flexible patch includes a combination of the first through-hole having a first diameter and second through-holes having second diameters respectively,
wherein the first diameter is larger than each of second diameters, and the second through-holes are disposed nearby the first through-hole.

4. The skin-adherable electronic device according to claim 1 , wherein the at least some of the plurality of through-holes of the flexible patch match the plurality of through-holes of the insulation layer.

5. The skin-adherable electronic device according to claim 1 , wherein the active layer is made of a material including AlN or GaN.

6. The skin-adherable electronic device according to claim 1 , wherein the circuit element includes a first electrode and a second electrode disposed opposite to the first electrode,
the first electrode includes at least one first bar,
the second electrode includes at least one second bar, and
the first bar has a plane of zigzag shape and extends toward the second electrode, and the second bar has a plane of zigzag shape and extends toward the first electrode.

7. The skin-adherable electronic device according to claim 6 , wherein the zigzag shape of the first bar or the second bar includes a hinge pattern disposed at a point where an extension direction of the bar changes.

8. The skin-adherable electronic device according to claim 1 , wherein the flexible patch includes a first flexible layer having a first elastic modulus and a second flexible layer having a second elastic modulus, and
the first elastic modulus is lower than the second elastic modulus.

9. The skin-adherable electronic device according to claim 8 , wherein a thickness (t 1 ) of the first flexible layer and a thickness (t 2 ) of the second flexible layer are determined based on the following equation:
W≥W c
where W c =E eq *t 3 /(24R 2 ),

W
=

4
⁢

γ
dPatch

⁢

⁢

γ
dskin

γ
dPatch

+

γ
dskin

+

4
⁢

γ
pPatch

⁢

⁢

γ
pskin

γ
pPatch

+

γ
pskin

,

⁢

E
eq

=

(

t
1

t
1

+

t
2

)

⁢

E
1

+

(

t
2

t
1

+

t
2

)

⁢

E
2

t
=

t
1

+

t
2

,

where t denotes a thickness of the flexible patch, E 1 denotes an elastic modulus of the first flexible layer, E 2 denotes an elastic modulus of the second flexible layer, R denotes a curvature of the flexible patch adhered to the skin, γ dSkin denotes a dispersive component of contact surface of the skin, γ dPatch denotes a dispersive component of contact surface of the patch, γ pSkin denotes a polar component of contact surface of the skin, and γ pPatch denotes a polar component of contact surface of the patch.

Assignees

• Amorepacific Corp
• Massachusetts Inst Technology

Inventors

• Han Jiyeon
• Yeun Han-Wool
• Kim Eunjoo
• Kim Jeehwan

Classifications

• A61B5/6833 Primary

  Adhesive patches · CPC title

• A61B5/0077

  Devices for viewing the surface of the body, e.g. camera, magnifying lens · CPC title

• A61B5/443

  Evaluating skin constituents, e.g. elastin, melanin, water · CPC title

• A61B2562/12

  Manufacturing methods specially adapted for producing sensors for in-vivo measurements · CPC title

• A61B5/442 Primary

  Evaluating skin mechanical properties, e.g. elasticity, hardness, texture, wrinkle assessment · CPC title