Terminal, and terminal-attached cable and wire harness with the terminal

US11108171B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11108171-B2
Application numberUS-202016896550-A
CountryUS
Kind codeB2
Filing dateJun 9, 2020
Priority dateJun 11, 2019
Publication dateAug 31, 2021
Grant dateAug 31, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A terminal includes a connection part electrically connectable to a mating terminal, and a crimp part capable of crimping a cable. The connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver. The crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver.

First claim

Opening claim text (preview).

What is claimed is: 1. A terminal comprising: a connection part electrically connectable to a mating terminal; and a crimp part capable of crimping a cable, wherein the connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver, the crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver, and the crimp part includes no plating layer containing silver alloy containing silver and having a Vickers hardness of 250 Hv or more. 2. The terminal according to claim 1 , wherein the silver alloy contained in the first plating layer is alloy containing silver and at least one metal selected from the group consisting of tin, copper, palladium, bismuth, indium, and antimony. 3. The terminal according to claim 1 , further comprising an underlayer that is arranged at least one between the first base and the first plating layer and between the second base and the second plating layer, has a thickness of from more than 0 μm to 3 μm or less, and contains at least one metal selected from the group consisting of nickel, copper, and silver. 4. The terminal according to claim 1 , wherein the connection part further includes a silver layer arranged on an outermost surface and formed of silver. 5. The terminal according to claim 1 , wherein a part other than the connection part or the crimp part includes no plating layer formed of at least one of a material forming the first plating layer and a material forming the second plating layer. 6. A terminal-attached cable comprising the terminal according to claim 1 . 7. A wire harness comprising the terminal-attached cable according to claim 6 . 8. A terminal comprising: a connection part electrically connectable to a mating terminal; and a crimp part capable of crimping a cable, wherein the connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver, the crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver, and the terminal further comprising an underlayer that is arranged at least one between the first base and the first plating layer and between the second base and the second plating layer, has a thickness of from more than 0 μm to 3 μm or less, and contains at least one metal selected from the group consisting of nickel, copper, and silver. 9. A terminal comprising: a connection part electrically connectable to a mating terminal; and a crimp part capable of crimping a cable, wherein the connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver, the crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver, and a part other than the connection part or the crimp part includes no plating layer formed of at least one of a material forming the first plating layer and a material forming the second plating layer.

Assignees

Inventors

Classifications

  • Agitating of electrolytes; Moving of racks · CPC title

  • for vehicles · CPC title

  • Electroplating characterised by the article coated · CPC title

  • H01R13/03Primary

    characterised by the material, e.g. plating, or coating materials · CPC title

  • Pretreatment of metallic surfaces to be electroplated · CPC title

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Frequently asked questions

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What does patent US11108171B2 cover?
A terminal includes a connection part electrically connectable to a mating terminal, and a crimp part capable of crimping a cable. The connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver. The crimp part includes a second base having electr…
Who is the assignee on this patent?
Yazaki Corp
What technology area does this patent fall under?
Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 31 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).