Terminal plating material, and terminal, terminal-equipped electric wire and wire harness using the same
US-2018212350-A1 · Jul 26, 2018 · US
US11108171B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11108171-B2 |
| Application number | US-202016896550-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 9, 2020 |
| Priority date | Jun 11, 2019 |
| Publication date | Aug 31, 2021 |
| Grant date | Aug 31, 2021 |
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A terminal includes a connection part electrically connectable to a mating terminal, and a crimp part capable of crimping a cable. The connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver. The crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver.
Opening claim text (preview).
What is claimed is: 1. A terminal comprising: a connection part electrically connectable to a mating terminal; and a crimp part capable of crimping a cable, wherein the connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver, the crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver, and the crimp part includes no plating layer containing silver alloy containing silver and having a Vickers hardness of 250 Hv or more. 2. The terminal according to claim 1 , wherein the silver alloy contained in the first plating layer is alloy containing silver and at least one metal selected from the group consisting of tin, copper, palladium, bismuth, indium, and antimony. 3. The terminal according to claim 1 , further comprising an underlayer that is arranged at least one between the first base and the first plating layer and between the second base and the second plating layer, has a thickness of from more than 0 μm to 3 μm or less, and contains at least one metal selected from the group consisting of nickel, copper, and silver. 4. The terminal according to claim 1 , wherein the connection part further includes a silver layer arranged on an outermost surface and formed of silver. 5. The terminal according to claim 1 , wherein a part other than the connection part or the crimp part includes no plating layer formed of at least one of a material forming the first plating layer and a material forming the second plating layer. 6. A terminal-attached cable comprising the terminal according to claim 1 . 7. A wire harness comprising the terminal-attached cable according to claim 6 . 8. A terminal comprising: a connection part electrically connectable to a mating terminal; and a crimp part capable of crimping a cable, wherein the connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver, the crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver, and the terminal further comprising an underlayer that is arranged at least one between the first base and the first plating layer and between the second base and the second plating layer, has a thickness of from more than 0 μm to 3 μm or less, and contains at least one metal selected from the group consisting of nickel, copper, and silver. 9. A terminal comprising: a connection part electrically connectable to a mating terminal; and a crimp part capable of crimping a cable, wherein the connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver, the crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver, and a part other than the connection part or the crimp part includes no plating layer formed of at least one of a material forming the first plating layer and a material forming the second plating layer.
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