Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module

Patent metadata

Field	Value
Publication number	US-11108152-B2
Application number	US-201916730493-A
Country	US
Kind code	B2
Filing date	Dec 30, 2019
Priority date	Jul 29, 2013
Publication date	Aug 31, 2021
Grant date	Aug 31, 2021

Abstract

An antenna-integrated wireless module comprises a substrate having a first surface and including a wireless region and an antenna region. A wireless functional section is in the wireless region and includes an RF circuit on the first surface or in the substrate. An antenna section is in the antenna region and includes an antenna conductor. A resin sealing layer covers at least a part of the first surface. A thickness of the resin sealing layer in a portion overlapping the antenna region may be thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region such that the resin sealing layer may have a step at a location between the wireless region and the antenna region; or the substrate may have a step at a boundary between the wireless region and the antenna region, and the resin sealing layer may not the cover the step.

First claim

The invention claimed is:

1. An antenna-integrated wireless module comprising:
a substrate having a first surface, the substrate including a wireless region and an antenna region;
a wireless functional section disposed in the wireless region and including an RF circuit disposed at least on the first surface of the substrate or inside the substrate;
an antenna section disposed in the antenna region and including an antenna conductor; and
a resin sealing layer disposed so as to cover at least a part of the first surface of the substrate,
wherein a thickness of the resin sealing layer in a portion overlapping the antenna region in a plan view is thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region in the plan view, such that the resin sealing layer has a step at a location between the wireless region and the antenna region.

2. The antenna-integrated wireless module according to claim 1 , wherein the wireless functional section and the antenna section are not directly connected on the first surface of the substrate.

3. The antenna-integrated wireless module according to claim 1 , further comprising a shield layer disposed on an upper surface of the resin sealing layer so as not to overlap the antenna region in the plan view.

4. The antenna-integrated wireless module according to claim 3 , wherein the shield layer is on the upper surface of the resin sealing layer only in a region overlapping the wireless region in the plan view.

5. The antenna-integrated wireless module according to claim 3 , wherein the shield layer covers at least a part of the step of the resin sealing layer.

6. The antenna-integrated wireless module according to claim 5 , further comprising a groove in the step of the resin sealing layer that extends toward the first surface of the substrate, wherein the shield layer extends over an inner surface of the groove.

7. The antenna-integrated wireless module according to claim 3 , wherein the shield layer extends over lateral surfaces of the resin sealing layer, the lateral surfaces surrounding at least a part of the wireless region or the antenna region.

8. The antenna-integrated wireless module according to claim 1 , wherein the plurality of antenna regions are disposed in the substrate in a sandwiching relation to the wireless region, and the antenna conductor is disposed in each of the antenna regions at least on the first surface of the substrate or inside the substrate.

9. The antenna-integrated wireless module according to claim 1 , wherein the wireless functional section and the antenna section are connected via a conductor inside the substrate.

10. The antenna-integrated wireless module according to claim 1 , wherein the antenna electrode includes a one-end antenna electrode connected to one end of the antenna conductor, and an opposite-end antenna electrode connected to an opposite end of the antenna conductor.

11. An antenna-integrated wireless module comprising:
a substrate having a first surface, the substrate including a wireless region and an antenna region;
a wireless functional section disposed in the wireless region and including an RF circuit disposed at least on the first surface of the substrate or inside the substrate;
an antenna section disposed in the antenna region and including an antenna conductor; and
a resin sealing layer disposed so as to cover at least a part of the first surface of the substrate,
wherein the substrate has a step at a boundary between the wireless region and the antenna region, and
wherein the resin sealing layer does not the cover the step of the substrate.

12. The antenna-integrated wireless module according to claim 11 , wherein the wireless functional section and the antenna section are not directly connected on the first surface of the substrate.

13. The antenna-integrated wireless module according to claim 11 , further comprising a shield layer disposed on an upper surface of the resin sealing layer so as not to overlap the antenna region in a plan view.

14. The antenna-integrated wireless module according to claim 13 , wherein the shield layer is on the upper surface of the resin sealing layer only in a region overlapping the wireless region in the plan view.

15. The antenna-integrated wireless module according to claim 13 , wherein the shield layer covers at least a part of the step of the substrate.

16. The antenna-integrated wireless module according to claim 13 , wherein the shield layer extends over lateral surfaces of the resin sealing layer, the lateral surfaces surrounding at least a part of the wireless region or the antenna region.

17. The antenna-integrated wireless module according to claim 11 , wherein a thickness of the resin sealing layer in a portion overlapping the antenna region in a plan view is thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region in the plan view.

18. The antenna-integrated wireless module according to claim 11 , wherein the plurality of antenna regions are disposed in the substrate in a sandwiching relation to the wireless region, and the antenna conductor is disposed in each of the antenna regions at least on the first surface of the substrate or inside the substrate.

19. The antenna-integrated wireless module according to claim 11 , wherein the wireless functional section and the antenna section are connected via a conductor inside the substrate.

20. The antenna-integrated wireless module according to claim 11 , wherein the antenna electrode includes a one-end antenna electrode connected to one end of the antenna conductor, and an opposite-end antenna electrode connected to an opposite end of the antenna conductor.

Assignees

• Murata Manufacturing Co

Inventors

• Ito Yuichi
• Hirai Taro
• Fujikawa Katsuhiko

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H01Q23/00

  Antennas with active circuits or circuit elements integrated within them or attached to them · CPC title

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

• H01Q1/526 Primary

  Electromagnetic shields · CPC title

• H01Q1/241

  used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence) · CPC title