Camera substrate assembly, camera module, and terminal device

Patent metadata

Field	Value
Publication number	US-11102384-B2
Application number	US-201716331869-A
Country	US
Kind code	B2
Filing date	Jan 13, 2017
Priority date	Dec 27, 2016
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.

First claim

What is claimed is:

1. A camera substrate assembly, comprising:
a rigid support plate;
a printed circuit board;
a flexible circuit board disposed between two plates of the printed circuit board, wherein the rigid support plate, the printed circuit board, and the flexible circuit board are laminated, wherein at least two mounting holes configured to accommodate camera chips are disposed on the printed circuit board and passing through the flexible circuit board, wherein the rigid support plate has mounting surfaces that face the at least two mounting holes, wherein a groove is formed on the rigid support plate, and wherein a bottom surface of the groove is one of the mounting surfaces of the rigid support plate and configured to support the camera chips;
a height difference between the mounting surfaces facing different mounting holes; and
a boss disposed on the rigid support plate, wherein a top surface of the boss is one of the mounting surfaces.

2. The camera substrate assembly of claim 1 , wherein the groove is coupled to one of the at least two mounting holes, and wherein a mounting surface of the rigid support plate that faces another one of the at least two mounting holes is flush with a surface of the rigid support plate facing the printed circuit board.

3. The camera substrate assembly of claim 1 , wherein the boss is inserted into one of the at least two mounting holes when only a boss structure is disposed on the rigid support plate, and wherein a mounting surface of the rigid support plate that faces another one of the at least two mounting holes is flush with a surface of the rigid support plate facing the printed circuit board.

4. The camera substrate assembly of claim 1 , wherein the boss and the rigid support plate are an integrated structure.

5. The camera substrate assembly of claim 1 , wherein the rigid support plate is a metal support plate.

6. The camera substrate assembly of claim 5 , wherein the metal support plate is a steel plate.

7. The camera substrate assembly of claim 5 , wherein the metal support plate is an alloy plate.

8. The camera substrate assembly of claim 1 , wherein the flexible circuit board is signal-connected to the printed circuit board and a connector.

9. The camera substrate assembly of claim 1 , wherein flatness of the mounting surfaces is less than a specified threshold, and wherein the specified threshold is from five to ten micrometers (μm).

10. The camera substrate assembly of claim 1 , wherein the height difference is adjusted to change in thicknesses of different camera chips.

11. The camera substrate assembly of claim 1 , wherein the height difference is adjusted to change in fields of view of different lenses.

12. A camera apparatus, comprising:
a camera substrate assembly, comprising:
a rigid support plate;
a printed circuit board;
a flexible circuit board disposed between two plates of the printed circuit board, wherein the rigid support plate, the printed circuit board, and the flexible circuit board are laminated,
wherein at least two mounting holes configured to accommodate camera chips are disposed on the printed circuit board and passing through the flexible circuit board,
wherein the rigid support plate has mounting surfaces that face the at least two mounting holes, wherein a groove is formed on the rigid support plate, wherein a bottom surface of the groove is one of the mounting surfaces of the rigid support plate and configured to support the camera chips,
wherein strength of the rigid support plate is greater than strength of the printed circuit board, and
wherein flatness of the mounting surfaces is less than a specified threshold;
a height difference between the mounting surfaces facing different mounting holes; and
a boss disposed on the rigid support plate, wherein a top surface of the boss is one of the mounting surfaces;

a camera chip disposed on a mounting surface in each mounting hole, wherein each camera chip is signal-connected to the printed circuit board;
a lens mount fixedly coupled to the printed circuit board, wherein a light filter is disposed on the lens mount;
a lens coupled to the lens mount, wherein an optical axis of the lens and an axis of the light filter are coaxial; and
a drive motor configured to drive the lens to zoom in or zoom out.

13. The camera apparatus of claim 12 , wherein each camera chip is signal-connected to the printed circuit board using a metallic wire.

14. The camera apparatus of claim 12 , wherein the groove is formed on the rigid support plate in an etching manner or a cutting manner.

15. The camera apparatus of claim 12 , wherein the light filter and the lens share an axis, and wherein the axis passes through a sensing device of the camera chip.

16. A terminal device, comprising a camera apparatus comprising:
a camera substrate assembly, comprising:
a rigid support plate;
a printed circuit board;
a flexible circuit board disposed between two plates of the printed circuit board, wherein the rigid support plate, the printed circuit board, and the flexible circuit board are laminated, wherein at least two mounting holes configured to accommodate camera chips are disposed on the printed circuit board and passing through the flexible circuit board, wherein the rigid support plate has mounting surfaces facing the at least two mounting holes, wherein a groove is formed on the rigid support plate, and wherein a bottom surface of the groove is one of the mounting surfaces of the rigid support plate and configured to support the camera chips;
a height difference between the mounting surfaces facing different mounting holes; and
a boss disposed on the rigid support plate, wherein a top surface of the boss is one of the mounting surfaces;

a camera chip disposed on a mounting surface in each mounting hole, wherein each camera chip is signal-connected to the printed circuit board;
a lens mount fixedly coupled to the printed circuit board, wherein a light filter is disposed on the lens mount;
a lens coupled to the lens mount, wherein an optical axis of the lens and an axis of the light filter are coaxial; and
a drive motor configured to drive the lens to zoom in or zoom out.

17. The terminal device of claim 16 , wherein the rigid support plate is a metal support plate.

18. The terminal device of claim 17 , wherein the metal support plate comprises a steel plate, an alloy plate, an aluminum plate, or an iron plate.

19. The terminal device of claim 16 , wherein the groove is formed on the rigid support plate in an etching manner or a cutting manner.

20. The terminal device of claim 16 , wherein the strength of the rigid support plate is greater than strength of the printed circuit board.

Assignees

• Huawei Tech Co Ltd

Inventors

• Wang Guanghai
• Li Cunying
• Luo Zhendong
• Tian Qingshan
• Wang Jianwen
• Li Sheng

Classifications

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/00

  Cameras or camera modules comprising electronic image sensors; Control thereof · CPC title

• H05K3/301

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title