Binding region connection structure, touch screen and display device

Patent metadata

Field	Value
Publication number	US-11099682-B2
Application number	US-201816303636-A
Country	US
Kind code	B2
Filing date	Mar 29, 2018
Priority date	Jun 9, 2017
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

The present disclosure provides a bonding region connection structure, a touch screen, and a display device. The bonding region connection structure for connecting a touch substrate and a flexible printed circuit includes: a plurality of electrode trace pins disposed at the bonding region, wherein the bonding region is between the touch substrate and the flexible printed circuit, each of the plurality of the electrode trace pins being respectively configured to connect to a touch electrode on the touch substrate and an electrode on the flexible printed circuit; and a plurality of dummy pins respectively disposed on both sides of the electrode trace pins, one end of each of the plurality of dummy pins leading to the touch electrode being respectively connected to a corresponding first test point by a lead wire, and configured to measure impedance of the bonding region.

First claim

What is claimed is:

1. A bonding region connection structure for connecting a touch substrate and a flexible printed circuit, comprising:
a plurality of electrode trace pins disposed at a bonding region, wherein the bonding region is between the touch substrate and the flexible printed circuit, each of the plurality of the electrode trace pins being respectively configured to connect to a touch electrode on the touch substrate and an electrode on the flexible printed circuit; and
a plurality of dummy pins respectively disposed on both sides of the electrode trace pins, one end of each of the plurality of dummy pins leading to the touch electrode being respectively connected to a corresponding first test point by a lead wire, and configured to measure impedance of the bonding region.

2. The bonding region connection structure according to claim 1 , wherein the plurality of electrode trace pins is distributed in a single row array and disposed at an intermediate portion of the bonding region, and the plurality of dummy pins respectively are disposed on both sides of the intermediate portion of the bonding region.

3. The bonding region connection structure according to claim 2 , wherein the plurality of electrode trace pins has same length, and a length of the dummy pin is gradually shortened in a direction away from the intermediate portion of the bonding region.

4. The bonding region connection structure according to claim 3 , wherein at least two of the dummy pins are respectively disposed on both sides of the intermediate portion of the bonding region.

5. The bonding region connection structure according to claim 4 , wherein three dummy pins are respectively disposed on both sides of the intermediate area of the bonding region.

6. The bonding region connection structure according to claim 5 , wherein a ratio of lengths of the electrode trace pins to lengths of the corresponding dummy pins in the direction away from the intermediate portion of the bonding region is 1:1:0.75:0.5.

7. The bonding region connection structure according to claim 6 , wherein a ratio of effective conduction areas of dummy pins corresponding to the first test points is 2:3:4, and the effective conduction areas of dummy pins are gradually shortened in the direction away from the intermediate portion of the bonding region.

8. The bonding region connection structure of claim 1 , wherein one end of each of the plurality of dummy pins leading to the electrode is connected to a corresponding second test point by a connecting finger, and the second test point and the first test point corresponding to the same dummy pin form a test channel.

9. The bonding region connection structure according to claim 8 , wherein the first test point, the second test point and the lead wire are made from material of the same layer.

10. The bonding region connection structure according to claim 9 , wherein the first test point is integrally formed with the lead wire and the dummy pin.

11. A touch screen comprising:
a touch substrate;
a flexible printed circuit; and
a bonding region connection structure for connecting a touch substrate and a flexible printed circuit, comprising:
a plurality of electrode trace pins disposed at the bonding region, wherein the bonding region is between the touch substrate and the flexible printed circuit, each of the plurality of the electrode trace pins being respectively configured to connect to a touch electrode on the touch substrate and an electrode on the flexible printed circuit, and
a plurality of dummy pins respectively disposed on both sides of the electrode trace pins, one end of each of the plurality of dummy pins leading to the touch electrode being respectively connected to a corresponding first test point by a lead wire, and configured to measure impedance of the bonding region.

12. A display device comprising a touch screen which comprises:
a touch substrate,
a flexible printed circuit; and
a bonding region connection structure for connecting a touch substrate and a flexible printed circuit, comprising:
a plurality of electrode trace pins disposed at the bonding region, wherein the bonding region is between the touch substrate and the flexible printed circuit, each of the plurality of the electrode trace pins being respectively configured to connect to a touch electrode on the touch substrate and an electrode on the flexible printed circuit; and
a plurality of dummy pins respectively disposed on both sides of the electrode trace pins, one end of each of the plurality of dummy pins leading to the touch electrode being respectively connected to a corresponding first test point by a lead wire, and configured to measure impedance of the bonding region.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Wang Qingpu
• Zhang Lei
• Kuo Tsungchieh
• Zhang Zhi
• He Xiaoyue

Classifications

• G06F3/04164 Primary

  Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

• G06F3/047

  using sets of wires, e.g. crossed wires · CPC title

• G06F2203/04102

  Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper · CPC title

• G06F3/0412

  Digitisers structurally integrated in a display · CPC title

• G06F3/0446

  using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes · CPC title