Conductive structure, method of manufacturing the same, touch sensor including the conductive structure, method of manufacturing the touch sensor, and touch sensing method

US11099669B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11099669-B2
Application numberUS-201816214976-A
CountryUS
Kind codeB2
Filing dateDec 10, 2018
Priority dateJun 10, 2016
Publication dateAug 24, 2021
Grant dateAug 24, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A conductive structure is provided. The conductive structure includes a template including a skeleton and a pore therein and having flexibility, and a conductive material aggregated and formed on the skeleton and in the pore.

First claim

Opening claim text (preview).

What is claimed is: 1. A touch sensor comprising: a conductive structure comprising: a flexible template having a plurality of skeletons in a depth direction and pores formed between the individual skeletons therein; and a conductive material aggregated and formed on the plurality of skeletons and in the pores, the conductive structure configured to be deformed by touch of an object; a first substrate; a first electrode provided between the first substrate and the conductive structure; a second substrate provided on a surface of the conductive structure opposite to the first substrate; and a second electrode provided between the second substrate and the conductive structure, wherein the conductive material is formed of a number of graphene flakes, wherein a conductive path is generated inside the conductive structure through the graphene flakes that are brought in contact with each other by the touch of the object, and wherein the template is formed of sponge. 2. The touch sensor of claim 1 , wherein when the object is touched through the first substrate, a conductivity of the conductive structure increases. 3. The touch sensor of claim 2 , wherein the conductivity of the conductive structure is sensed through the first electrode. 4. A touch sensing method comprising: touching an object to the touch sensor comprising the conductive structure of claim 3 to deform the conductive structure; and sensing a change in conductivity according to the deformation of the conductive structure to sense touch or a surface roughness of the object. 5. The touch sensor of claim 2 , wherein when the touch of the object is removed, the deformation of the conductive structure is restored by flexibility of the conductive structure. 6. A touch sensing method comprising: touching an object to the touch sensor comprising the conductive structure of claim 5 to deform the conductive structure; and sensing a change in conductivity according to the deformation of the conductive structure to sense touch or a surface roughness of the object. 7. A touch sensing method comprising: touching an object to the touch sensor comprising the conductive structure of claim 2 to deform the conductive structure; and sensing a change in conductivity according to the deformation of the conductive structure to sense touch or a surface roughness of the object. 8. The touch sensor of claim 1 , wherein the conductive structure is deformed by the touch of the object in such a way that a thickness of the conductive structure is reduced. 9. A touch sensing method comprising: touching an object to the touch sensor comprising the conductive structure of claim 8 to deform the conductive structure; and sensing a change in conductivity according to the deformation of the conductive structure to sense touch or a surface roughness of the object. 10. The touch sensor of claim 1 , further comprising: a sensing substrate on a surface of the first substrate, to which the object is touched, wherein the sensing substrate includes a sensing pattern. 11. A touch sensing method comprising: touching an object to the touch sensor comprising the conductive structure of claim 10 to deform the conductive structure; and sensing a change in conductivity according to the deformation of the conductive structure to sense touch or a surface roughness of the object. 12. A touch sensing method comprising: touching an object to the touch sensor comprising the conductive structure of claim 1 to deform the conductive structure; and sensing a change in conductivity according to the deformation of the conductive structure to sense touch or a surface roughness of the object. 13. A method of manufacturing a touch sensor, the method comprising: immersing a template, which has flexibility and comprises a plurality of skeletons in a depth direction and pores formed between the individual skeletons therein, in a conductive material dispersion solution to aggregate a conductive material on the plurality of skeletons and in the pores, thereby forming a conductive structure; and forming a first electrode, which is configured to sense deformation of the conductive structure by touch of an object, on a top surface of the conductive structure, and forming a second electrode on a bottom surface of the conductive structure, wherein the conductive material is formed of a number of graphene flakes, wherein a conductive path is generated inside the conductive structure through the graphene flakes that are brought in contact with each other by the touch of the object, and wherein the template is formed of sponge. 14. The method of claim 13 , further comprising: forming a sensing pattern for sensing a surface roughness of the object on the top surface of the conductive structure.

Assignees

Inventors

Classifications

  • Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper · CPC title

  • G06F3/041Primary

    Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

  • Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

  • G01L1/146Primary

    for measuring force distributions, e.g. using force arrays (G01L1/148 takes precedence) · CPC title

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Frequently asked questions

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What does patent US11099669B2 cover?
A conductive structure is provided. The conductive structure includes a template including a skeleton and a pore therein and having flexibility, and a conductive material aggregated and formed on the skeleton and in the pore.
Who is the assignee on this patent?
Iucf Hyu
What technology area does this patent fall under?
Primary CPC classification G06F3/041. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 24 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).