Multilayer wiring base plate and probe card using the same

Patent metadata

Field	Value
Publication number	US-11099227-B2
Application number	US-201716097757-A
Country	US
Kind code	B2
Filing date	Apr 6, 2017
Priority date	May 6, 2016
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

Included are an insulating plate 41 including a plurality of insulating synthetic resin layers, wiring circuits 44a, 44b, and 44c provided in the insulating plate 41, a thin-film resistor 46 formed to be buried in the insulating plate 41 and electrically connected to the wiring circuits 44a, 44b, and 44c, a heat dissipating portion 47 provided over one surface of the insulating plate to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate 41, a pedestal portion 48 formed to be buried in the insulating plate 41 and provided to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion 47 and having higher heat conductivity than that of the insulating plate 41, and a heat dissipation and pedestal connecting portion 49 connecting the heat dissipating portion 47 to the pedestal portion 48 and having higher heat conductivity than that of the insulating plate 41.

First claim

The invention claimed is:

1. A multilayer wiring base plate provided on a wiring path between a tester and a probe, comprising:
an insulating plate including a plurality of insulating synthetic resin layers;
a wiring circuit provided in the insulating plate;
at least one thin-film resistor formed to be buried in the insulating plate and electrically connected to the wiring circuit;
a heat dissipating portion provided over one surface of the insulating plate to be opposed to the thin-film resistor via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate;
a pedestal portion formed to be buried in the insulating plate and provided to be opposed to the thin-film resistor via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion and having higher heat conductivity than that of the insulating plate;
at least one heat dissipation and pedestal connecting portion connecting the heat dissipating portion to the pedestal portion on a lateral side of the thin-film resistor, provided to be buried in the insulating plate, and having higher heat conductivity than that of the insulating plate;
paired connecting electrodes connected to both ends of the thin-film resistor and provided to at least partially project from the insulating plate; and
insulating protecting layers provided to cover at least parts of the paired connecting electrodes projecting from the insulating plate,
wherein the heat dissipating portion is provided to cover the insulating protecting layers and a surface of the insulating plate located between the insulating protecting layers without contacting the paired connecting electrodes.

2. The multilayer wiring base plate according to claim 1 , wherein the heat dissipation and pedestal connecting portion is provided along a longitudinal direction of the thin-film resistor.

3. The multilayer wiring base plate according to claim 2 , wherein the plurality of heat dissipation and pedestal connecting portions are provided on both lateral sides of the thin-film resistor with the thin-film resistor interposed therebetween.

4. The multilayer wiring base plate according to claim 3 , wherein the plurality of heat dissipation and pedestal connecting portions provided at least on one lateral side of the thin-film resistor are connected.

5. The multilayer wiring base plate according to claim 1 , wherein the plurality of thin-film resistors are provided,
wherein the heat dissipating portion is provided to be opposed to the plurality of thin-film resistors, and
wherein the heat dissipating portion and the pedestal portion are connected by the plurality of heat dissipation and pedestal connecting portions.

6. A probe card comprising the multilayer wiring base plate according to claim 1 .

7. A multilayer wiring base plate provided on a wiring path between a tester and a probe, comprising:
an insulating plate including a plurality of insulating synthetic resin layers;
a wiring circuit provided in the insulating plate;
at least one thin-film resistor formed to be buried in the insulating plate and electrically connected to the wiring circuit;
a heat dissipating portion provided over one surface of the insulating plate to be opposed to the thin-film resistor via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate;
a pedestal portion formed to be buried in the insulating plate and provided to be opposed to the thin-film resistor via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion and having higher heat conductivity than that of the insulating plate;
at least one heat dissipation and pedestal connecting portion connecting the heat dissipating portion to the pedestal portion on a lateral side of the thin-film resistor, provided to be buried in the insulating plate, and having higher heat conductivity than that of the insulating plate;
paired connecting electrodes connected to both ends of the thin-film resistor and provided to at least partially project from the insulating plate; and
an insulating protecting layer provided to cover at least a part of each of the paired connecting electrodes projecting from the insulating plate and a surface of the insulating plate located between the paired connecting electrodes,
wherein the heat dissipating portion is provided to cover the insulating protecting layer without contacting the paired connecting electrodes.

8. The multilayer wiring base plate according to claim 7 , wherein the heat dissipation and pedestal connecting portion is provided along a longitudinal direction of the thin-film resistor.

9. The multilayer wiring base plate according to claim 8 , wherein the plurality of heat dissipation and pedestal connecting portions are provided on both lateral sides of the thin-film resistor with the thin-film resistor interposed therebetween.

10. The multilayer wiring base plate according to claim 9 , wherein the plurality of heat dissipation and pedestal connecting portions provided at least on one lateral side of the thin-film resistor are connected.

11. The multilayer wiring base plate according to claim 7 , wherein the plurality of thin-film resistors are provided,
wherein the heat dissipating portion is provided to be opposed to the plurality of thin-film resistors, and
wherein the heat dissipating portion and the pedestal portion are connected by the plurality of heat dissipation and pedestal connecting portions.

12. A probe card comprising the multilayer wiring base plate according to claim 7 .

Assignees

• Nihon Micronics Kk

Inventors

• Otabe Noboru
• Fukami Yoshiyuki

Classifications

• G01R1/20

  Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments · CPC title

• G01R1/07307 Primary

  with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card · CPC title

• G01R31/2818 Primary

  using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors (G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266) · CPC title

• H05K2201/0317

  Thin film conductor layer; Thin film passive component · CPC title

• H05K1/167

  incorporating printed resistors · CPC title