Pump cooling systems

US11098718B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11098718-B2
Application numberUS-201716483145-A
CountryUS
Kind codeB2
Filing dateDec 21, 2017
Priority dateFeb 3, 2017
Publication dateAug 24, 2021
Grant dateAug 24, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pump cooling system may include a cooling body configured to be fitted to a pump housing to receive heat from the pump housing via a heat conducting path between the cooling body and pump housing. The cooling body may have a passage through which, in use, a cooling fluid is passed to conduct heat away from the cooling body. The pump cooling system includes a cooling control mechanism configured to provide a gap in the heat conducting path at pump operating temperatures below a predefined temperature so heat conduction from the pump housing to the cooling body is interrupted.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pump cooling system comprising: a cooling body configured to be fitted to a pump housing to receive heat from the pump housing via a heat conducting path between the cooling body and the pump housing, the cooling body having a passage through which, in use, a cooling fluid is passed to conduct heat away from the cooling body; and a cooling control mechanism configured to provide a gap in the heat conducting path at pump operating temperatures below a predefined temperature whereby heat conduction from the pump housing to the cooling body is interruptible. 2. The pump cooling system as claimed in claim 1 , wherein the cooling control mechanism includes a space that, in use, is disposed between the cooling body and the pump housing, the space sized to accommodate a heat conducting body that, in use, is movable relative to at least one of the cooling body and the pump housing to open and close the gap. 3. The pump cooling system as claimed in claim 2 , wherein: the cooling control mechanism further comprises a securing member to secure the cooling body to the pump housing; the heat conducting body is configured to be fixed in the space between the cooling body and the pump housing so as to permit the relative movement by thermal expansion and contraction; the heat conducting body and the securing member have respective coefficients of thermal expansion; and the coefficient of thermal expansion of the heat conducting body is greater than the coefficient of thermal expansion of the securing member so that, in use, when the operating temperature is above the predefined temperature the gap in the heat conducting path is closed by expansion of the heat conducting body to permit conduction of heat from the pump housing to said cooling body via the heat conducting path. 4. A The pump cooling system as claimed in claim 3 , wherein the cooling control mechanism further comprises at least one resilient biasing member arranged to provide a biasing force to maintain the gap at operating temperatures below the predefined temperature. 5. The pump cooling system as claimed in claim 3 , wherein the securing member comprises a first transverse surface configured to engage the cooling body and a second transverse surface configured to engage the pump housing, a distance defined between the first and second transverse surfaces defines a distance between the pump housing and the cooling body, and the heat conducting body has a thickness at temperatures below the predefined temperature that is less than the distance so as to provide the gap. 6. The pump cooling system as claimed in claim 2 , wherein the heat conducting body comprises a body of liquid and further comprising an actuator to cause the liquid to move relative to the cooling body and the pump housing. 7. The pump cooling system as claimed in claim 6 , wherein the liquid is a magnetic liquid and the actuator comprises at least one magnet. 8. The pump cooling system as claimed in claim 7 , wherein the at least one magnet comprises an electromagnet. 9. The pump cooling system as claimed in claim 1 , wherein the cooling control mechanism comprises at least one powered actuator operable to move the cooling body relative to the pump housing. 10. The pump cooling system as claimed in claim 9 , wherein the at least one powered actuator comprises at least one of: i) at least one fluid actuated cylinder connected with the cooling body; or ii) at least one electromagnet. 11. The pump cooling system as claimed in claim 9 , wherein the at least one powered actuator is operable to move the cooling body in a first direction, the pump cooling system further comprising at least one resilient biasing element to bias the cooling body in a second direction that is opposite to the first direction. 12. The pump cooling system as claimed in claim 1 , wherein the cooling control mechanism comprises a pressure chamber to contain a pressurised gas whereby, in use, selective pressurisation of the pressure chamber controls opening and closing of the gap. 13. The pump cooling system as claimed in claim 12 , wherein the pressure chamber is configured to be disposed between the cooling body and the pump housing and at least one conduit extends to the pressure chamber via which the pressure chamber can be i) evacuated to cause one of the gap to close and the gap to open and ii) pressurised to cause the other of the gap to close and the gap to open. 14. The pump cooling system as claimed in claim 12 , further comprising valving operable, in use, to connect the pressure chamber with at least one of a pressurised gas source and a vacuum source to selectively pressurise the pressure chamber. 15. The pump cooling system as claimed in claim 12 , further comprising at least one biasing member to bias the cooling body in a direction to open the gap. 16. The pump cooling system as claimed in claim 6 , further comprising a controller and at least one temperature sensor, the controller being configured to provide signals that cause operation of the cooling control mechanism to open and close the gap in response to a determination based on signals provided by the at least one temperature sensor. 17. A pump comprising: a pump housing and a pumping mechanism disposed in the pump housing; and a pump cooling system comprising a cooling body and a cooling control mechanism, wherein the cooling body is configured to receive heat from the pump housing via a heat conducting path and is provided with a passage through which, in use, a cooling fluid is passed to conduct heat away from the cooling body, and the cooling control mechanism is configured to provide a gap in the heat conducting path between the pump housing and the cooling body at pump operating temperatures below a predefined temperature, whereby heat conduction from the pump housing to the cooling body is interruptible. 18. The pump as claimed in claim 17 , wherein the pump is a vacuum pump. 19. A method of providing cooling for a pump comprising: providing a cooling body to receive heat from the pump by heat conduction, the cooling body having a passage through which cooling fluid is passed to convey heat away from the cooling body; providing a cooling control mechanism configured to provide a gap in a heat conducting path between the pump and the cooling body when pump operating temperatures are below a predefined temperature whereby heat conduction between the pump and the cooling body is controllably interruptible. 20. The method as claimed in claim 19 , wherein providing the cooling control mechanism comprises providing a pressure chamber to contain a pressurised gas whereby, in use, selective pressurisation of said pressure chamber controls opening and closing of the gap.

Assignees

Inventors

Classifications

  • Movable elements, e.g. being pivotable · CPC title

  • with helical teeth, e.g. chevron-shaped, screw type {(for non-parallel axes of movement F04C18/48)} · CPC title

  • Temperature · CPC title

  • heat insulation or conduction · CPC title

  • using rigid bodies, e.g. mounted on a movable carrier · CPC title

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What does patent US11098718B2 cover?
A pump cooling system may include a cooling body configured to be fitted to a pump housing to receive heat from the pump housing via a heat conducting path between the cooling body and pump housing. The cooling body may have a passage through which, in use, a cooling fluid is passed to conduct heat away from the cooling body. The pump cooling system includes a cooling control mechanism configur…
Who is the assignee on this patent?
Edwards Ltd
What technology area does this patent fall under?
Primary CPC classification F04B39/064. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 24 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).