Fluoride fluorescent material and method for producing the same
US-9670403-B2 · Jun 6, 2017 · US
US11098246B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11098246-B2 |
| Application number | US-201916294651-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2019 |
| Priority date | Mar 15, 2013 |
| Publication date | Aug 24, 2021 |
| Grant date | Aug 24, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A lighting apparatus includes a semiconductor light source in direct contact with a polymer composite comprising a color stable Mn4+ doped phosphor, wherein the lighting apparatus has a color shift of ≤1.5 MacAdam ellipses after operating for at least 2,000 hour at a LED current density greater than 2 A/cm2, a LED wall-plug efficiency greater than 40%, and a board temperature greater than 25° C.
Opening claim text (preview).
The invention claimed is: 1. A lighting apparatus comprising a semiconductor light source in direct contact with a polymer composite comprising a color stable Mn 4+ doped phosphor, wherein the lighting apparatus has a color shift of ≤1.5 MacAdam ellipses after operating for at least 2,000 hours at a LED current density greater than 2 A/cm 2 , a LED wall-plug efficiency greater than 40%, and a board temperature greater than 25° C. wherein the color stable Mn 4+ doped phosphor is annealed K 2 SiF 6 :Mn 4+ . 2. A lighting apparatus according to claim 1 , wherein the MacAdam ellipse color shift is ≤1.
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
Encapsulations, e.g. protective coatings · CPC title
Wavelength conversion materials · CPC title
Silicon-containing compounds · CPC title
Silicates · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.