Shielding film and shielded printed wiring board
US-2018134920-A1 · May 17, 2018 · US
Conductive adhesive
US11098227B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11098227-B2 |
| Application number | US-201816484913-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 2, 2018 |
| Priority date | Aug 7, 2017 |
| Publication date | Aug 24, 2021 |
| Grant date | Aug 24, 2021 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
First claim
Opening claim text (preview).
The invention claimed is: 1. A conductive adhesive comprising: a thermosetting resin (A); a conductive filler (B); and a loss modulus modifier (C), wherein the conductive adhesive has a loss modulus at 200° C. from 5.0×10 4 Pa to 4.0×10 5 Pa and a storage modulus curve from 40° C. to 120° C. that does not show a distinct maximum value greater than a storage modulus at 40° C.; the thermosetting resin (A) contains a first resin component (A 1 ) having a first functional group and a second resin component (A 2 ) having a second functional group that reacts with the first functional group; and the second resin component (A 2 ) is a urethane-modified polyester resin. 2. The conductive adhesive of claim 1 , wherein the conductive adhesive contains from 40 to 140 parts by mass of the loss modulus modifier (C) relative to 100 parts by mass of the thermosetting resin (A). 3. The conductive adhesive of claim 1 , wherein the second resin component (A 2 ) has a glass transition temperature from 5° C. to 100° C. and a number average molecular weight from 10,000 to 50,000.
Assignees
Inventors
Classifications
Carboxyl groups · CPC title
Conductive additives · CPC title
the adhesive layer and/or the carrier being conductive · CPC title
- C09J9/02Primary
Electrically-conducting adhesives · CPC title
Adhesives based on unspecified macromolecular compounds · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11098227B2 cover?
- The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
- Who is the assignee on this patent?
- Tatsuta Electric Wire & Cable Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C09J9/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 24 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).