Adhesive composition

US11098225B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11098225-B2
Application numberUS-201716319115-A
CountryUS
Kind codeB2
Filing dateJul 19, 2017
Priority dateJul 19, 2016
Publication dateAug 24, 2021
Grant dateAug 24, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1) represented by general formula (B), excluding an ingredient (1-3) wherein Z represents a (meth)acryloyl group, and R 3 represents a hydrogen atom, a halogen atom, an alkyl group with 1 to 12 carbon atoms, or an alkoxy group with 1 to 12 carbon atoms; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); (wherein Z and Z′ each represent a (meth)acryloyl group, and Z and Z′ are the same or different; R1 and R1′ each represent an alkylene group, and R1 and R1′ are the same or different; R2 and R2′ each represent hydrogen or an alkyl group with 1 to 4 carbon atoms, and R2 and R2′ are the same or different; and p and p″ each represent an integer from 0 to 8, and p and p′ are the same or different); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt. 2. The adhesive composition according to claim 1 , wherein the acidic phosphate compound (2) is an acidic phosphate compound represented by general formula (C): (wherein R 4 represents a CH 2 ═CR 5 CO(0R 6 ) m— group (where R 5 represents hydrogen or a methyl group, R 6 represents —C 2 H 4 —, —C 3 H 6 —, —CH 2 CH(CH 3 )—, —C 4 H 8 —, —C 6 H 12 —, or and m represents an integer from 1 to 10), and n represents an integer of 1 or 2). 3. The adhesive composition according to claim 1 , wherein the polymerization initiator (3) is a thermal radical polymerization initiator. 4. The adhesive composition according to claim 1 , wherein the reducing agent (4) is vanadyl acetylacetonate. 5. The adhesive composition according to claim 1 , further comprising an elastomer (5). 6. The adhesive composition according to claim 1 , wherein the polyamide is at least one selected from the group consisting of nylon 6 and nylon 6,6. 7. The adhesive composition according to claim 1 , wherein the polyamide comprises a filling material. 8. The adhesive composition according to claim 7 , wherein the filling material is an inorganic fiber. 9. A two-part adhesive composition, wherein the adhesive composition according to claim 1 is separated into: a first part comprising at least the polymerization initiator (3); and a second part comprising at least the reducing agent (4). 10. A laminate having adherends at least one of which is a polyamide sheet or plate and an adhesive layer formed of the adhesive composition according to claim 1 between the adherends.

Assignees

Inventors

Classifications

  • C09J4/00Primary

    Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • Adhesives based on unspecified macromolecular compounds · CPC title

  • comprising polyamides · CPC title

  • using fillers, pigments, thixotroping agents · CPC title

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What does patent US11098225B2 cover?
Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)ac…
Who is the assignee on this patent?
Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification C09J4/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 24 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).