Liquid ejection device, cleaning apparatus and cleaning method for module substrate

Patent metadata

Field	Value
Publication number	US-11097545-B2
Application number	US-201916524300-A
Country	US
Kind code	B2
Filing date	Jul 29, 2019
Priority date	Aug 9, 2018
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

A liquid ejection device, a cleaning apparatus and a cleaning method for a module substrate, which can remove foreign matter on an ejection opening face and in a flow path connected with an ejection opening is provided. For that purpose, an ejection opening face is covered with liquid, cleaning is performed by driving a device configured to vibrate liquid, and after that the liquid is collected.

First claim

What is claimed is:

1. A liquid ejection device, comprising:
a storage container storing liquid;
an ejection device configured to eject the liquid stored in the storage container from an ejection opening provided on an ejection opening face;
a liquid holding device configured to hold liquid between itself and the ejection opening face;
a liquid collecting device configured to collect the liquid held by the liquid holding device; and
a vibrating device configured to vibrate the liquid held by the liquid holding device, the vibrating device being located inside the ejection device,
wherein the ejection device has a supply opening that is provided on a surface facing the ejection opening face and is in communication with the ejection opening, and
wherein the vibrating device causes liquid flow from the supply opening to the ejection opening and causes liquid flow from the ejection opening to the supply opening.

2. The liquid ejection device according to claim 1 , wherein the vibrating device vibrates liquid by ejection energy that is used when the ejection device ejects liquid.

3. The liquid ejection device according to claim 1 , wherein the vibrating device is a device configured to generate ultrasonic waves and ultrasonic waves generated by the vibrating device vibrate the liquid held by the liquid holding device.

4. The liquid ejection device according to claim 1 , wherein a mechanism for ejecting liquid from the ejection device is driven along with a flow of liquid from the supply opening to the ejection opening and a flow of liquid from the ejection opening to the supply opening by the vibrating device.

5. The liquid ejection device according to claim 1 , wherein the liquid holding device is also as the liquid collecting device and has plural comb teeth disposed at a predetermined spacing, liquid being collected between the comb teeth.

6. The liquid ejection device according to claim 1 , further comprising a liquid supplying device configured to supply liquid between the ejection opening face and the liquid holding device, wherein a liquid column is formed between the ejection opening face and the liquid holding device by supplying liquid from the liquid supplying device.

7. The liquid ejection device according to claim 6 , wherein the liquid supplying device a second device configured to supply liquid in connection with the ejection device or with the liquid holding device.

8. The liquid ejection device according to claim 7 , wherein the ejection device is for ejecting a first liquid, the second device configured to supply liquid is for supplying a second liquid, and the second liquid is liquid that decreases viscosity of the first liquid by contacting with the first liquid.

9. The liquid ejection device according to claim 7 , wherein the ejection device is for ejecting a first liquid, the liquid supplying device is for supplying a second liquid, and the first liquid and the second liquid are liquids of the same kind.

10. The liquid ejection device according to claim 1 , wherein the liquid collecting device is for collecting liquid by negative pressure generated by a device configured to generate negative pressure connected with the liquid holding device.

11. The liquid ejection device according to claim 1 , wherein the liquid is an imprint material.

12. The liquid ejection device according to claim 1 , wherein the ejection opening face is not in contact with the liquid holding device.

13. A cleaning apparatus for cleaning a module substrate, the substrate being for ejecting liquid from an ejection opening, the apparatus comprising:
a liquid holding device configured to hold liquid between itself and an ejection opening face of the module substrate, the ejection opening being formed on the ejection opening face;
a liquid supply device configured to supply liquid between the ejection opening face and the liquid holding device;
a vibrating device configured to vibrate the liquid held by the liquid holding device, the vibrating device being located inside the module substrate; and
a liquid collecting device configured to collect the liquid held by the liquid holding device,
wherein the module substrate has a supply opening in communication with the ejection opening, the supply opening being in a surface facing the ejection opening face, and
wherein the vibrating device causes liquid flow from the supply opening to the ejection and causes liquid flow from the ejection opening to the supply opening.

14. The cleaning apparatus according to claim 13 , wherein a mechanism for ejecting liquid of the module substrate is to be driven along with a flow of liquid from the supply opening to the ejection opening and a flow of liquid from the ejection opening to the supply opening by the vibrating device.

15. A cleaning method for a module substrate for ejecting liquid from an ejection opening, comprising:
an arrangement process arranging an ejection opening face of the module substrate, to which the ejection opening has been formed, and a holding portion of a holding member capable of holding liquid between itself and the ejection opening face, so as to face each other at a predetermined space;
a holding process supplying and holding liquid between the ejection opening face and the holding portion;
a vibrating process vibrating the liquid held in the holding process using a vibrating device, the vibrating device being located inside the module substrate;
a collecting process collecting the liquid supplied between the ejection opening face and the holding portion;
a first cleaning process making liquid flow from a supply opening, which is equipped for a surface facing the ejection opening face of the module substrate and is in communication with the ejection opening, to the ejection opening; and
a second cleaning process making liquid flow from the ejection opening to the supply opening.

16. The cleaning method according to claim 15 , wherein a mechanism for ejecting liquid of the module substrate is driven in at least one of cleaning processes of the first cleaning process and the second cleaning process.

Assignees

• Canon Kk

Inventors

• Iimura Akiko
• Namba Hisashi
• Hasegawa Noriyasu
• Kuri Masahiro

Classifications

• B41J2/16508 Primary

  connected with the printer frame · CPC title

• B41J2/16523

  Waste ink transport from caps or spittoons, e.g. by suction (Collecting or collectors of waste ink B41J2/1721) · CPC title

• B41J2/16517 Primary

  Cleaning of print head nozzles (B41J2/16505, B41J2/1707 take precedence) · CPC title

• B41J2/16526

  by applying pressure only · CPC title

• B41J2002/16567

  using ultrasonic or vibrating means · CPC title