Resin composition for semiconductor package, prepreg, and metal clad laminate using the same

Patent metadata

Field	Value
Publication number	US-11091630-B2
Application number	US-201816333082-A
Country	US
Kind code	B2
Filing date	Mar 8, 2018
Priority date	Mar 22, 2017
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

First claim

The invention claimed is:

1. A resin composition comprising:
an amine curing agent containing one or more functional groups selected from the group consisting of a sulfone group, a carbonyl group, a halogen group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a heteroaryl group having 2 to 30 carbon atoms, and an alkylene group having 1 to 20 carbon atoms;
a thermosetting resin; and
an inorganic filler comprising a first microparticle inorganic filler, and a second nanoparticle inorganic filler;
wherein the thermosetting resin is present in an amount of 400 parts by weight or less based on 100 parts by weight of the amine curing agent,
the alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, the heteroaryl group having 2 to 30 carbon atoms, and the alkylene group having 1 to 20 carbon atoms contained in the amine curing agent are each independently substituted with one or more functional groups selected from the group consisting of a nitro group, a cyano group, and a halogen group,
wherein the resin composition has an equivalent ratio, calculated by the following Mathematical Equation 1, of 1.4 or more:
Equivalent ratio=Total active hydrogen equivalent weight contained in the amine curing agent/Total curable functional group equivalent weight contained in the thermosetting resin  [Mathematical Equation 1],and

wherein the resin composition has a minimum viscosity at 140° C. or higher, and a minimum viscosity of 100 Pa·s to 500 Pa·s.

2. The resin composition of claim 1 , wherein
the amine curing agent includes one or more compounds selected from the group consisting of the following Chemical Formulas 1 to 3:

wherein, in Chemical Formula 1,
A is a sulfone group, a carbonyl group, or an alkylene group having 1 to 10 carbon atoms,
X 1 to X 8 are each independently a nitro group, a cyano group, a hydrogen atom, a halogen group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a heteroaryl group having 2 to 20 carbon atoms,
R 1 , R 1 ′, R 2 , and R 2 ′ are each independently a hydrogen atom, a halogen group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a heteroaryl group having 2 to 20 carbon atoms,
n is an integer of 1 to 10, and
the alkylene group having 1 to 10 carbon atoms, the alkyl group having 1 to 6 carbon atoms, the aryl group having 6 to 15 carbon atoms, and the heteroaryl group having 2 to 20 carbon atoms are each independently substituted with one or more functional groups selected from the group consisting of a nitro group, a cyano group, and a halogen group;

wherein, in Chemical Formula 2,
Y 1 to Y 8 are each independently a nitro group, a cyano group, a hydrogen atom, a halogen group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a heteroaryl group having 2 to 20 carbon atoms,
R 3 , R 3 ′, R 4 , and R 4 ′ are each independently a hydrogen atom, a halogen group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a heteroaryl group having 2 to 20 carbon atoms,
m is an integer of 1 to 10, and
the alkyl group having 1 to 6 carbon atoms, the aryl group having 6 to 15 carbon atoms, and the heteroaryl group having 2 to 20 carbon atoms are each independently substituted with one or more functional groups selected from the group consisting of a nitro group, a cyano group, and a halogen group;

wherein, in Chemical Formula 3,
Z 1 to Z 4 are each independently a nitro group, a cyano group, a hydrogen atom, a halogen group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a heteroaryl group having 2 to 20 carbon atoms,
R 5 , R 5 ′, R 6 , and R 6 ′ are each independently a hydrogen atom, a halogen group, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a heteroaryl group having 2 to 20 carbon atoms, and
the alkyl group having 1 to 6 carbon atoms, the aryl group having 6 to 15 carbon atoms, and the heteroaryl group having 2 to 20 carbon atoms are each independently substituted with one or more functional groups selected from the group consisting of a nitro group, a cyano group, and a halogen group.

3. The resin composition of claim 1 , wherein
the inorganic filler is contained in an amount of 200 parts by weight or more based on 100 parts by weight of the amine curing agent and the thermosetting resin.

4. The resin composition of claim 1 , wherein
the inorganic filler is present in an amount of 200 parts by weight to 500 parts by weight, based on 100 parts by weight of the amine curing agent and the thermosetting resin.

5. The resin composition of claim 1 , wherein
the second inorganic filler is present in an amount of 1 part by weight to 50 parts by weight, based on 100 parts by weight of the first inorganic filler.

6. The resin composition of claim 1 , wherein
the surface of the first inorganic filler or the second inorganic filler, is treated with a silane compound.

7. The resin composition of claim 6 , wherein
the silane compound includes one or more silane coupling agents selected from the group consisting of an aminosilane coupling agent, an epoxy silane coupling agent, a vinyl silane coupling agent, a cationic silane coupling agent, and a phenylsilane coupling agent.

8. The resin composition of claim 1 , wherein
the thermosetting resin includes one or more resins selected from the group consisting of an epoxy resin, a bismaleimide resin, a cyanate ester resin, and a bismaleimide-triazine resin.

9. The resin composition of claim 1 , wherein
the inorganic filler is dispersed in the resin composition.

10. The resin composition of claim 1 , wherein
the resin composition for has tensile elongation of 2.0% or more, as measured by IPC-TM-650 (2.4.18.3).

11. A prepreg obtained by impregnating a fiber substrate with the resin composition according to claim 1 .

12. A metal clad laminate comprising the prepreg according to claim 11 , and a metal foil integrated with the prepreg by heating and pressurizing.

13. The resin composition of claim 1 , wherein the thermosetting resin comprises an epoxy resin and a bismaleimide resin.

14. The resin composition of claim 1 , wherein the equivalent ratio is 1.45 to 1.8.

Assignees

• Lg Chemical Ltd

Inventors

• Shim Chang Bo
• Shim Hee Yong
• Min Hyun Sung
• Kim Young Chan
• Song Seung Hyun

Classifications

• H10W70/69

  Insulating materials thereof · CPC title

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/244

  using glass fibres · CPC title

• B32B5/02

  characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} · CPC title

• B32B37/10

  characterised by the pressing technique, e.g. using action of vacuum or fluid pressure · CPC title