Curved plate machining apparatus, and method of manufacturing curved plate with machined outer circumference

US11090767B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11090767-B2
Application numberUS-201916414320-A
CountryUS
Kind codeB2
Filing dateMay 16, 2019
Priority dateNov 18, 2016
Publication dateAug 17, 2021
Grant dateAug 17, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A machining apparatus for a curved plate includes a holder that holds a main surface of a curved plate having curved surfaces on both main surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame that retains the machining device; a driver that moves the movable frame to move a machining point of the curved plate held by the holder; a controller that controls the driver; and a guide that guides the movable frame along the outer circumference of the curved plate held by the holder.

First claim

Opening claim text (preview).

What is claimed is: 1. A machining apparatus for a curved plate, comprising: a holder that holds a main surface of a curved plate having curved surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame retaining the machining device with respect to the outer circumference of the curved plate held by the holder; a driver that moves the movable frame such that the machining device retained by the movable frame moves a machining point of the curved plate held by the holder; a controller comprising circuitry configured to control the driver such that the driver moves the movable frame along the outer circumference of the curved plate held by the holder; and a guide that guides the movable frame along the outer circumference of the curved plate held by the holder such that the guide restricts a rotational motion of the movable frame pressed against the guide with respect to a moving direction of the movable frame. 2. The machining apparatus for a curved plate according to claim 1 , wherein the guide restricts the rotational motion of the movable frame pressed against the guide with respect to a Y-direction and allows a rotational motion of the movable frame with respect to an X-direction and a rotational motion of the movable frame with respect to a Z-direction, where the Y-direction is the moving direction of the movable frame, the Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and the X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 3. The machining apparatus for a curved plate according to claim 1 , wherein the guide includes a plurality of guide surfaces configured to be brought into contact with the movable frame in a cross section perpendicular to a Y-direction, where the Y-direction is the moving direction of the movable frame, a Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and an X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 4. The machining apparatus for a curved plate according to claim 1 , further comprising: an elastic deformer positioned between the movable frame and the driver such that the elastic deformer is elastically deformed by the driver and presses the movable frame against the guide by a restoration force from an elastic deformation of the elastic deformer. 5. The machining apparatus for a curved plate according to claim 4 , further comprising: a deformation restrictor that restricts a deformation of the elastic deformer in the moving direction of the movable frame. 6. The machining apparatus for a curved plate according to claim 4 , further comprising: a deformation restrictor that restricts a torsion of the elastic deformer with respect to an X-direction, where a Y-direction is the moving direction of the movable frame, a Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and the X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 7. The machining apparatus for a curved plate according to claim 4 , further comprising: a deformation restrictor that restricts a torsion of the elastic deformer with respect to a Z-direction the Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point. 8. The machining apparatus for a curved plate according to claim 4 , wherein the elastic deformer includes an X-direction elastic deformer that elastically deforms by a translation of the movable frame with respect to the driver in an X-direction, where a Y-direction is the moving direction of the movable frame, a Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and the X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 9. The machining apparatus for a curved plate according to claim 4 , wherein the elastic deformer includes a Z-direction elastic deformer that elastically deforms by a translation of the movable frame with respect to the driver in the Z-direction, where a Y-direction is the moving direction of the movable frame, the Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and an X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 10. The machining apparatus for a curved plate according to claim 4 , wherein the elastic deformer includes a θ direction elastic deformer that elastically deforms by the rotational motion of the movable frame with respect to the driver around a rotational axis parallel to a Y-direction, where the Y-direction is the moving direction of the movable frame, a Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and an X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 11. The machining apparatus for a curved plate according to claim 1 , further comprising: an X-direction position changer that moves an X-direction position of the machining device with respect to the movable frame, where a Y-direction is the moving direction of the movable frame, a Z-direction is a plate thickness direction of the curved plate held by the holder at the machining point, and the X-direction is a direction orthogonal to the Y-direction and to the Z-direction. 12. The machining apparatus for a curved plate according to claim 1 , wherein the machining device includes a grinding device that grinds an outer periphery of the curved plate held by the holder. 13. The machining apparatus for a curved plate according to claim 12 , wherein the grinding device is a rotating grinding wheel that grinds the outer periphery of the curved plate held by the holder. 14. The machining apparatus for a curved plate according to claim 1 , wherein the machining device cuts the curved plate held by the holder. 15. The machining apparatus for a curved plate according to claim 14 , wherein the machining device includes a cutting device that is pressed against the main surface of the curved plate held by the holder. 16. The machining apparatus for a curved plate according to claim 14 , wherein the machining device includes a light source that irradiates the main surface of the curved plate held by the holder with laser light. 17. The machining apparatus for a curved plate according to claim 1 , wherein the machining device, the movable frame, the driver, and the controller are provided in a plurality of sets such that one machining device machines a part of the outer circumference of the curved plate held by the holder, and another machining device machines another part of the outer circumference of the curved plate held by the holder. 18. The machining apparatus for a curved plate according to claim 17 , wherein the plurality of machining devices machines the outer circumference of the curved plate held by the holder over an entire periphery. 19. The machining apparatus for a curved plate according to claim 1 , wherein the driver and the controller are an industrial robot. 20. A method of manufacturing a curved plate with a machined outer circumference, comprising: machining the outer circumference of the curved plate by the machining apparatus of claim 1 . 21. A machining apparatus for a curved plate, comprising: a holder that holds a main surface of a curved plate having curved surfac

Assignees

Inventors

Classifications

  • involving mechanical transmission means only · CPC title

  • mechanically only · CPC title

  • Scoring tool holders; Driving mechanisms therefor · CPC title

  • Other grinding machines or devices · CPC title

  • by thermal shock · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11090767B2 cover?
A machining apparatus for a curved plate includes a holder that holds a main surface of a curved plate having curved surfaces on both main surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame that retains the machining device; a driver that moves the movable frame to move a machining point of the curved plate held by the holde…
Who is the assignee on this patent?
Agc Inc
What technology area does this patent fall under?
Primary CPC classification B23K26/364. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 17 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).