Antimicrobial shape memory polymers

US11090408B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11090408-B2
Application numberUS-201716466073-A
CountryUS
Kind codeB2
Filing dateDec 6, 2017
Priority dateDec 6, 2016
Publication dateAug 17, 2021
Grant dateAug 17, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.

First claim

Opening claim text (preview).

What is claimed is: 1. A system comprising: a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent; wherein the at least one antimicrobial agent includes a phenolic acid, and the SMP foam has a dry glass transition temperature (T g ) above 40 degrees C. and a wet T g below 34 degrees C.; wherein the SMP foam includes a reaction product of hexamethylene diisocyanate (HDI) with one or more of trimethanolamine (TEA), N,N,N′,N′ tetrakis (hydroxyl propylene) ethylenediamine (HPED), or combinations thereof; wherein the phenolic acid is a pendant group chemically bonded, via an ester, to a polyurethane polymer chain of the SMP foam; and wherein the phenolic acid includes one or more of benzoic acid, gentisic acid, 4-hydroxy benzoic acid, p-coumaric acid, vanillic acid, syringic acid, protocatechuic acid, gallic acid, ferulic acid, sinapic acid, caffeic acid, or combinations thereof. 2. The system of claim 1 wherein the SMP foam is physically cross-linked around the at least one antimicrobial agent. 3. The system of claim 1 comprising: a thermoset polyurethane second SMP foam that includes a phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the second SMP foam; and a thermoset polyurethane third SMP foam that includes a phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the third SMP foam; wherein (a) the SMP foam comprises a first foam, and (b) the first, second, and third SMP foams are all enclosed in a sealed kit. 4. The system of claim 1 , wherein the wet T g is below 30 degrees C.

Assignees

Inventors

Classifications

  • Use of materials characterised by their function or physical properties (liquid bandages A61L26/00) · CPC title

  • Porous materials, e.g. foams or sponges · CPC title

  • with other specific functional groups, e.g. aldehydes, ketones, phenols, quaternary phosphonium groups · CPC title

  • Deodorants or malodour counteractants, e.g. to inhibit the formation of ammonia or bacteria · CPC title

  • Biologically active materials, e.g. therapeutic substances {(A61L31/047 takes precedence)} · CPC title

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Frequently asked questions

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What does patent US11090408B2 cover?
An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
Who is the assignee on this patent?
Texas A & M Univ Sys
What technology area does this patent fall under?
Primary CPC classification A61L31/06. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 17 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).