Printed wiring board and method for manufacturing printed wiring board

Patent metadata

Field	Value
Publication number	US-11089679-B2
Application number	US-202016909339-A
Country	US
Kind code	B2
Filing date	Jun 23, 2020
Priority date	Mar 2, 2017
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.

First claim

The invention claimed is:

1. A printed wiring board comprising:
a main substrate having a top surface, a bottom surface, a slit penetrating from the top surface to the bottom surface, and a plurality of first electrodes provided on the bottom surface; and
a rising substrate having a support portion and a plurality of second electrodes provided in the support portion and connected to the plurality of first electrodes, respectively, using solder,
the support portion of the rising substrate being inserted into the slit in the main substrate,
in a direction in which the plurality of first electrodes are aligned, a width of each of the plurality of first electrodes being larger than a width of each of the plurality of second electrodes, the width of each of the plurality of second electrodes being arranged to fit within the width of each of the plurality of first electrodes,
each of the plurality of second electrodes of the rising substrate being inserted into the slit in the main substrate,
the solder being arranged between the rising substrate and an inner peripheral surface of the slit in the main substrate wherein, with the support portion of the rising substrate being inserted into the slit in the main substrate, the plurality of first electrodes and the plurality of second electrodes are connected using solder, and the solder is formed on the bottom surface of the main substrate.

2. The printed wiring board according to claim 1 , wherein the support portion is arranged to be spaced from an entirety of the inner peripheral surface of the slit.

3. The printed wiring board according to claim 1 , wherein at least one of a symbol ink and a solder resist is arranged between the plurality of second electrodes.

4. The printed wiring board according to claim 1 , wherein
a first relief-processed portion is provided at each of four corners of the slit along the top surface of the main substrate, and
the first relief-processed portion has an arc shape spreading toward an outside of the slit along the top surface.

5. The printed wiring board according to claim 1 , wherein
the rising substrate includes a body portion connected to the support portion and protruding on one side and another side of the support portion,
second relief-processed portions are provided at a connection portion between the support portion and the body portion on the one side and the other side of the support portion,
the second relief-processed portion on the one side has an arc shape spreading toward the other side, and
the second relief-processed portion on the other side has an arc shape spreading toward the one side.

6. The printed wiring board according to claim 1 , wherein
a pitch P between the plurality of first electrodes and between the plurality of second electrodes,
one larger width Mw and another smaller width Sw of each of the plurality of first electrodes and each of the plurality of second electrodes, and
a value D obtained by subtracting a length of the support portion from a length of the slit in a direction in which the slit extends
have a relation P/2>(Mw−Sw)/2≥D.

7. The printed wiring board according to claim 1 , wherein, with the support portion of the rising substrate being inserted into the slit in the main substrate, the plurality of second electrodes extend to a height of the top surface of the main substrate.

8. The printed wiring board according to claim 1 , wherein two slits and two support portions are provided.

9. The printed wiring board according to claim 1 , wherein
the main substrate has a first auxiliary slit penetrating from the top surface to the bottom surface, and two first auxiliary female electrodes provided on the bottom surface,
the first auxiliary slit is arranged to be linearly aligned with the slit in a longitudinal direction of the slit,
the two first auxiliary female electrodes are arranged with the first auxiliary slit being sandwiched therebetween in a short direction of the first auxiliary slit,
the rising substrate has a first auxiliary support portion and two first auxiliary male electrodes provided in the first auxiliary support portion,
the first auxiliary support portion is inserted into the first auxiliary slit, and
the two first auxiliary male electrodes are soldered to the two first auxiliary female electrodes, respectively.

10. The printed wiring board according to claim 9 , wherein dimensions of the support portion and the slit in the longitudinal direction of the slit are respectively larger than dimensions of the first auxiliary support portion and the first auxiliary slit in the longitudinal direction of the slit.

11. The printed wiring board according to claim 9 , wherein a surface area of the first auxiliary female electrode is larger than a surface area of each of the plurality of first electrodes, and a surface area of the first auxiliary male electrode is larger than a surface area of each of the plurality of second electrodes.

12. The printed wiring board according to claim 1 , wherein a height of upper ends of the plurality of second electrodes of the rising substrate is equal to or higher than the top surface of the main substrate.

Assignees

• Mitsubishi Electric Corp

Inventors

• Sasaki Shunsuke
• Sato Kohei
• Morimoto Yusuke

Classifications

• H05K3/366 Primary

  substantially perpendicularly to each other (H05K3/361 takes precedence) · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K2201/0305

  Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns · CPC title

• H05K3/403

  Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence) · CPC title

• H05K2201/09645

  Patterning on via walls; Plural lands around one hole · CPC title