Wall for isolation enhancement

Patent metadata

Field	Value
Publication number	US-11089673-B2
Application number	US-201916517043-A
Country	US
Kind code	B2
Filing date	Jul 19, 2019
Priority date	Jul 19, 2019
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

First claim

What is claimed is:

1. A circuit assembly, comprising:
a multi-layer printed circuit board (PCB) having, in one or more layers thereof, a circuit/antenna/radiator element region and defining, in the one or more layers thereof, a trench surrounding an entirety of the circuit/antenna/radiator element region;
a circuit/antenna/radiator element disposed within the circuit/antenna/radiator element region of the multi-layer PCB; and
a Faraday wall comprising a solid, unitary body having a same shape as the trench and being disposed within the trench traversing the one or more layers to surround an entirety of the circuit/antenna/radiator element.

2. The circuit assembly according to claim 1 , wherein the Faraday wall comprises a conductive material.

3. The circuit assembly according to claim 1 , wherein the Faraday wall has a polygonal shape within respective planes of the one or more layers of the multi-layer PCB.

4. The circuit assembly according to claim 3 , wherein the Faraday wall comprises one or more of corners with complex geometrical shapes, chamfered corners and sides comprising inwardly protruding features.

5. The circuit assembly according to claim 1 , wherein the Faraday wall is one or more of soldered and press-fit into a secured position within the trench.

6. The circuit assembly according to claim 1 , wherein:
the multi-layer PCB defines, in the one or more layers thereof, the trench as multiple trenches surrounding an entirety of the circuit/antenna/radiator element region, and
the Faraday wall is provided as multiple Faraday walls respectively disposed within corresponding ones of the multiple trenches.

Assignees

• Raytheon Co

Inventors

• Southworth Andrew
• Wilder Kevin
• Benedict James
• Herndon Mary K
• Sikina Thomas V
• Haven John P

Classifications

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H01Q1/40 Primary

  Radiating elements coated with or embedded in protective material · CPC title

• H05K2203/0228

  Cutting, sawing, milling or shearing · CPC title

• H05K2201/2018

  Presence of a frame in a printed circuit or printed circuit assembly · CPC title