Metal ceramic composite for electromagnetic signal transparent materials
US-2016373838-A1 · Dec 22, 2016 · US
US11089389B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11089389-B2 |
| Application number | US-201916572046-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 16, 2019 |
| Priority date | Feb 28, 2014 |
| Publication date | Aug 10, 2021 |
| Grant date | Aug 10, 2021 |
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A system includes a network of a plurality of sensing/control/identification devices distributed throughout a machine, each of the sensing/control/identification devices associated with at least one sub-system component of the machine and operable to communicate through a plurality of electromagnetic signals. Shielding surrounds at least one of the sensing/control/identification devices to contain the electromagnetic signals proximate to the at least one sub-system component. A communication path is integrally formed in a component of the machine to route a portion of the electromagnetic signals through the component and a remote processing unit operable to communicate with the network of the sensing/control/identification devices through the electromagnetic signals, wherein at least a portion of the sensing/control/identification devices comprise a wide band gap semiconductor device and wherein at least a portion of the sensing/control/identification devices comprise an on-chip antenna.
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What is claimed is: 1. A system of a machine, the system comprising: a network of a plurality of sensing/control/identification devices distributed throughout the machine, each of the sensing/control/identification devices associated with at least one sub-system component of the machine and operable to communicate through a plurality of electromagnetic signals; shielding surrounding at least one of the sensing/control/identification devices to contain the electromagnetic signals proximate to the at least one sub-system component; a communication path integrally formed in a component of the machine to route a portion of the electromagnetic signals through the component; and a remote processing unit operable to communicate with the network of the sensing/control/identification devices through the electromagnetic signals, wherein at least a portion of the sensing/control/identification devices comprise a wide band gap semiconductor device and wherein at least a portion of the sensing/control/identification devices comprise an on-chip antenna. 2. The system as recited in claim 1 , wherein the wide band gap semiconductor device comprises silicon on insulator (SOI), silicon carbide (SiC), gallium nitride (GaN), boron nitride, aluminum nitride, or a combination comprising at least one of the foregoing. 3. The system as recited in claim 1 , wherein the wide band gap semiconductor device operates at a temperature greater than 200 degrees C. 4. The system as recited in claim 1 , wherein the wide band gap semiconductor device comprises an integrated device having bipolar junction transistors, field effect transistors, or a combination comprising at least one of the foregoing. 5. The system as recited in claim 1 , wherein the wide band gap semiconductor device comprises a bipolar structure, MOSFET, JFET, light emitting diode, oscillator, diode or a combination comprising at least one of the foregoing. 6. The system as recited in claim 1 , wherein the wide band gap semiconductor device is part of an integrated circuit. 7. The system as recited in claim 1 , wherein the wide band gap semiconductor device comprises silicon carbide (SiC), gallium nitride (GaN) or a combination thereof. 8. A system for a gas turbine engine, the system comprising: a network of a plurality of sensing/control/identification devices distributed throughout the gas turbine engine, each of the sensing/control/identification devices associated with at least one sub-system component of the gas turbine engine and operable to communicate through a plurality of electromagnetic signals; shielding surrounding at least one of the sensing/control/identification devices to contain the electromagnetic signals proximate to the at least one sub-system component; a communication path integrally formed in a component of the gas turbine engine to route a portion of the electromagnetic signals through the component; and a remote processing unit operable to communicate with the network of the sensing/control/identification devices through the electromagnetic signals, wherein at least a portion of the sensing/control/identification devices comprise a wide band gap semiconductor device and wherein at least a portion of the sensing/control/identification devices comprise an on-chip antenna. 9. The system as recited in claim 8 , wherein the wide band gap semiconductor device comprises silicon on insulator (SOI), silicon carbide (SiC) or gallium nitride (GaN), boron nitride, aluminum nitride, or a combination comprising at least one of the foregoing. 10. The system as recited in claim 8 , wherein the wide band gap semiconductor device operates at a temperature greater than 200 degrees C. 11. The system as recited in claim 8 , wherein the wide band gap semiconductor device comprises an integrated device having bipolar junction transistors, field effect transistors, or a combination comprising at least one of the foregoing. 12. The system as recited in claim 8 , wherein the wide band gap semiconductor device comprises a bipolar structure, MOSFET, JFET, light emitting diode, oscillator, diode or a combination comprising at least one of the foregoing. 13. The system as recited in claim 8 , wherein the wide band gap semiconductor device is part of an integrated circuit. 14. The system as recited in claim 8 , wherein the wide band gap semiconductor device comprises silicon carbide (SiC), gallium nitride (GaN) or a combination thereof. 15. A method of electromagnetic communication through a machine, the method comprising: transmitting communication signals between a remote processing unit and a network of a plurality of control/sensing/identification devices in the machine using a plurality of electromagnetic signals wherein the plurality of electromagnetic signals provide power to the control/sensing/identification devices and further wherein the at least a portion of the control/sensing/identification devices comprise a wide band gap semiconductor device and wherein at least a portion of the sensing/control/identification devices comprise an on-chip antenna. 16. The method as recited in claim 15 , wherein the wide band gap semiconductor device comprises silicon on insulator (SOI), silicon carbide (SiC), gallium nitride (GaN), boron nitride, aluminum nitride, or a combination comprising at least one of the foregoing. 17. The method as recited in claim 15 , wherein the wide band gap semiconductor device operates at a temperature greater than 200 degrees C. 18. The method as recited in claim 15 , wherein the wide band gap semiconductor device comprises an integrated device having bipolar junction transistors, field effect transistors, or a combination comprising at least one of the foregoing. 19. The method as recited in claim 15 , wherein the wide band gap semiconductor device is part of an integrated circuit. 20. The method as recited in claim 19 , wherein the wide band gap semiconductor device comprises silicon carbide (SiC), gallium nitride (GaN) or a combination thereof.
Devices generating input signals, e.g. transducers, sensors, cameras or strain gauges · CPC title
Controlling gas-turbine plants; Controlling fuel supply in air- breathing jet-propulsion plants (controlling air intakes F02C7/057; controlling turbines F01D; controlling compressors F04D27/00; controlling in general G05) · CPC title
Dielectric loaded (not air) · CPC title
Reducing interference from ignition apparatus of fuel engines (cables with high resistance H01B) · CPC title
having a turbine driving a compressor (power transmission arrangements F02C7/36; control of working fluid flow F02C9/16) · CPC title
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