Laser diode device

Patent metadata

Field	Value
Publication number	US-11088513-B2
Application number	US-201916680639-A
Country	US
Kind code	B2
Filing date	Nov 12, 2019
Priority date	Nov 14, 2018
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A laser diode device includes a thermally conductive substrate that has a planar surface for dissipating ambient heat, and a plurality of laser diodes situated thereon, each of which includes at least one epitaxial layer that is situated on a side of the laser diode facing the substrate. The laser diodes are each electrically activated via an electrically conductive coating situated between the at least one epitaxial layer and the substrate. The substrate includes a plurality of metallized cavities that accommodate the plurality of laser diodes so that the plurality of laser diodes have an essentially uniform height above the substrate.

First claim

What is claimed is:

1. A laser diode device comprising:
a thermally conductive first substrate that includes a planar surface by which ambient heat can be dissipated; and
a plurality of laser diodes situated on the first substrate;
wherein:
each of the plurality of laser diodes includes at least one epitaxial layer;
an electrically conductive coating that is situated between the at least one epitaxial layer and the first substrate is configured to electrically activate the respective laser diode; and
the first substrate includes a plurality of metallized areas at which the plurality of laser diodes are accommodated such that the plurality of laser diodes have an essentially uniform height above the first substrate; and

wherein:
(I) for each respective one of the plurality laser diodes, a respective base surface of the respective laser diode that is supported on the first substrate extends parallel to a direction in which the planar surface extends;
(II) the plurality of laser diodes are fastened to a second substrate via their respective sides facing away from the first substrate; and/or
(III) the laser diode device further comprises, for each of at least one pair of immediately adjacent ones of the plurality of laser diodes:
(i) a respective electrically conductive compensation structure situated on the first substrate between the laser diodes of the respective pair;
(ii) a respective electrically conductive compensation structure that (a) is situated on the first substrate between the laser diodes of the respective pair, and (b) has a same height as the laser diodes of the respective pair; and/or
(iii) a respective capacitor situated on the first substrate between the laser diodes of the respective pair.

2. The laser diode device of claim 1 , wherein the laser diode device comprises, for the each of the at least one pair of immediately adjacent ones of the plurality of laser diodes, the respective electrically conductive compensation structure situated on the first substrate between the laser diodes of the respective pair.

3. The laser diode device of claim 2 , further comprising solder or a conductive adhesive by which the electrically conductive compensation structure is fastened on the first substrate.

4. The laser diode device of claim 2 , wherein the plurality of laser diodes and the electrically conductive compensation structure are fastened to the second substrate via their respective sides facing away from the first substrate.

5. The laser diode device of claim 4 , wherein a thermally conductive bonding layer by which the plurality of laser diodes and the electrically conductive compensation structure are fastened to the second substrate compensates for height differences between the plurality of laser diodes and the electrically conductive compensation structure.

6. The laser diode device of claim 2 , wherein the metallized areas each includes a respective cavity that is metallized and in which a respective one of the laser diodes is arranged.

7. The laser diode device of claim 1 , wherein the laser diode device comprises, for the each of the at least one pair of immediately adjacent ones of the plurality of laser diodes, the respective electrically conductive compensation structure that (a) is situated on the first substrate between the laser diodes of the respective pair, and (b) has the same height as the laser diodes of the respective pair.

8. The laser diode device of claim 7 , wherein the metallized areas each includes a respective cavity that is metallized and in which a respective one of the laser diodes is arranged.

9. The laser diode device of claim 1 , wherein the laser diode device comprises, for the each of the at least one pair of immediately adjacent ones of the plurality of laser diodes, the respective capacitor situated on the first substrate between the laser diodes of the respective pair.

10. The laser diode device of claim 9 , wherein the plurality of laser diodes and the capacitor are fastened to the second substrate via their respective sides facing away from the first substrate.

11. The laser diode device of claim 10 , wherein a thermally conductive bonding layer by which the plurality of laser diodes and the capacitor are fastened to the second substrate compensates for height differences between the plurality of laser diodes and the capacitor.

12. The laser diode device of claim 9 , wherein, for the each of the at least one pair of immediately adjacent ones of the plurality of laser diodes, the respective capacitor has the same height as the laser diodes of the respective pair.

13. The laser diode device of claim 9 , wherein the metallized areas each includes a respective cavity that is metallized and in which a respective one of the laser diodes is arranged.

14. The laser diode device of claim 1 , wherein the plurality of laser diodes are fastened to the second substrate via their respective sides facing away from the first substrate.

15. The laser diode device of claim 14 , wherein a thermally conductive bonding layer by which the plurality of laser diodes are fastened to the second substrate compensates for height differences between the plurality of laser diodes.

16. The laser diode device of claim 14 , wherein the metallized areas each includes a respective cavity that is metallized and in which a respective one of the laser diodes is arranged.

17. The laser diode device of claim 1 , for the each respective one of the plurality laser diodes, the respective base surface of the respective laser diode that is supported on the first substrate extends parallel to the direction in which the planar surface extends.

18. The laser diode device of claim 17 , wherein the metallized areas each includes a respective cavity that is metallized and in which a respective one of the laser diodes is arranged.

Assignees

• Bosch Gmbh Robert

Inventors

• Amberger Maximilian
• Brinks Gerald
• Zoller Tobias

Classifications

• H01S5/042

  Electrical excitation {; Circuits therefor (monolithically integrated laser drive components H01S5/0261)} · CPC title

• H01S5/0236

  using an adhesive · CPC title

• H01S5/4025 Primary

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/0216

  using an intermediate compound, e.g. a glue or solder · CPC title

• H01S5/02325

  Mechanically integrated components on mount members or optical micro-benches · CPC title