Metallic material and connection terminal
US-2020235510-A1 · Jul 23, 2020 · US
Metallic material and connection terminal
US11088482B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11088482-B2 |
| Application number | US-201916695868-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 26, 2019 |
| Priority date | Jan 18, 2019 |
| Publication date | Aug 10, 2021 |
| Grant date | Aug 10, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.
First claim
Opening claim text (preview).
What is claimed is: 1. A metallic material comprising: a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains both Ag and In, wherein In is present less than the Ag in atomic ratio, and wherein the surface layer includes an Ag portion containing Ag as a main constituent and optionally In, and a high-concentration In portion containing a higher-concentration of In than in the Ag portion, and the Ag portion and the high-concentration In portion are both exposed on the outermost surface. 2. The metallic material according to claim 1 , wherein at least part of the In contained in the surface layer is an Ag—In alloy. 3. The metallic material according to claim 1 , wherein the Ag portion is made of soft silver. 4. The metallic material according to claim 1 , wherein (In/Ag) is 0.05 or more. 5. The metallic material according to claim 1 , wherein (In/Ag) is 0.25 or less. 6. The metallic material according to claim 1 , wherein a total amount of the In contained in the surface layer detected by an X-ray diffraction method is an Ag—In alloy. 7. The metallic material according to claim 1 , wherein the base material is made of Cu or a Cu alloy, and includes, between the base material and the surface layer, an intermediate layer containing at least one kind selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. 8. A connection terminal being made of the metallic material according to claim 1 , wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.
Assignees
Inventors
Classifications
Alloys based on copper · CPC title
- B32B15/018Primary
one layer being formed of a noble metal or a noble metal alloy · CPC title
on hard metal substrates · CPC title
Alloys based on silver · CPC title
Co-, Fe-, or Ni-base components, alternative to each other · CPC title
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- What does patent US11088482B2 cover?
- A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion elec…
- Who is the assignee on this patent?
- Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification B32B15/018. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).