Conductive wire structure and manufacturing method thereof, array substrate and display device

Patent metadata

Field	Value
Publication number	US-11088180-B2
Application number	US-201916512664-A
Country	US
Kind code	B2
Filing date	Jul 16, 2019
Priority date	Nov 14, 2018
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

The present disclosure provides a conductive wire structure, a manufacturing method thereof, an array substrate and a display device. The conductive wire structure includes a first conductive wire and a second conductive wire on a first plane, wherein a connection end of the first conductive wire is spaced apart from a connection end of the second conductive wire by a gap so as to discharge charges accumulated on the first conductive wire and the second conductive wire through the gap; an electrical connector connected to the connection end of the first conductive wire and the connection end of the second conductive wire, respectively, wherein a part of the electrical connector is located on a second plane different from the first plane.

First claim

What is claimed is:

1. An array substrate, comprising:
a first conductive wire, a second conductive wire, a third conductive wire, a first gate, a second gate and a third gate on a first plane, wherein a first connection end of the first conductive wire is electrically connected with the first gate, a first connection end of the second conductive wire is electrically connected with the second gate, the third conductive wire is electrically connected with the third gate, the third conductive wire is not electrically connected with the first conductive wire and the second conductive wire, a second connection end of the first conductive wire is spaced apart from a second connection end of the second conductive wire by a gap, the first conductive wire and the second conductive wire to discharge accumulated charges through the gap, a width of the gap is smaller than a distance between the third conductive wire and the first gate or a distance between the third conductive wire and the second gate; and
an electrical connector connected to the second connection end of the first conductive wire and the second connection end of the second conductive wire, respectively, wherein a part of the electrical connector is located on a second plane different from the first plane.

2. The array substrate according to claim 1 , wherein
a projection of an end face of the first conductive wire on a plane where an end face of the second conductive wire is located at least partially covers the end face of the second conductive wire.

3. The array substrate according to claim 1 , wherein
a width of the gap is 5 to 10 μm.

4. The array substrate according to claim 1 , wherein
line widths of the first conductive wire and the second conductive wire are 5 to 10 μm.

5. The array substrate according to claim 1 , wherein the electrical connector comprises:
a first connection portion, electrically connected with the second connection end of the first conductive wire;
a second connection portion, electrically connected with the second connection end of the second conductive wire; and
a third connection portion, electrically connected to the first connection portion and the second connection portion, respectively.

6. The array substrate according to claim 5 , wherein
the third connection portion is located on the second plane.

7. The array substrate according to claim 1 , wherein the gap is located in a display area.

8. A display device comprising the array substrate according to claim 1 .

9. A manufacturing method of a conductive wire structure, comprising:
forming a first conductive wire, a second conductive wire, a third conductive wire, a first gate, a second gate and a third gate on a first plane, wherein a first connection end of the first conductive wire is electrically connected with the first gate, a first connection end of the second conductive wire is electrically connected with the second gate, the third conductive wire is electrically connected with the third gate, the third conductive wire is not electrically connected with the first conductive wire and the second conductive wire, a second connection end of the first conductive wire is spaced apart from a second connection end of the second conductive wire by a gap, the first conductive wire and the second conductive wire to discharge accumulated charges through the gap, a width of the gap is smaller than a distance between the third conductive wire and the first gate or a distance between the third conductive wire and the second gate; and
forming an electrical connector connected to the second connection end of the first conductive wire and the second connection end of the second conductive wire, respectively, wherein a part of the electrical connector is located on a second plane different from the first plane.

10. The manufacturing method according to claim 9 , wherein
a projection of an end face of the first conductive wire on a plane where an end face of the second conductive wire is located at least partially covers the end face of the second conductive wire.

11. The manufacturing method according to claim 10 , wherein
a width of the gap is 5 to 10 μm.

12. The manufacturing method according to claim 10 , wherein
line widths of the first conductive wire and the second conductive wire are 5 to 10 μm.

Assignees

• Hefei Boe Optoelectronics Tech
• Boe Technology Group Co Ltd

Inventors

• Liu Tianzhen
• Duan Xianxue
• Xu Dezhi

Classifications

• H10D89/931

  characterised by the dispositions of the protective arrangements · CPC title

• H10D89/601

  for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs · CPC title

• H10D89/60

  Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] · CPC title

• H10D86/021

  of multiple TFTs · CPC title

• H10D62/81

  of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation · CPC title