Method and apparatus for source mask optimization configured to increase scanner throughput for a patterning process

US11086230B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11086230-B2
Application numberUS-202016777941-A
CountryUS
Kind codeB2
Filing dateJan 31, 2020
Priority dateFeb 1, 2019
Publication dateAug 10, 2021
Grant dateAug 10, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for optimization to increase lithographic apparatus throughput for a patterning process is described. The method includes providing a baseline dose for an EUV illumination and an initial pupil configuration, associated with a lithographic apparatus. The baseline dose and the initial pupil configuration are configured for use with a dose anchor mask pattern and a corresponding dose anchor target pattern for setting an illumination dose for corresponding device patterns of interest. The method includes biasing the dose anchor mask pattern relative to the dose anchor target pattern; determining an acceptable lower dose for the biased dose anchor mask pattern and the initial pupil configuration; unbiasing the dose anchor mask pattern relative to the dose anchor target pattern; and determining a changed pupil configuration and a mask bias for the device patterns of interest based on the acceptable lower dose and the unbiased dose anchor mask pattern.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for configuring an extreme ultra violet (EUV) lithographic apparatus, the method comprising: providing a baseline dose for an EUV illumination and an initial pupil configuration, wherein the baseline dose and the initial pupil configuration are configured for use with a dose anchor mask pattern and a corresponding dose anchor target pattern for setting an illumination dose for corresponding device patterns of interest; biasing the dose anchor mask pattern relative to the dose anchor target pattern; determining a dose lower than the baseline dose, for the biased dose anchor mask pattern and the initial pupil configuration; unbiasing the dose anchor mask pattern relative to the dose anchor target pattern; and determining a changed pupil configuration and a mask bias for the device patterns of interest based on the lower dose, or a higher dose than the lower dose, and the unbiased dose anchor mask pattern. 2. A computer program product comprising a non-transitory computer readable medium having instructions therein, the instructions, when executed by a computer system, configured to cause the computer system to at least: obtain a baseline dose for an illumination and an initial pupil configuration, wherein the baseline dose and the initial pupil configuration are configured for use with a dose anchor mask pattern and a corresponding dose anchor target pattern for setting an illumination dose for corresponding device patterns of interest; bias the dose anchor mask pattern relative to the dose anchor target pattern; determine a dose lower than the baseline dose, for the biased dose anchor mask pattern and the initial pupil configuration; unbias the dose anchor mask pattern relative to the dose anchor target pattern; and determine a changed pupil configuration and a mask bias for the device patterns of interest based on the lower dose, or a higher dose than the lower dose, and the unbiased dose anchor mask pattern implement the method of claim 1 . 3. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to bias the dose anchor mask pattern relative to the dose anchor target pattern are further configured to cause the computer system to dimensional shift the dose anchor mask pattern relative to the dose anchor target pattern in one or more dimensions. 4. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to bias the dose anchor mask pattern relative to the dose anchor target pattern are further configured to cause the computer system to dimensionally shift one or more edges of one or more features of the dose anchor mask pattern. 5. The computer program product of claim 4 , wherein the one or more features of the dose anchor mask pattern are one dimensional or two dimensional. 6. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to bias the dose anchor mask pattern relative to the dose anchor target pattern are further configured to cause the computer system to bias the dose anchor mask pattern relative to the dose anchor target pattern asymmetrically. 7. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to bias the dose anchor mask pattern relative to the dose anchor target pattern are further configured to cause the computer system to enlarge one or more device patterns and provide a corresponding mask bias of the device patterns of interest. 8. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to determine the lower dose for the biased dose anchor mask pattern and the initial pupil configuration are further configured to cause the computer system to do so using a dose and focus optimization. 9. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to obtain the baseline dose and the initial pupil configuration are further configured to cause the computer system to: optimize a freeform or parametric pupil and the dose anchor mask pattern; optimize a continuous transmission mask (CTM) and extracting main and assist features; optimize pupil and polygon masks at different dose levels; map a discrete pupil; perform a dose and focus optimization; determine the baseline dose and the initial pupil configuration based on the dose and focus optimization; and provide the baseline dose for the illumination and the initial pupil configuration. 10. The computer program product of claim 2 , wherein the instructions are further configured to cause the computer system to, after determination of the changed pupil configuration: normalize an intensity of the illumination to optimize a free form illumination mask co-optimization with a fixed dose and a fixed illumination intensity set at the lower dose, or a dose higher than the lower dose, with a pupil telecentricity penalty; map a continuous pupil produced by the changed pupil configuration to a discrete pupil; perform a dose and focus optimization using a dose anchor feature and a focus anchor feature, simultaneously or sequentially; perform a mask only optimization of device patterns of interest with the discrete pupil; optimize dose based on a difference between Abbe and Hopkins model outputs; and optimize the mask bias for device patterns of interest through a slit using the optimized dose, or a dose higher than the optimized dose. 11. The computer program product of claim 2 , wherein the instructions are further configured to cause the computer system to, after determination of the changed pupil configuration: perform a discrete mirror state optimization at the lower dose, or a dose higher than the lower dose; optimize dose based on a difference between Abbe and Hopkins model outputs; and optimize the mask bias for device patterns of interest through a slit using the optimized dose, or a dose higher than the optimized dose. 12. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to obtain the baseline dose and the initial pupil configuration, bias the dose anchor mask pattern, determine the lower dose, unbias the dose anchor mask pattern, and determine the changed pupil configuration and the mask bias are configured to do so using an aerial image model. 13. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to obtain the baseline dose and the initial pupil configuration, bias the dose anchor mask pattern, determine the lower dose, unbias the dose anchor mask pattern, and determine the changed pupil configuration and the mask bias are configured to do so for a resist image model. 14. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to obtain the baseline dose and the initial pupil configuration, bias the dose anchor mask pattern, determine the lower dose, unbias the dose anchor mask pattern, and determine the changed pupil configuration and the mask bias are configured to do so at any numerical aperture and/or wavelength. 15. The computer program product of claim 2 , wherein the instructions configured to cause the computer system to obtain the baseline dose and the initial pupil configuration, bias the dose anchor mask pattern, determine the lower dose, unbias the dose anchor mask pattern, and determine the changed pupil configuration and the mask bias are configured to do so as part of a memory chip, logic chip, and/or microprocesso

Assignees

Inventors

Classifications

  • Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

  • Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds · CPC title

  • Optical proximity correction [OPC] · CPC title

  • Dose control, i.e. achievement of a desired dose · CPC title

  • G03F7/705Primary

    Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11086230B2 cover?
A method for optimization to increase lithographic apparatus throughput for a patterning process is described. The method includes providing a baseline dose for an EUV illumination and an initial pupil configuration, associated with a lithographic apparatus. The baseline dose and the initial pupil configuration are configured for use with a dose anchor mask pattern and a corresponding dose anch…
Who is the assignee on this patent?
Asml Netherlands Bv
What technology area does this patent fall under?
Primary CPC classification G03F7/70558. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).