Method for assembling force sensor, involves applying sense die adhesive to place, where sense die material is removed

Patent metadata

Field	Value
Publication number	US-11085837-B2
Application number	US-201916546027-A
Country	US
Kind code	B2
Filing date	Aug 20, 2019
Priority date	May 15, 2017
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

First claim

What is claimed is:

1. A method for assembling a force sensor, the method comprising:
removing sense die material from a bottom portion of a sense die while not removing sense die material from a top portion of the sense die, the sense die material being removed around edges of a bottom face of the sense die leaving sense die material at a center of the bottom face to form a bottom support;
applying sense elements to the top portion of the sense die;
applying to the sense die an adhesive to where the sense die material was removed; and
securing, using the adhesive, the sense die to a substrate with the bottom support of the sense die situated between the top portion of the sense die and the substrate.

2. The method of claim 1 , wherein removing sense die material from the sense die around the edges of the bottom face of the sense die comprises etching the sense die material.

3. The method of claim 1 , wherein the bottom face of the sense die along a bottom of the bottom support remains free of adhesive after the sense die is secured to the substrate.

4. The method of claim 1 , wherein the adhesive is applied to laterally facing side walls of the bottom support of the sense die revealed as a result of the sense die material being removed.

5. The method of claim 1 , wherein etching of the edges of the bottom face of the sense die results in a lesser width for the bottom support of the sense die relative to the top portion of the sense die.

6. The method of claim 5 , wherein the etching of the edges of the bottom face of the sense die results in a transverse wall extending between the lesser width of the bottom support and a greater width of the top portion of the sense die, wherein the adhesive is applied to engage at least part of the transverse wall.

7. The method of claim 6 , wherein the adhesive is applied to engage the laterally facing side walls of the bottom support that are revealed as a result of the sense die material being removed.

8. The method of claim 7 , wherein the adhesive is applied to engage the substrate, laterally facing side walls of the bottom support and the transverse wall when the sense die is secured to the substrate.

9. The method of claim 1 , wherein etching of the edges of the bottom face of the sense die results in a projection of the bottom support of the sense die from the top portion of the sense die, and wherein the projection of the bottom support is concentric with the top portion of the sense die.

10. A method for assembling a sensor assembly that includes a sense die, the method comprising:
forming a sense die to include:
a top part that includes a first surface and a second surface;
a bottom part extending from the second surface of the top part to include a third surface; and

securing with an adhesive the sense die to a substrate, with the third surface facing the substrate, and the second surface being spaced above the substrate and providing a space between the second surface of the top part and the substrate, wherein the space is filled at least in part with the adhesive,
wherein the third surface directly contacts the substrate, and
wherein the third surface is free from adhesive after the sense die is secured to the substrate.

11. The method of claim 10 , wherein the bottom part of the sense die is formed by removing a sense die material from the sense die along the second surface, leaving the sense die material along the third surface.

12. The method of claim 11 , wherein the sense die material is removed by etching.

13. The method of claim 10 further comprising adding one or more sense elements to the top part of the sense die.

14. The method of claim 13 , wherein adding the one or more of the sense elements further comprises adding one or more piezo resistive sense elements.

15. A method for assembling a sensor assembly that includes a sense die, the method comprising:
forming a sense die, including:
adding sense elements to a top portion of the sense die;
removing sense die material from a bottom portion of the sense die while not removing sense die material from a top portion of the sense die, the sense die material being removed around edges of a bottom face of the sense die leaving sense die material at a center to form a bottom support;
securing the sense die to a substrate, including:
applying an adhesive to the sense die where the sense die material was removed;
bringing together the sense die and the substrate, with the bottom support of the sense die situated between the top portion of the sense die and the substrate, wherein the adhesive secures the sense die to the substrate.

16. The method of claim 15 , wherein the sense elements are added after the sense die material is removed from the bottom portion of the sense die.

17. The method of claim 15 , wherein the adhesive is applied before the sense die and the substrate are brought together.

18. The method of claim 15 , wherein the bottom face of the sense die along a bottom of the bottom support remains free of adhesive after the sense die is secured to the substrate.

Assignees

• Honeywell Int Inc

Inventors

• Patch Jason Dennis
• Eckhardt Todd
• Machir Jim
• Wade Richard
• Cook Jim

Classifications

• B06B1/0622

  on one surface · CPC title

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title

• G01L1/18 Primary

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title