Method for improved thermal performance of cold plates and heat sinks

Patent metadata

Field	Value
Publication number	US-11085708-B2
Application number	US-201615337959-A
Country	US
Kind code	B2
Filing date	Oct 28, 2016
Priority date	Oct 28, 2016
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.

First claim

What is claimed is:

1. A heat-exchange apparatus, comprising a thermally conductive substrate with a metal microlattice structure attached to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a plurality of microlattice members and a plurality of spans integral with the plurality of microlattice members, the microlattice members extending from the thermally conductive substrate to the plurality of spans, wherein the plurality of spans are oriented parallel to the thermally conductive substrate, each of the plurality of microlattice members and at least one of the plurality of spans comprises a solid metal region, the solid metal region comprising:
an outer electroplated metal layer disposed over an electroless metal layer; and
an inner electroplated metal layer, wherein the electroless metal layer is disposed over the inner electroplated metal layer, wherein the outer electroplated metal layer, the electroless metal layer, and the inner electroplated metal layer are formed on the thermally conductive substrate.

2. The heat-exchange apparatus of claim 1 , wherein the metal microlattice structure comprises at least two metals.

3. The heat-exchange apparatus of claim 1 , wherein the inner electroplated metal layer comprises copper.

4. The heat-exchange apparatus of claim 1 , wherein the electroless metal layer comprises a composition selected from a group consisting of nickel, tin, zinc, gold, alloys thereof, or combinations thereof.

5. The heat-exchange apparatus of claim 1 , wherein the outer electroplated metal layer is an electrolytic copper plating.

6. The heat-exchange apparatus of claim 5 , wherein the thermally conductive substrate comprises copper and the copper plating is in thermal communication with the thermally conductive substrate.

7. A heat-exchange apparatus, comprising a thermally conductive substrate with a metal microlattice structure attached to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a plurality of microlattice members and a plurality of spans integral with the plurality of microlattice members, the microlattice members extending from the thermally conductive substrate to the plurality of spans, wherein the plurality of spans are oriented parallel to the thermally conductive substrate, each of the plurality of microlattice members and at least one of the plurality of spans comprises a solid metal region comprising:
an outer electroplated metal layer disposed over an electroless metal layer; and
an inner electroplated metal layer, wherein the electroless metal layer is disposed over the inner electroplated metal layer, wherein the metal microlattice structure comprises a plurality of spans, each span having a wall that contains a portion of the solid metal region, wherein the outer electroplated metal layer, the electroless metal layer, and the inner electroplated metal layer are formed on the thermally conductive substrate.

8. The heat-exchange apparatus of claim 7 , wherein the metal microlattice structure comprises at least two metals.

9. The heat-exchange apparatus of claim 7 , wherein the metal microlattice structure comprises copper.

10. The heat-exchange apparatus of claim 7 , wherein the electroless metal layer comprises a composition selected from a group consisting of nickel, tin, zinc, gold, alloys thereof, or combinations thereof.

11. The heat-exchange apparatus of claim 7 , wherein the wall includes the electroless metal layer and the outer electroplated metal layer is an electrolytic copper plating.

12. The heat-exchange apparatus of claim 11 , wherein the thermally conductive substrate comprises copper and the copper plating is in thermal communication with the thermally conductive substrate.

13. A heat-exchange apparatus, comprising a thermally conductive substrate with a metal microlattice structure attached to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the thermally conductive substrate comprising a first metal composition, wherein the metal microlattice structure comprises a plurality of microlattice members and a plurality of spans integral with the plurality of microlattice members, the microlattice members extending from the thermally conductive substrate to the plurality of spans, wherein the plurality of spans are oriented parallel to the thermally conductive substrate, each of the plurality of microlattice members and at least one of the plurality of spans comprises a polymer layer, an electroless metal seed layer comprising a second metal composition different from the first metal composition, and an electrolytic metal layer comprising the first metal composition, and the polymer layer comprises a polymer selected from the group consisting of styrenics, vinyl ethers, N-vinyl carbazoles, lactones, lactams, cyclic ethers, acetals, and siloxanes, and wherein the electroless metal seed layer, the electrolytic metal layer, and the polymer are attached to the thermally conductive substrate.

14. The heat-exchange apparatus of claim 13 , wherein the second metal composition comprises a material selected from the group consisting of nickel, tin, zinc, gold, alloys thereof, and combinations thereof.

15. The heat-exchange apparatus of claim 13 , wherein the first metal composition comprises a copper alloy.

Assignees

• IBM

Inventors

• Campbell Eric J
• Mann Phillip V

Classifications

• F28F3/022

  the means being wires or pins · CPC title

• F28F21/067

  Details · CPC title

• F28F21/089

  Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence) · CPC title

• F28F21/085

  from copper or copper alloys · CPC title

• F28F2215/06

  Hollow fins; fins with internal circuits · CPC title