Methods and apparatus for forming node to panel joints

US11085473B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11085473-B2
Application numberUS-201715853301-A
CountryUS
Kind codeB2
Filing dateDec 22, 2017
Priority dateDec 22, 2017
Publication dateAug 10, 2021
Grant dateAug 10, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A node to panel interface structure for use in a transport structure such as a vehicle is disclosed. In an aspect, the node includes a base, first and second sides protruding from the base to form a recess for receiving a panel, ports for adhesive injection and/or vacuum generation, one or more adhesive regions disposed on a surface of each side adjacent the panel, and at least one channel coupled between the first and second ports and configured to fill the adhesive regions with an adhesive, the adhesive being cured to form a node-panel interface. The node may be additively manufactured. In an exemplary embodiment, the node may use sealant features for including sealants that border and define the adhesive regions, and that may hermetically seal the region before and after adhesive injection. In another embodiment, the node may include isolation features for including isolators for inhibiting galvanic corrosion. In another aspect, adhesive may be filled serially on the adhesive regions on the first side and then on the adhesive regions on the second side. Adhesive may alternatively may be filled in parallel, or concurrently, on the adhesive regions of both sides.

First claim

Opening claim text (preview).

What is claimed is: 1. A node comprising: a base; first and second sides protruding from the base to form a recess for receiving a panel; first and second ports; one or more adhesive regions disposed on a surface of each side adjacent the panel; and at least one channel coupled between the first and second ports and configured to fill the adhesive regions with an adhesive, the adhesive being cured to form a node-panel joint, wherein: the first side comprises n=N adhesive regions; each of the N adhesive regions comprises at least two apertures including at least one aperture disposed on an opposite side of at least one other aperture; (a) the first port being coupled to an (n=1) channel portion on the first side; (b) the (n=1) channel portion is coupled to a first aperture of an (n=1) adhesive region on the first side; and (c) a second aperture of the (n=1) adhesive region is coupled to an (n+1=2) channel portion on the first side. 2. The node of claim 1 , wherein the channel runs serially from the first port to the second port through each adhesive region on the first and second sides by using apertures arranged on opposing sides of each adhesive region as respective entry and exit areas for the adhesive. 3. The node of claim 2 , wherein the channel is configured to enable transmission of the adhesive in parallel through each adhesive region on the respective first and second sides. 4. The node of claim 2 , wherein the channel is configured to enable transmission of the adhesive serially through each adhesive region on the first side, through the base, and then serially through each adhesive region on the second side. 5. The node of claim 1 , wherein at least the base, the first and second sides, the first and second ports, and the at least one channel are additively manufactured (AM). 6. The node of claim 5 , wherein at least portions of the channel comprise geometries conducive to additively manufacturing the at least one channel without use of support structures during the AM. 7. The node of claim 1 , wherein at least the base, the first and second sides, the first and second ports, and the at least one channel are co-printed. 8. The node of claim 1 , wherein each of the one or more adhesive regions is bounded by a sealant region configured to accept a sealant. 9. The node of claim 8 , wherein the sealant region comprises the sealant. 10. The node of claim 9 , wherein the sealant is configured to configured to perform one or more following functions: (i) retard flow of the adhesive beyond the corresponding adhesive region; (ii) hermetically seal the corresponding adhesive region prior to adhesive injection; (iii) hermetically seal the corresponding adhesive region after the adhesive is cured; and (iv) inhibit galvanic corrosion between dissimilar materials. 11. The node of claim 9 , wherein the sealant comprises an O-ring, a gasket, or a liquid sealant. 12. The node of claim 9 , wherein the sealant is robotically applied to each corresponding sealant region. 13. The node of claim 9 , wherein at least portions of the channel extending across the first or second sides are elevated relative to an inner surface of the one or more sealant regions to enable the channel portions to contact the adhesive regions via the apertures without disrupting the seal formed by the sealant. 14. The node of claim 1 , further comprising at least one isolation feature disposed on at least one of the first side, the second side, and an inner surface of the base, to prevent contact of the node with the panel upon installation of an isolator in the isolation feature. 15. The node of claim 1 , wherein the first or second sides further comprise one or more gaskets configured to prevent galvanic corrosion. 16. The node of claim 1 , wherein the channel runs from the first port serially through each adhesive region on the first side, through the base, and through each adhesive region on the second side, and then to the second port, and the channel is configured to fill each adhesive region to create a bond with the panel when the adhesive is cured. 17. The node of claim 16 , wherein the second port is disposed on the first side, such that, after routing through each of the one or more adhesive regions on the second side, the channel is routed via the base back to the first side. 18. The node of claim 1 , wherein the channel runs from the first port to the second side via the base, serially through each adhesive region on the second side, back to the first side via the base, and serially through each adhesive region on the first side, whereafter the channel is coupled to the second port. 19. The node of claim 1 , wherein application of negative pressure at the second port and subsequent application of the adhesive at the first port progressively fill the one or more adhesive regions with the adhesive when a panel is inserted. 20. The node of claim 1 , wherein the channel portions contact the one or more adhesive regions via an aperture at an angle. 21. The node of claim 1 , wherein: (b)-(c) continue for (n=2, 3 . . . N) until, at (c), the second aperture of the N th adhesive region is coupled to an (N+1) th channel portion on the first side. 22. The node of claim 21 , wherein: the (N+1) th channel portion is routed through the base to the second side to become an (m=1) channel portion on the second side; the second side comprises m=M adhesive regions; each of the M adhesive regions comprises at least two apertures including at least one aperture on an opposite side of at least one other aperture; (f) the (m=1) channel portion on the second side is coupled to a first aperture of a (m=1) adhesive region on the second side; (g) a second aperture of the first (m=1) adhesive region on the second side is coupled to a (m+1=2) channel portion on the second side; and (f)-(g) continue for (m=2, 3 . . . M) until, at (g), the second aperture of the M th adhesive region is coupled to an (M+1) th channel portion on the second side. 23. The node of claim 22 , wherein the adhesive regions on the first and second sides are configured to receive the adhesive via the first port; and the (M+1) th channel portion is coupled to the second port. 24. The node of claim 22 , wherein N=M. 25. The node of claim 1 , wherein the first port comprises a protrusion or a recess, or a protrusion at least partially inside a recess to allow an end of the protrusion to be proximate to or flush with a surface of the first side. 26. The node of claim 1 , wherein at least one of the first and second ports is configured to be broken off after the adhesive is cured.

Assignees

Inventors

Classifications

  • Driving means · CPC title

  • Data acquisition or data processing · CPC title

  • Nozzles · CPC title

  • Scanners · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11085473B2 cover?
A node to panel interface structure for use in a transport structure such as a vehicle is disclosed. In an aspect, the node includes a base, first and second sides protruding from the base to form a recess for receiving a panel, ports for adhesive injection and/or vacuum generation, one or more adhesive regions disposed on a surface of each side adjacent the panel, and at least one channel coup…
Who is the assignee on this patent?
Divergent Tech Inc
What technology area does this patent fall under?
Primary CPC classification F16B11/006. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).