Polyester resin for heat-shrinkable film, heat-shrinkable film, heat-shrinkable label, and packaged product

US11084901B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11084901-B2
Application numberUS-201816603580-A
CountryUS
Kind codeB2
Filing dateApr 16, 2018
Priority dateApr 27, 2017
Publication dateAug 10, 2021
Grant dateAug 10, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides a polyester resin for heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mol of neopentyl glycol and from 8 to 16% by mol of diethylene glycol when a total amount of the whole diol component in total polyester resin components is taken as 100% by mol. The polyester resin has an intrinsic viscosity (IV) of from 0.70 to 0.86 dl/g, a carboxyl end group concentration (AV) of from 8 to 25 eq/t, and a color b value of from 1.0 to 12.0 in an L*a*b color system. The invention also provides a heat-shrinkable film prepared from the aforementioned polyester resin, as well as a heat-shrinkable label and packaged product.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyester resin for a heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mol of neopentyl glycol and from 8 to 16% by mol of diethylene glycol when a total amount of the whole diol component in total polyester resin components is taken as 100% by mol, characterized in that it satisfies the following requirements (i) to (iii): (i) the polyester resin has an intrinsic viscosity (IV) of from 0.70 to 0.86 dl/g; (ii) the polyester resin has a carboxyl end group concentration (AV) of from 8 to 25 eq/t; and (iii) the polyester resin has a color b value of from 1.0 to 12.0 in an L*a*b color system. 2. A heat-shrinkable film, characterized in that, it contains the polyester resin for heat-shrinkable film mentioned in claim 1 . 3. A heat-shrinkable label which is characterized in being prepared by using the heat-shrinkable film mentioned in claim 2 . 4. A packaged product which is characterized in being formed by coating the heat-shrinkable label mentioned in claim 3 at least on a part of an outer periphery of a target to be packaged followed by subjecting to a heat-shrinking treatment.

Assignees

Inventors

Classifications

  • Coloured · CPC title

  • Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

  • Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title

  • Wrappers or flexible covers; Packaging materials of special type or form (wrappers or envelopes with shock-absorbing properties B65D81/03) · CPC title

  • C08G63/672Primary

    Dicarboxylic acids and dihydroxy compounds · CPC title

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What does patent US11084901B2 cover?
The invention provides a polyester resin for heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mol of neopentyl glycol and from 8 to 16% by mol of diethylene glycol when a total amount of the whole diol component in total polyester resin comp…
Who is the assignee on this patent?
Toyo Boseki
What technology area does this patent fall under?
Primary CPC classification C08G63/672. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).