Jacking tool and semiconductor process apparatus having the same

Patent metadata

Field	Value
Publication number	US-11084694-B2
Application number	US-201815992120-A
Country	US
Kind code	B2
Filing date	May 29, 2018
Priority date	Mar 27, 2018
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A jacking tool includes a bar, a first jack and a second jack. The bar extends in a first direction and has a first connection region and a second connection. The first jack is movably attached to the first connection region of the bar. The second jack is movably attached to the second connection region of the bar. The first jack includes a foot, a first guiding rod and a second guiding rod spaced apart from each other in a second direction crossing the first direction, a rod disposed between the first and second guiding rods with a thread section that is movably attached to the bar, a knob attached to one end of the rod and a toggle attached to an opposite end of the rod that is proximate to the foot in the third direction.

First claim

What is claimed is:

1. A jacking tool, comprising:
a bar extending in a first direction and having a first connection region proximate to one end of the bar and a second connection region proximate to another end of the bar;
a first jack movably attached to the first connection region of the bar; and
a second jack movably attached to the second connection region of the bar,
wherein the first jack includes:
a foot;
a first guiding rod and a second guiding rod spaced apart from each other in a second direction crossing the first direction, the first guiding rod having one end attached to the foot and penetrating the bar in a third direction and the second guiding rod having one end attached to the foot and penetrating the bar in the third direction;
a rod disposed between the first guiding rod and the second guiding rod, the rod having a thread section that is movably attached to the bar;
a knob attached to one end of the rod distal to the foot in the third direction; and
a toggle attached to an opposite end of the rod that is proximate to the foot in the third direction, wherein the toggle is disposed between the bar and the foot;

wherein a threaded connection rod extends from a threaded connection hole on the bar to attach to an object to be lifted.

2. The jacking tool of claim 1 ,
wherein the first guiding rod is slidingly attached to the bar so that a downward force in the third direction applied to the foot through the toggle causes the bar to move away from the foot in the third direction.

3. The jacking tool of claim 1 ,
wherein the first connection region of the bar includes a first hole, a second hole and a third hole arranged in the second direction,
and wherein the second hole is threaded.

4. The jacking tool of claim 3 ,
wherein the first guiding rod penetrates the first hole,
wherein the second guiding rod penetrates the third hole, and
wherein the threaded section of the rod is connected to the second hole.

5. The jacking tool of claim 3 ,
wherein the second connection region of the bar has the same configuration of the first connection region.

6. The jacking tool of claim 3 ,
wherein the bar further includes the threaded connection hole spaced apart from the second hole of the first connection region in the second direction, and
wherein the threaded connection rod is configured to attach the jacking tool to an object to be lifted through the threaded connection hole.

7. The jacking tool of claim 1 ,
wherein the foot includes aluminum.

8. The jacking tool of claim 1 ,
wherein the bar is of rectangular shape.

9. The jacking tool of claim 1 , further comprising:
a Polytetrafluoroethylene pad attached to a bottom of the foot.

10. A semiconductor fabrication system having a jacking tool, comprising:
a frame;
a showerhead accommodated with the frame and configured to distribute a gas into a chamber;
a top plate disposed on the showerhead;
an O-ring interposed between the showerhead and the top plate; and
a jacking tool attached to the top plate,
wherein the jacking tool includes:
a bar extending in a first direction and having a first connection region proximate to one end of the bar and a second connection region proximate to another end of the bar, the bar being attached to the top plate;
a first jack movably attached to the first connection region of the bar and being in contact with the frame; and
a second jack movably attached to the second connection region of the bar and being in contact with the frame;
wherein the first jack includes:
a foot;
a first guiding rod and a second guiding rod spaced apart from each other in a second direction crossing the first direction, the first guiding rod having one end attached to the foot and penetrating the bar in a third direction and the second guiding rod having one end attached to the foot and penetrating the bar in the third direction;
a rod disposed between the first guiding rod and the second guiding rod, the rod having a thread section that is movably attached to the bar;
a knob attached to one end of the rod distal to the foot in the third direction; and
a toggle attached to an opposite end of the rod that is proximate to the foot in the third direction, wherein the toggle is disposed between the bar and the foot;

wherein a threaded connection rod extends from a threaded connection hole on the bar to attach to an object to be lifted; and
wherein a threaded connection rod extends from a threaded connection hole on the bar to attach to an object to be lifted.

11. The semiconductor fabrication system of claim 10 ,
wherein the bar is of rectangular shape.

12. The semiconductor fabrication system of claim 11 ,
wherein a length of the bar is greater than a diameter of the top plate so that the first connection region and the second connection region of the bar are disposed over the frame.

13. The semiconductor fabrication system of claim 10 ,
wherein the first guiding rod is slidingly attached to the bar so that a downward force applied in the third direction through the toggle exerts a reaction force on the top plate to cause the bar to move away from the foot in the third direction.

14. The semiconductor fabrication system of claim 10 ,
wherein the first connection region of the bar includes a first hole, a second hole and a third hole arranged in the second direction,
and wherein the second hole is threaded.

15. The semiconductor fabrication system of claim 14 ,
wherein the first guiding rod penetrates the first hole,
wherein the second guiding rod penetrate the third hole,
wherein the threaded section of the rod is movably coupled to the second hole.

16. The semiconductor fabrication system of claim 14 ,
wherein the bar further includes the threaded connection hole is spaced apart from the second hole of the first connection region in the second direction, and
wherein the threaded connection rod is configured to attach the jacking tool to the top plate through the threaded connection hole.

17. The semiconductor fabrication system of claim 10 , further comprising:
a Polytetrafluoroethylene pad interposed between the foot and the frame.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Barner Christopher W
• Lewis Scott P

Classifications

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H01J37/32908

  Utilities · CPC title

• H01J37/3244 Primary

  Gas supply means · CPC title

• H01J37/32807

  Construction (includes replacing parts of the apparatus) · CPC title