Outdoor electronics enclosure with modular structure

Patent metadata

Field	Value
Publication number	US-11083093-B2
Application number	US-201916429611-A
Country	US
Kind code	B2
Filing date	Jun 3, 2019
Priority date	Aug 14, 2018
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.

First claim

That which is claimed is:

1. A modular electronics enclosure, comprising:
a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall, and first and second opposed side walls that define an internal cavity, a door, and a cooling unit;
wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends Perpendicular from a rear edge of the first wall panel and top panel;
wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel;
wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels;
wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame;
wherein the door hingedly attaches to one of the first or second wall panels of the first or second L-shaped pieces; and
wherein the cooling unit is mounted to the door for cooling the internal cavity.

2. The modular electronics enclosure defined in claim 1 , wherein the rear frame includes an opening covered by an I/O panel.

3. The modular electronics enclosure defined in claim 1 , wherein at least one of the side panels of the rear frame includes an aperture for receiving a cable routed into the internal cavity.

4. The modular electronics enclosure defined in claim 1 , further comprising a battery tray mounted in the internal cavity and a battery string residing in the battery tray.

5. The modular electronics enclosure defined in claim 1 , further comprising a divider that divides the internal cavity into multiple compartments.

6. The modular electronics enclosure defined in claim 1 , further comprising electronics equipment mounted in the internal cavity.

7. The modular electronics enclosure defined in claim 6 , further comprising a battery string residing in the internal cavity.

8. The modular electronics enclosure defined in claim 1 , wherein the internal cavity is nominally 21 RU in height.

9. An assembly, comprising first and second modular electronics enclosures, each of the first and second modular electronics enclosures comprising:
a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall, first and second opposed side walls that define an internal cavity, a door, and a cooling unit;
wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends perpendicular from a rear edge of the first wall panel and top panel;
wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends Perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel;
wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels;
wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame;
wherein the door hingedly attaches to one of the first or second wall panels of the first or second L-shaped pieces;
wherein the cooling unit is mounted to the door for cooling the internal cavity; and
wherein the second modular electronics enclosure is vertically stacked on and above the first electronics enclosure.

10. The assembly defined in claim 9 , wherein the first modular electronics enclosure houses at least one battery string.

11. The assembly defined in claim 10 , wherein the second modular electronics enclosure houses electronic equipment.

12. A modular electronics enclosure, comprising:
a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity;
wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends perpendicular from a rear edge of the first wall panel and top panel;
wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel; and
wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels; and
wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame with fasteners, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame with fasteners, and wherein the fasteners are located in the internal cavity of the shell such that the shell has no externally exposed fasteners.

13. The modular electronics enclosure defined in claim 12 , further comprising a door hingedly attached to one of the wall panels of the first or second pieces.

14. The modular electronics enclosure defined in claim 13 , further comprising a cooling unit mounted to the door for cooling the internal cavity.

15. The modular electronics enclosure defined in claim 12 , wherein the internal cavity is nominally 21 RU in height.

Assignees

• Commscope Technologies Llc

Inventors

• Mann Charles John
• Wang Jiayong
• Shi Qiwei
• Hendrix Walter Mark
• Nguyen Tri H

Classifications

• H05K5/13 Primary

  assembled by screws · CPC title

• H05K7/186 Primary

  for supporting telecommunication equipment (selecting apparatus H04Q1/02) · CPC title

• H05K7/1488

  Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures · CPC title

• H05K5/065

  sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding · CPC title

• H05K7/183

  support rails therefor · CPC title