Integrated device package

Patent metadata

Field	Value
Publication number	US-11083089-B1
Application number	US-202016815536-A
Country	US
Kind code	B1
Filing date	Mar 11, 2020
Priority date	Mar 11, 2020
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

A package is disclosed. The package includes a substrate and an electrical component vertically mounted to the substrate. The electrical component has a first end, a second end vertically spaced from the first end, and a side wall extending from the first end to the second end. The first end of the electrical component is positioned between the substrate and the second end of the electrical component. The package can also include a molding material disposed at least partially along the side wall of the electrical component.

First claim

What is claimed is:

1. A package comprising:
a substrate;
an electrical component vertically mounted to the substrate, the electrical component having a longitudinal dimension, a transverse dimension generally perpendicular to the longitudinal dimension, a first end portion, a second end portion vertically spaced from the first portion along the longitudinal dimension of the electrical component, and a side wall extending from the first end portion to the second end portion, the first end portion having a first polarity and positioned between the substrate and the second end portion of the electrical component, the second end portion having a second polarity, the longitudinal dimension being greater than the transverse dimension; and
a molding material disposed at least partially along the side wall of the electrical component.

2. The package of claim 1 , wherein the longitudinal dimension of the electrical component is at least twice as long as the transverse dimension of the electrical component.

3. The package of claim 1 , further comprising a second component mounted to the substrate.

4. The package of claim 3 , wherein the second component is vertically mounted to the substrate, the second component having a third end portion and a fourth end portion vertically spaced from the third end portion, the third end portion of the second component is positioned between the substrate and the fourth end portion of the second component.

5. The package of claim 4 , further comprising an interconnect structure electrically connecting the second portion of the electrical component and the fourth portion of the second component.

6. The package of claim 5 , wherein the interconnect structure comprises a conductive ink.

7. The package of claim 5 , further comprising a third component electrically coupled to the substrate by way of the electrical component and the interconnect structure.

8. The package of claim 3 , wherein the second component comprises an integrated device die.

9. The package of claim 3 , wherein the substrate comprises an electrical pathway that electrically couples the electrical component and the second component.

10. The package of claim 1 , further comprising a second component mounted over the electrical component, the second component being in electrical communication with the substrate through the electrical component.

11. The package of claim 1 , wherein the substrate comprises a printed circuit board.

12. A package comprising:
a substrate;
a first component vertically mounted to the substrate, the first component having a long side, a short side shorter than the long side, a first end portion, and a second end portion vertically spaced from the first end portion along the long side, the first end portion of the first component mounted to the substrate and positioned between the substrate and the second end portion of the component;
a second component vertically mounted to the substrate, the second component having a third end portion and a fourth end portion vertically spaced from the third end portion, the third end portion of the second component mounted to the substrate and positioned between the substrate and the fourth end portion of the second component; and
an interconnect structure electrically connecting the second portion of the first component and the fourth portion of the second component.

13. The package of claim 12 , wherein the interconnect structure is arranged so as to provide lateral electrical connection between the first component and the second component.

14. The package of claim 12 , wherein the interconnect structure comprises a conductive ink.

15. The package of claim 12 , wherein the interconnect structure comprises a passive device.

16. The package of claim 12 , further comprising a molding material disposed at least partially between a first side wall of the first component extending from the first end portion to the second end portion and a second side wall of the second component extending from the third end portion to the fourth end portion.

17. The package of claim 12 , wherein the first component comprises a passive component that has a positive terminal and a negative terminal.

18. A package comprising:
a substrate; and
an electrical routing means for providing an electrical pathway between a first portion of the substrate and a second portion of the substrate, the electrical routing means comprising:
a first component vertically mounted to the first portion of the substrate, the first component having a long side, a short side generally perpendicular with the long side, a first terminal, and a second terminal spaced along the long side, the long side of the first component having a dimension greater than the shorter side of the first component, the first component configured to provide a first vertical electrical path from the first portion of the substrate through the first terminal to the second terminal along the long side of the first component;
a second component vertically mounted to the second portion of the substrate, the second component having a long side, a short side generally perpendicular with the long side, a third terminal, and a fourth terminal spaced along the long side, the long side of the second component having a dimension greater than the short side of second component, the second component configured to provide a second vertical electrical path from the fourth terminal through the third terminal to the second portion of the substrate along the long side of the second component; and
an interconnect electrically coupling the second terminal of the first component and the fourth terminal of the second component, the interconnect configured to provide a lateral electrical path between the first component and the second component.

19. The package of claim 18 , wherein the first component comprises a passive component, and the first terminal and the second terminal has opposite polarities.

20. The package of claim 18 , further comprising a molding material disposed at least partially between the first component and the second component.

Assignees

• Analog Devices International Unlimited Co

Inventors

• Toong Teik Tiong
• Chew Sok Mun
• Kang Chern Beng

Classifications

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2201/1053

  Mounted components directly electrically connected to each other, i.e. not via the PCB · CPC title

• H05K2201/10454

  Vertically mounted · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K3/341

  Surface mounted components · CPC title