Inductor bridge and electronic device
US-2019116659-A1 · Apr 18, 2019 · US
US11083083B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11083083-B2 |
| Application number | US-202016897317-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2020 |
| Priority date | Dec 26, 2017 |
| Publication date | Aug 3, 2021 |
| Grant date | Aug 3, 2021 |
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An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.
Opening claim text (preview).
What is claimed is: 1. An inductor bridge comprising: a flexible substrate; and a coil defined by a conductor pattern provided on or in the flexible substrate; wherein the inductor bridge connects a plurality of circuit portions; the flexible substrate includes at least one rigid portion and at least one flexible portion; the at least one rigid portion is wider than the flexible portion; the at least one rigid portion includes the coil and a joining portion connected to another circuit; the coil includes a plurality of coil portions located at different positions in plan view; the flexible portion is located adjacent to one side of the at least one rigid portion; at least two of the plurality of coil portions are located on the one side when viewed from the joining portion; the plurality of coil portions located on the one side when viewed from the joining portion include a first coil portion and a second coil portion; the second coil portion is located nearer to the one side than the first coil portion; and an inductance of the second coil portion is substantially equal to or less than an inductance of the first coil portion. 2. The inductor bridge according to claim 1 , wherein the flexible substrate is a multilayer substrate including a plurality of laminated insulating base material layers; and a conductor pattern defining the coil is provided over the plurality of insulating base material layers. 3. The inductor bridge according to claim 1 , further comprising a bending portion in the flexible portion. 4. An electronic device comprising: an inductor bridge; a first circuit portion; and a second circuit portion; wherein the first circuit portion and the second circuit portion are connected via the inductor bridge; the inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, the inductor bridge connecting a plurality of circuit portions; the flexible substrate includes at least one rigid portion and at least one flexible portion; the at least one rigid portion is wider than the flexible portion; the at least one rigid portion includes the coil and a joining portion connected to another circuit; the coil includes a plurality of coil portions located at different positions in plan view; the flexible portion is located adjacent to one side of the at least one rigid portion; at least two of the plurality of coil portions are located on the one side when viewed from the joining portion; the plurality of coil portions located on the one side when viewed from the joining portion include a first coil portion and a second coil portion; the second coil portion is located nearer to the one side than the first coil portion; an inductance of the second coil portion is substantially equal to or less than an inductance of the first coil portion; and in a state where the flexible portion is bent, the first circuit portion and the second circuit portion are connected via the inductor bridge. 5. The electronic device according to claim 4 , wherein the flexible substrate is a multilayer substrate including a plurality of laminated insulating base material layers; and a conductor pattern defining the coil is provided over the plurality of insulating base material layers. 6. The electronic device according to claim 4 , further comprising a bending portion in the flexible portion. 7. The inductor bridge according to claim 2 , wherein the multilayer substrate includes a resist film provided on the plurality of laminated insulating base material layers. 8. The inductor bridge according to claim 7 , wherein the resist film includes at least one opening that exposes the joining portion. 9. The inductor bridge according to claim 2 , wherein the plurality of laminated insulating base material layers include at least one of liquid crystal polymer (LCP) and polyetheretherketone (PEEK). 10. The inductor bridge according to claim 1 , wherein the at least one rigid portion includes a first rigid portion and a second rigid portion; the first rigid portion is located adjacent to a first side of the flexible portion; and the second rigid portion is located adjacent to a second side of the flexible portion. 11. The inductor bridge according to claim 10 , wherein the first rigid portion includes the coil and the joining portion; and the second rigid portion includes a second joining portion. 12. The inductor bridge according to claim 1 , wherein the first coil portion and the second coil portion are magnetically coupled by a closed-loop magnetic flux. 13. The electronic device according to claim 4 , wherein the first circuit portion includes an antenna element pattern. 14. The electronic device according to claim 4 , wherein a capacitor is mounted on the inductor bridge.
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