Resin film for electronic devices, and electronic device

Patent metadata

Field	Value
Publication number	US-11081672-B2
Application number	US-201816472976-A
Country	US
Kind code	B2
Filing date	Feb 15, 2018
Priority date	Feb 23, 2017
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

Provided is a resin film for an electronic device including: a resin containing a polymer; hygroscopic particles dispersed in the resin and having a primary particle diameter of 200 nm or less; and a dispersant, wherein an absolute value of a difference in refractive index between the resin and the particles is 0.05 or less. The resin is preferably a thermoplastic resin, and more preferably a thermoplastic elastomer. The polymer is preferably one or more types selected from an aromatic vinyl compound-conjugated diene copolymer and a hydrogenated aromatic vinyl compound-conjugated diene copolymer. An electronic device including the resin film for an electronic device is also provided.

First claim

The invention claimed is:

1. A resin film for an electronic device comprising:
a resin containing a polymer;
hygroscopic particles dispersed in the resin and having a primary particle diameter of 200 nm or less; and
a dispersant, wherein
an absolute value of a difference in refractive index between the resin and the hygroscopic particles is 0.05 or less,
an amount of the dispersant is 7 parts by weight or more and 50 parts by weight or less relative to 100 parts by weight of the hygroscopic particles,
the polymer is a hydrogenated styrene-isoprene-styrene block copolymer in which both an unsaturated bond of isoprene and an aromatic ring are hydrogenated, the polymer having an alkoxysilyl group introduced thereto,
a ratio (wA/wB) of the weight fraction wA of all of the styrene blocks in the entire block copolymer relative to the weight fraction wB of all of the isoprene blocks in the entire block copolymer is 20/80 or more and 60/40 or less,
the hygroscopic particles are one or more substances selected from the group consisting of zeolite and hydrotalcite, and
an acid value or a base value of the dispersant is 20 mgKOH/g or more, and 200 mgKOH/g or less.

2. The resin film for an electronic device according to claim 1 , wherein the resin is a thermoplastic resin.

3. The resin film for an electronic device according to claim 2 , wherein the thermoplastic resin is a thermoplastic elastomer.

4. The resin film for an electronic device according to claim 1 , wherein the polymer having an alkoxysilyl group is a graft polymer containing an alkoxysilyl group-containing unit.

5. The resin film for an electronic device according to claim 1 , wherein a storage elastic modulus at 25° C. thereof is 10 7 Pa or more and 10 9 Pa or less.

6. The resin film for an electronic device according to claim 1 , wherein a thickness thereof is 0.1 μm or more and 1000 μm or less.

7. The resin film for an electronic device according to claim 1 , wherein an internal haze thereof is 6.0% or less.

8. An electronic device comprising the resin film for an electronic device according to claim 1 .

Assignees

• Zeon Corp

Inventors

• Inoue Hiroyasu

Classifications

• H10K59/874

  including getter material or desiccant · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K50/846

  comprising getter material or desiccants · CPC title

• C08K3/34 Primary

  Silicon-containing compounds · CPC title

• C08L53/025

  modified · CPC title