Radiation shield around a component on a substrate

Patent metadata

Field	Value
Publication number	US-11081450-B2
Application number	US-201916585052-A
Country	US
Kind code	B2
Filing date	Sep 27, 2019
Priority date	Sep 27, 2019
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

First claim

What is claimed is:

1. An electronic device comprising:
a substrate;
a radiation source on the substrate;
a ground on the substrate, wherein the ground is located around the radiation source; and
a heat spreader over the radiation source, wherein the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate.

2. The electronic device of claim 1 , wherein the one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

3. The electronic device of claim 1 , wherein the one or more ground coupling mechanisms that are in contact with the ground on the substrate create a Faraday cage around the radiation source.

4. The electronic device of claim 1 , wherein the ground is part of a stiffener for the substrate.

5. The electronic device of claim 1 , wherein the radiation source emits electromagnetic interference and/or radio-frequency interference.

6. The electronic device of claim 1 , wherein at least one specific ground coupling mechanism from the one or more ground coupling mechanisms is electrically conductive and can convert an input force at one area of the specific ground coupling mechanism to an output force at another area of the specific ground coupling mechanism through elastic body deformation.

7. The electronic device of claim 1 , wherein the radiation source is part of a system on a chip package.

8. An electronic device comprising:
a substrate;
a radiation sensitive device on the substrate;
a ground on the substrate, wherein the ground is located around the radiation sensitive device; and
a heat spreader over the radiation sensitive device, wherein the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate.

9. The electronic device of claim 8 , wherein the one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from a radiation source from the radiation sensitive device.

10. The electronic device of claim 8 , wherein the one or more ground coupling mechanisms that are in contact with the ground on the substrate create a Faraday cage around the radiation sensitive device.

11. The electronic device of claim 8 , wherein the ground is part of a stiffener for the substrate.

12. The electronic device of claim 8 , wherein the radiation sensitive device is sensitive to electromagnetic interference and/or radio-frequency interference.

13. The electronic device of claim 8 , wherein at least one specific ground coupling mechanism from the one or more ground coupling mechanisms is electrically conductive and can convert an input force at one area of the specific ground coupling mechanism to an output force at another area of the specific ground coupling mechanism through elastic body deformation.

14. The electronic device of claim 8 , wherein the radiation sensitive device is part of a system on a chip package.

15. A method comprising:
creating a ground on a substrate around a radiation source on the substrate;
adding one or more ground coupling mechanisms to a heat spreader; and
coupling the heat spreader to the radiation source, wherein the one or more ground coupling mechanisms are in contact with the ground on the substrate.

16. The method of claim 15 , wherein the one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

17. The method of claim 15 , wherein the one or more ground coupling mechanisms that are in contact with the ground on the substrate create a Faraday cage around the radiation source.

18. The method of claim 15 , wherein the ground is part of a stiffener for the substrate.

19. The method of claim 15 , wherein the radiation source emits electromagnetic interference and/or radio-frequency interference.

20. The method of claim 15 , wherein the radiation source is part of a system on a chip package.

Assignees

• Intel Corp

Inventors

• Han Dong-Ho
• Lee Jaejin
• Chang Je-Young
• Peterson Jerrod
• Carbone Mark

Classifications

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/023

  Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W44/248

  for antennas · CPC title