Polyamide composition containing a polyamide and an additive

Patent metadata

Field	Value
Publication number	US-11078362-B2
Application number	US-201715999324-A
Country	US
Kind code	B2
Filing date	Feb 16, 2017
Priority date	Feb 19, 2016
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process.

First claim

The invention claimed is:

1. A polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A), wherein the at least one additive (A) is selected from compounds of general formula (I)

in which
R 1 and R 3 are independently of one another selected from the group consisting of H, C 1 - to C 10 -alkyl and NR 5 R 6 ,
wherein
R 5 and R 6 are independently of one another selected from the group consisting of H and C 1 - to C 10 -alkyl;

R 2 and R 4 are independently of one another selected from the group consisting of H, C 1 - to C 10 -alkyl and NR 7 R 8 ,
wherein
R 7 and R 8 are independently of one another selected from the group consisting of H and C 1 - to C 10 -alkyl;

X represents N, O + or S + ;
wherein the compounds of general formula (I) have a positive charge when X represents O + or S + and the compounds of general formula (I) then comprise an anion Y − ,
wherein
Y − is selected from the group consisting of hydroxide, chloride, bromide, iodide, sulfate, sulfite, phosphate and phosphite, wherein the polyamide composition (PC) is present in the form of a powder having a particle size in the range from 1 to 200 μm,
wherein the composition is a sintering powder; and wherein
the polyamide composition (PC) comprises in the range from 95 to 99.9 wt % of the at least one polyamide (P) and in the range from 0.1 to 5 wt % of the at least one additive (A) in each case based on the sum of the weight percentages of the at least one polyamide (P) and of the at least one additive (A);
wherein the polyamide composition has a D10 value in the range of from 10 to 30 μm.

2. The composition according to claim 1 , wherein the at least one polyamide (P) present in the polyamide composition (PC) is selected from the group consisting of PA 4, PA 6, PA 7, PA 8, PA 9, PA 11, PA 12, PA 46, PA 66, PA 69, PA 510, PA 610, PA 612, PA 613, PA 1212, PA 1313, PA 6T, PA MXD6, PA 61, PA 6-3-T, PA 6/6T, PA 6/66, PA 66/6, PA 6/12, PA 66/6/610, PA 61/6T, PA PACM 12, PA 61/6T/PACM, PA 12/MACMI, PA 12/MACMT, PA PDA-T and copolyamides composed of two or more of the abovementioned polyamides.

3. The composition according to claim 1 , wherein the at least one polyamide (P) present in the polyamide composition (PC) is selected from the group consisting of polyamide 6 (PA 6), polyamide 66 (PA 66), polyamide 6/66 (PA 6/66), polyamide 66/6 (PA 66/6), polyamide 610 (PA 610), polyamide 6/6T (PA 6/6T), polyamide 12 (PA12) and polyamide 1212 (PA1212).

4. The composition according to claim 1 , wherein the substituents of the compounds of general formula (I) are defined as follows:
R 1 and R 3 are independently of one another selected from the group consisting of H and C 1 - to C 5 -alkyl;
R 2 and R 4 are independently of one another selected from the group consisting of C 1 - to C 5 -alkyl and NR 7 R 8 ,
wherein
R 7 and R 8 are independently of one another selected from the group consisting of H and C 1 - to C 5 -alkyl;
X is N or S + ,
wherein the compounds of general formula (I) have a positive charge when X represents S + and the compounds of general formula (I) then comprise an anion Y − ,
wherein
Y − is selected from the group consisting of hydroxide, chloride, bromide and iodide.

5. The composition according to claim 1 , wherein the at least one additive (A) present in the polyamide composition (PC) is selected from the group consisting of neutral red and methylene blue.

6. The composition according to claim 1 , wherein the polyamide composition (PC) comprises further additives (fA), wherein the further additives (fA) are selected from the group consisting of stabilizers, dyes, pigments, fillers, reinforcers, impact modifiers and plasticizers.

7. The composition according to claim 1 , wherein the polyamide composition (PC) comprises in the range from 0.1 to 60 wt % of further additives (fA) based on the total weight of the polyamide composition (PC).

8. A method comprising selective laser sintering the polyamide composition (PC) according to claim 1 .

9. A method comprising producing a molded article from the polyamide composition (PC) according to claim 1 .

Assignees

• Basf Se

Inventors

• Gabriel Claus
• Gramlich Simon
• Ostermann Rainer
• Richter Florian
• Dabbous Raphael
• Meier Thomas
• Schrof Wolfgang

Classifications

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• C08J3/12

  Powdering or granulating · CPC title

• B29C45/0001

  characterised by the choice of material · CPC title

• C08K5/46

  with oxygen or nitrogen in the ring · CPC title

• B29C64/153 Primary

  using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title