Polyamide resin composition, molded article, and method for manufacturing polyamide resin pellet

US11078330B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11078330-B2
Application numberUS-201716471799-A
CountryUS
Kind codeB2
Filing dateDec 6, 2017
Priority dateDec 22, 2016
Publication dateAug 3, 2021
Grant dateAug 3, 2021

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Abstract

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Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and dicarboxylic acid derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an α,ω-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin includes phosphorus atoms in a ratio of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio.

First claim

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The invention claimed is: 1. A polyamide resin composition comprising a polyamide resin and an inorganic filler, wherein the polyamide resin comprises diamine-derived constituent units and dicarboxylic acid-derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an am-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin comprises phosphorus atoms in a concentration of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio. 2. The polyamide resin composition according to claim 1 , wherein the inorganic filler is an inorganic filler comprising glass as a main component. 3. The polyamide resin composition according to claim 1 , wherein the inorganic filler is glass fiber. 4. The polyamide resin composition according to claim 1 , comprising the inorganic filler in a ratio of from 35 to 65 mass % of the polyamide resin composition. 5. The polyamide resin composition according to claim 1 , which is a pellet. 6. A molded article obtainable by molding the polyamide resin composition described in claim 1 . 7. The molded article according to claim 6 , wherein the molded article is a sliding part. 8. A method for manufacturing a polyamide resin pellet, the method comprising: adding an inorganic filler to a polyamide resin to form a mixture; and melt-kneading the mixture, wherein the polyamide resin comprises diamine-derived constituent units and dicarboxylic acid-derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an α,ω-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin comprises phosphorus atoms in a concentration of from 20 to 100 mass ppm and comprises calcium atoms in a molar ratio of phosphorus atoms:calcium atoms of 1:0.3 to 0.7.

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What does patent US11078330B2 cover?
Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and d…
Who is the assignee on this patent?
Mitsubishi Gas Chemical Co
What technology area does this patent fall under?
Primary CPC classification C08G69/26. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 03 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).