Multilayer film for reclosable pet packaging

US11078004B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11078004-B2
Application numberUS-201615745621-A
CountryUS
Kind codeB2
Filing dateJul 12, 2016
Priority dateJul 17, 2015
Publication dateAug 3, 2021
Grant dateAug 3, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer film: an adhesive layer A: an extrudable hot-melt self-adhesive composition; a complexable thin layer B; and a heat-sealable and cleavable layer C of a linear copolyester C1 obtained by polycondensation of a composition of monomers: at least one diol (i), at least one compound (ii) chosen from terephthalic acid or a diester derivative and at least one compound (iii) chosen from an aromatic or aliphatic dicarboxylic acid or a diester or anhydride derivative; the amounts of the monomers (i), (ii) and (iii) used in the polycondensation such that the softening temperature of C1 is below 190° C. A process for producing the multilayer film by co-extrusion blow-molding. A resealable packaging comprising a PET-based receptacle and a seal of said multilayer film, the heat-sealable and cleavable layer (C) of which is heat-sealed on the receptacle.

First claim

Opening claim text (preview).

The invention claimed is: 1. A multilayer film comprising: an adhesive layer A having a thickness of 7 to 50 μm and consisting of an extrudable hot-melt self-adhesive composition a which has a melt flow index (or MFI), measured for a temperature of 190° C. and a total weight of 2.16 kg, ranging from 0.01 to 200 g/10 minutes and which comprises, on the basis of the total weight of said composition a: from 40% to 70% by weight of a composition a1 of styrene block copolymers with at least one elastomer block, said composition a1 consisting of, on the basis of its total weight: of 30% to 90% by weight of at least one diblock copolymer of styrene-isoprene block copolymer (SI), styrene-butadiene/isoprene block copolymer (SBI), styrene-isoprene/butadiene block copolymer (SIB), styrene-butadiene block copolymer (SB), styrene-ethylene/butylene block copolymer (SEB), styrene-ethylene/propylene block copolymer (SEP), and of 10% to 70% by weight of at least one triblock copolymer of styrene-isoprene-styrene block copolymer (SIS), styrene-isoprene/butadiene-styrene block copolymer (SIBS), styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene/butylene-styrene block copolymer (SEBS), styrene-ethylene/propylene-styrene block copolymer (SEPS); the total content of styrene units of said composition a1 being 10% to 40% by weight on the basis of the total weight of a1; and from 30% to 60% by weight of one or more tackifying resins a2 having a softening temperature of between 5 and 140° C.; a complexable thin layer B consisting of a thermoplastic b; and a heat-sealable and cleavable layer C having a thickness of 10 to 150 μm; the layers B and C being linked to one another by the layer A; and wherein in said film the layer C consists of a composition c of, on the basis of the total weight of c, a content by weight of at least 95% of at least one linear copolyester C1 obtained by polycondensation of a composition m of monomers of: at least one diol (i), at least one compound (ii) that is terephthalic acid or a diester derivative thereof, optionally substituted with an alkyl radical, and at least one compound (iii) that is an aromatic or aliphatic dicarboxylic acid or a diester or anhydride derivative thereof; the amounts of the monomers (i), (ii) and (iii) used in the polycondensation being such that the softening temperature of C1 is below 190° C. 2. The multilayer film as claimed in claim 1 , wherein the softening temperature of the linear copolyester C1 included in composition c of the C is below 180° C. 3. The multilayer film as claimed in claim 1 , wherein the linear copolyester C1 is obtained by polycondensation of a composition m consisting of, on the basis of contents expressed as mol % per 100 mol of monomers, of: approximately 50% of diol (i), from 10% to 38% of compound (ii), and from 12% to 40% of compound (iii). 4. The multilayer film as claimed in claim 1 , wherein ethylene glycol is used as diol (i). 5. The multilayer film as claimed in claim 1 , wherein composition a of the layer A has a melt flow index of 2 to 70 g/10 minutes. 6. The multilayer film as claimed in claim 1 , wherein the composition a1 of styrene block copolymers included in the composition a of the layer A consists of an SIS triblock copolymer and an SI diblock copolymer. 7. The multilayer film as claimed in claim 1 , wherein the resin(s) a2 included in the composition a of the layer A are: (ii) resins obtained by hydrogenation, polymerization or copolymerization with an aromatic hydrocarbon of mixtures of unsaturated aliphatic hydrocarbons having approximately 5, 9 or 10 carbon atoms resulting from petroleum fractions; or (iii) terpene resins resulting from the polymerization of terpene hydrocarbons in the presence of Friedel-Crafts catalysts, which are optionally modified by the action of phenols. 8. The multilayer film as claimed in claim 1 , wherein composition a of the layer A comprises: from 50% to 70% of the composition a1 of styrene block copolymers; and from 30% to 50% of tackifying resin a2. 9. The multilayer film as claimed in claim 1 , wherein the multilayer film also comprises a tie layer D, connecting the layer A to the layer B, and/or a tie layer E, connecting the layer A to the layer C. 10. The multilayer film as claimed in claim 1 , wherein the thickness of the layer A ranges from 8 to 25 μm. 11. A resealable packaging comprising: a PET-based receptacle which consists either of amorphous PET or of a bilayer system of amorphous PET and of semicrystalline PET, said receptacle having a flat bottom and a perimeter in the form of a flat band, and a seal consisting of the multilayer film as defined in claim 1 , the layer (C) of which is heat-sealed on the perimeter of the receptacle, in contact with amorphous PET. 12. A process for producing the multilayer film as defined in claim 1 , said process comprising co-extrusion of the composition a, the thermoplastic b and the composition c, at a temperature of between 150° C. and 200° C. 13. The production process as claimed in claim 12 , wherein the co-extrusion is carried out by blow-molding. 14. The production process as claimed in claim 12 , comprising: (i) the introduction, into separate extruders, of constituent compositions and materials of the layers A, B, C, and optionally a tie layer D and a tie layer E, in the form of granules having a size of between 1 and 10 mm, then (ii) the conversion by heating of said granules to a viscous liquid state forming viscous compositions, then (iii) the passing of the viscous compositions through an extrusion head comprising a set of coplanar and concentric annular dies, each brought to a temperature of between 150° C. and 200° C., so as to form a tubular bubble comprising several layers, in which the order of the layers corresponds to that desired for the final film, then (iv) radial expansion and the drawing of the bubble, then (v) cooling of said bubble. 15. The production process as claimed in claim 14 , wherein the extrusion head used in step (iii) is a monoblock extrusion head, in which the annular dies are brought to one and the same temperature of between 150° C. and 200° C.

Assignees

Inventors

Classifications

  • B32B7/12Primary

    using interposed adhesives or interposed materials with bonding properties · CPC title

  • Removable lids or covers (with means for piercing, cutting, or tearing a frangible inner closure B65D51/22) · CPC title

  • Thermoplastic elastomer material · CPC title

  • comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers · CPC title

  • of synthetic resin · CPC title

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Frequently asked questions

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What does patent US11078004B2 cover?
A multilayer film: an adhesive layer A: an extrudable hot-melt self-adhesive composition; a complexable thin layer B; and a heat-sealable and cleavable layer C of a linear copolyester C1 obtained by polycondensation of a composition of monomers: at least one diol (i), at least one compound (ii) chosen from terephthalic acid or a diester derivative and at least one co…
Who is the assignee on this patent?
Bostik Sa
What technology area does this patent fall under?
Primary CPC classification B32B7/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 03 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).