Thermally conductive silicone rubber composite sheet

Patent metadata

Field	Value
Publication number	US-11077647-B2
Application number	US-201716313795-A
Country	US
Kind code	B2
Filing date	Jul 12, 2017
Priority date	Aug 5, 2016
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which(A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and(B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.

First claim

The invention claimed is:

1. A thermally conductive silicone rubber composite sheet including a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, wherein
(A) the intermediate layer is an electrically insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K, a tensile elastic modulus of not lower than 5 GPa, and a thickness of 50 to 100 μm, and
(B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.

2. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the thermally conductive silicone rubber composite sheet has a total thickness of not larger than 300 μm.

3. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the intermediate layer has a tensile strength of not lower than 200 MPa.

4. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

5. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

6. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

7. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the curing agent as the component (b) is an addition reaction-type curing agent utilizing hydrosilylation reaction, and the silicon compound-based adhesion imparting agent as the component (d) has any one or both of a vinyl group and a Si—H group; and any one or both of an epoxy group and an alkoxy group.

8. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the curing agent as the component (b) is an organic peroxide, and the silicon compound-based adhesion imparting agent as the component (d) has any one or both of a methyl group and a vinyl group; and any one or both of an epoxy group and an alkoxy group.

9. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein the intermediate layer has a tensile strength of not lower than 200 MPa.

10. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

11. The thermally conductive silicone rubber composite sheet according to claim 3 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

12. The thermally conductive silicone rubber composite sheet according to claim 9 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

13. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

14. The thermally conductive silicone rubber composite sheet according to claim 3 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

15. The thermally conductive silicone rubber composite sheet according to claim 9 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

16. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

17. The thermally conductive silicone rubber composite sheet according to claim 3 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

18. The thermally conductive silicone rubber composite sheet according to claim 4 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

19. The thermally conductive silicone rubber composite sheet according to claim 5 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

Assignees

• Shinetsu Chemical Co

Inventors

• Endo Akihiro
• Tanaka Yuki

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• B32B25/08 Primary

  of synthetic resin · CPC title