Movable platen, opening/closing apparatus and molding apparatus

US11077594B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11077594-B2
Application numberUS-201615551787-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2016
Priority dateFeb 18, 2015
Publication dateAug 3, 2021
Grant dateAug 3, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A movable platen according to the present invention includes: a mold clamping platen 42 having a projecting portion 62 in a mold closing direction-side surface; a mold mounting platen 44 mounted to the projecting portion 62 of the mold clamping platen 42 ; and a guide mechanism 50 fixed to the mold clamping platen 42 and supporting the mold mounting platen 44 . Only the mold clamping platen 42 is fixed to the guide mechanism 50 , while the mold mounting platen 44 is not fixed but placed on platen surface support portions 52.

First claim

Opening claim text (preview).

The invention claimed is: 1. A movable platen comprising: a mold clamping platen having a projecting portion in a mold closing direction-side surface; a mold mounting platen mounted to the projecting portion of the mold clamping platen and configured to project from side surfaces of the mold clamping platen; and a guide mechanism fixed to the mold clamping platen and supporting the mold mounting platen, the guide mechanism comprising: a pair of platen surface support portions, a pair of leg portions constructed integrally with the pair of the platen surface support portions respectively, a pair of linear motion guides held on the pair of the leg portions to prevent floating of the mold clamping platen, and an adjustment mechanism configured to adjust the height of the mold mounting platen, the adjustment mechanism provided between the platen surface support portion of the guide mechanism and the mold on both sides of the mold mounting surface of the mold mounting platen, wherein only the mold clamping platen is fixed to the guide mechanism by using fixing members, while the mold mounting platen is not fixed but placed on the pair of the platen surface support portions of the guide mechanism. 2. The movable platen according to claim 1 , wherein the mold clamping platen is constructed integrally with the guide mechanism supporting the mold mounting platen. 3. The movable platen according to claim 1 , wherein the mold clamping platen is constructed integrally with the guide mechanism supporting the mold mounting platen.

Assignees

Inventors

Classifications

  • B22D17/263Primary

    mechanically · CPC title

  • using a toggle mechanism for mould clamping · CPC title

  • Dies (manufacture, see the appropriate class, e.g. B23P15/24); Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies · CPC title

  • Mechanisms or devices for locking or opening dies · CPC title

  • using toggles directly connected or linked to the fixed platen and indirectly to the movable platen · CPC title

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Frequently asked questions

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What does patent US11077594B2 cover?
A movable platen according to the present invention includes: a mold clamping platen 42 having a projecting portion 62 in a mold closing direction-side surface; a mold mounting platen 44 mounted to the projecting portion 62 of the mold clamping platen 42 ; and a guide mechanism 50 fixed to the mold clamping platen 42 and supporting the mold mounting platen 44 . Only the mold clamp…
Who is the assignee on this patent?
Toshiba Machine Co Ltd, Shibaura Machine Co Ltd
What technology area does this patent fall under?
Primary CPC classification B22D17/263. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 03 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).