Process system having locking pin and locking pin

Patent metadata

Field	Value
Publication number	US-11077535-B2
Application number	US-201815897133-A
Country	US
Kind code	B2
Filing date	Feb 14, 2018
Priority date	Feb 14, 2018
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

A process system of performing a fabrication process on a wafer includes a wafer storage cassette, one or more process chambers, a transfer chamber having a body and a lid that detachably covers the body, and a locking pin. The transfer chamber also includes a robot hub, a robot arm attached to the robot hub, and a blade attached to the robot arm. The body of the transfer chamber is connected to the wafer storage cassette and the process chambers, and the robot arm is configured to transfer a wafer from the wafer storage cassette through the body of the transfer chamber to one or more of the process chambers. The locking pin is configured to detachably attach to the robot arm to constrain the blade at a predetermined position within the transfer chamber.

First claim

What is claimed is:

1. A processing system for performing a fabrication process on a wafer, the processing system comprising:
a wafer storage cassette that receives at least one wafer;
one or more process chambers;
a transfer chamber having a body, a robot huh, a robot arm attached to the robot hub such that the arm can be extended into a position outward from the robot hub or contracted in a position toward the robot huh for moving a blade attached to the robot arm between an extended or contracted position, wherein the body of the transfer chamber is connected to the wafer storage cassette and the one or more process chambers, and the robot arm is configured to transfer the wafer on the blade from the wafer storage cassette through the body of the transfer chamber to one or more of the process chambers; and
a locking pin that detachably attaches to the robot arm when the robot arm is in the contracted position and when attached with the robot arm constrains the robot arm from extending and thereby contra ins the blade from moving or extending in a radial direction from the robot hub toward the body of the transfer chamber and constrains the blade at a predetermined position of the blade within the transfer chamber to prevent the blade from colliding with the body of the transfer chamber.

2. The processing system of claim 1 ,
wherein the blade is formed of a ceramic material.

3. The processing system of claim 1 ,
wherein the locking pin is formed of Teflon.

4. The processing system of claim 1 ,
wherein the locking pin includes a handle and a plurality of fingers that extend from the handle, and the fingers engage the robot arm to constrain the robot arm at a predetermined position of the robot arm.

5. The processing system of claim 4 ,
wherein the plurality of fingers have four fingers separated from each other.

6. The processing system of claim 4 ,
wherein the locking pin comprises a first side and a second side, the plurality of fingers extend from the handle in a first direction that is parallel to a surface of the first side and a surface of the second side, a first sidewall of a finger on the first side of the locking pin comprises a first width in a second direction that is perpendicular to the first direction, the first width is greater than a second width of a second sidewall of the finger in the second direction, the second sidewall is opposite the first sidewall, a third sidewall of the finger extends between the first sidewall and the second sidewall, and the third sidewall extends a predetermined angle from the first sidewall.

7. The processing system of claim 6 ,
wherein the predetermined angle is about 27 degrees from the first sidewall.

8. The processing system of claim 4 ,
wherein at least two fingers of the plurality of fingers have different thickness from each other.

9. The processing system of claim 4 ,
wherein the locking pin further includes an area on a surface of the locking pin having a different color from a color of the handle.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lopez Hector
• Moncada Juan

Classifications

• H10P90/00

  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3402

  Mechanical parts of transfer devices · CPC title

• H10P72/3304

  characterised by movements or sequence of movements of transfer devices · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title