Arrangement for dissipating heat of a power supply unit in a housing

US11076504B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11076504-B2
Application numberUS-202016811646-A
CountryUS
Kind codeB2
Filing dateMar 6, 2020
Priority dateMar 8, 2019
Publication dateJul 27, 2021
Grant dateJul 27, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present disclosure envisages an arrangement ( 100 ) for dissipating heat of a power supply unit ( 105 ) in a housing ( 110 ). The arrangement ( 100 ) comprises at least one packing member ( 120 ). The packing member ( 120 ) is disposed between the power supply unit ( 105 ) and an operative inner wall of the housing ( 110 ) to increase conductive thermal contact between inner walls of the housing ( 110 ) and the power supply unit ( 105 ). The arrangement ( 100 ) facilitates maximum surface contact between a power supply unit and inner walls of a housing.

First claim

Opening claim text (preview).

What is claimed is: 1. An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an inner wall of said housing, said arrangement configured to increase conductive thermal contact between the inner walls of said housing and said power supply unit; wherein said packing member is a wedge; wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member; and wherein said arrangement comprises a third tapered inner wall configured in said housing, said third tapered inner wall is orthogonal to said first tapered inner wall and said second inner wall, and said arrangement is configured to increase conductive thermal contact between said power supply unit and said first, second and third tapered walls. 2. The arrangement as claimed in claim 1 , wherein said packing member is thermally conductive. 3. The arrangement as claimed in claim 1 , wherein said packing member is a slab of constant cross-section. 4. The arrangement as claimed in claim 1 , wherein said arrangement includes at least one cavity configured on said wedge. 5. The arrangement as claimed in claim 1 , wherein the tapered angle of said wedge ranges from 1° to 10°. 6. An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an operative inner wall of said housing, said arrangement configured to increase conductive thermal contact between at least some of the inner walls of said housing and said power supply unit; wherein said packing member is a wedge; and wherein said wedge has chamfered edges. 7. The arrangement as claimed in claim 1 , wherein said wedge comprises screw lugs provided on opposite sides thereof to fasten said wedge to said housing. 8. An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an inner wall of said housing, said arrangement configured to increase conductive thermal contact between at least some of the inner walls of said housing and said power supply unit; wherein said packing member is a wedge; wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member; and wherein a tapered angle of said first tapered inner wall is equal to a tapered angle of said wedge. 9. The arrangement as claimed in claim 1 , wherein said arrangement includes a pair of guiding channels configured on the inner wall of said housing to guide said power supply unit in said housing. 10. The arrangement as claimed in claim 1 , wherein said arrangement includes a plurality of fins configured on an outer surface of said housing. 11. A method of dissipating heat of a power supply unit in a housing, said method comprising the step of inserting a packing member between an inner wall of said housing and said power supply unit to increase conductive thermal contact between the inner wall of said housing and said power supply unit; wherein said packing member is a wedge; wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member; and wherein said arrangement comprises a third tapered inner wall configured in said housing, said third tapered inner wall is orthogonal to said first tapered inner wall and said second inner wall, and said arrangement is configured to increase conductive thermal contact between said power supply unit and said first, second and third tapered walls. 12. The method as claimed in claim 11 , wherein said method comprises the step of securing said packing member within said housing via fasteners.

Assignees

Inventors

Classifications

  • Energy storage using batteries · CPC title

  • H05K7/2049Primary

    Pressing means used to urge contact, e.g. springs · CPC title

  • the casing being inside the housing of the lighting device · CPC title

  • the radiating structures being additional and fastened onto the housing · CPC title

  • of electrical circuits · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11076504B2 cover?
The present disclosure envisages an arrangement ( 100 ) for dissipating heat of a power supply unit ( 105 ) in a housing ( 110 ). The arrangement ( 100 ) comprises at least one packing member ( 120 ). The packing member ( 120 ) is disposed between the power supply unit ( 105 ) and an operative inner wall of the housing ( 110 ) to increase conductive thermal contact between inner walls of the ho…
Who is the assignee on this patent?
Appleton Grp Llc
What technology area does this patent fall under?
Primary CPC classification H05K7/2049. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).