Semiconductor relay module and semiconductor relay circuit

Patent metadata

Field	Value
Publication number	US-11075630-B2
Application number	US-202017067761-A
Country	US
Kind code	B2
Filing date	Oct 12, 2020
Priority date	Oct 30, 2019
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.

First claim

The invention claimed is:

1. A semiconductor relay module comprising:
a first semiconductor relay including a first input circuit and a first output circuit;
a second semiconductor relay including a second input circuit and a second output circuit;
a third semiconductor relay including a third input circuit and a third output circuit;
a package configured to house the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay in the package;
a first input terminal disposed in the package, a part of the first input terminal being exposed outside of the package;
a second input terminal disposed in the package, a part of the second input terminal being exposed outside of the package;
a third input terminal disposed in the package, a part of the third input terminal being exposed outside of the package;
a first output terminal disposed in the package, a part of the first output terminal being exposed outside of the package;
a second output terminal disposed in the package, a part of the second output terminal being exposed outside of the package;
a third output terminal disposed in the package, a part of the third output terminal being exposed outside of the package;
a first connection line connecting the first output circuit and the second output circuit in the package; and
a first monitor terminal connected to the first connection line in the package, a part of the first monitor terminal being exposed outside of the package,
the first input circuit and the second input circuit being connected to the first input terminal and the second input terminal in the package,
the third input circuit being connected to the first input terminal or the second input terminal in the package,
the third input circuit being connected to the third input terminal in the package,
the first output circuit being connected to the first output terminal and the first connection line in the package,
the second output circuit being connected to the second output terminal and the first connection line in the package,
the third output circuit being connected to the third output terminal and the first connection line in the package,
in a first state in which a current flows through the first input terminal and the second input terminal without flowing through the third input terminal, the first output circuit and the second output circuit being configured to be turned on, the third output circuit being configured to be turned off, the first output terminal and the second output terminal being configured to be electrically connected to each other, and the first connection line and the third output terminal being configured to be electrically disconnected to each other, and
in a second state in which a current flows through the third input terminal without flowing through the first input terminal and the second input terminal, the first output circuit and the second output circuit being configured to be turned off, the third output circuit being configured to be turned on, the first output terminal and the second output terminal being configured to be electrically disconnected to each other, and the first connection line and the third output terminal being configured to be electrically connected to each other.

2. A semiconductor relay circuit comprising:
the semiconductor relay module according to claim 1 ;
a power supply terminal connected to the first input terminal;
a control terminal; and
a control circuit connected to the control terminal, the first input terminal, the second input terminal, and the third input terminal, the control circuit being configured to switch between the first state and the second state according to an input signal supplied to the control terminal.

3. The semiconductor relay module according to claim 1 , further comprising:
a fourth semiconductor relay including a fourth input circuit and a fourth output circuit;
a fifth semiconductor relay including a fifth input circuit and a fifth output circuit;
a sixth semiconductor relay including a sixth input circuit and a sixth output circuit;
a fourth output terminal disposed in the package, a part of the fourth output terminal being exposed outside of the package;
a fifth output terminal disposed in the package, a part of the fifth output terminal being exposed outside of the package;
a second connection line connecting the fourth output circuit and the fifth output circuit in the package; and
a second monitor terminal connected to the second connection line in the package, a part of the second monitor terminal being exposed outside of the package, wherein
the fourth input circuit and the fifth input circuit are connected to the first input terminal and the second input terminal in the package,
the sixth input circuit is connected to the first input terminal or the second input terminal in the package,
the sixth input circuit is connected to the third input terminal in the package,
the fourth output circuit is connected to the fourth output terminal and the second connection line in the package,
the fifth output circuit is connected to the fifth output terminal and the second connection line in the package, and
the sixth output circuit is connected to the third output terminal and the second connection line in the package.

4. The semiconductor relay module according to claim 3 , wherein
in the first state, the first output circuit, the second output circuit, the fourth output circuit, and the fifth output circuit are configured to be turned on, and the third output circuit and the sixth output circuit are configured to be turned off, the first output terminal and the second output terminal are configured to be electrically connected to each other, the fourth output terminal and the fifth output terminal are configured to be electrically connected to each other, the first connection line and the third output terminal are configured to be disconnected to each other, and the second connection line and the third output terminal are configured to be disconnected to each other, and
in the second state, the first output circuit, the second output circuit, the fourth output circuit, and the fifth output circuit are configured to be turned off, the third output circuit and the sixth output circuit are configured to be turned on, the first output terminal and the second output terminal are configured to be disconnected to each other, the fourth output terminal and the fifth output terminal are configured to be disconnected to each other, the first connection line and the third output terminal are configured to be connected to each other, and the second connection line and the third output terminal are configured to be connected to each other.

5. A semiconductor relay circuit comprising:
the semiconductor relay module according to claim 4 ;
a power supply terminal connected to the first input terminal;
a control terminal;
a control circuit connected to the control terminal, the first input terminal, the second input terminal, and the third input terminal, the control circuit being configured to switch between the first state and the second state according to an input signal supplied to the control terminal.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Sasaki Shinya
• Akutagawa Toshinobu
• Okada Shigenari

Classifications

• H01H47/32 Primary

  Energising current supplied by semiconductor device · CPC title

• H01H47/02

  for modifying the operation of the relay · CPC title

• H01F7/06

  Electromagnets; Actuators including electromagnets {(electric coils H01F5/00; devices for holding workpieces using electric force B23Q3/15; load-engaging elements for lifting articles electromagnetically B66C1/06; electromagnetic couplings F16D27/00; magnetic brakes F16D63/002; electromagnetically operated valves F16K11/24, F16K31/00; analysing materials by magnetic means G01N27/72, G01N27/80; electromagnets for winding mechanical clocks G04C1/02; electromagnetic relays H01H51/00; windings for salient poles of dynamo-electric machines H02K3/18; electromagnets for telegraphic communication H04L; for arc lamps H05B31/28)} · CPC title

• H01H50/02

  Bases; Casings; Covers (frames for mounting two or more relays or for mounting a relay and another electric component H02B1/01, H04Q1/08, H05K) · CPC title

• H01H50/00

  Details of electromagnetic relays ({H01H51/28 takes precedence;} electric circuit arrangements H01H47/00; details of electrically-operated selector switches H01H63/00) · CPC title