Tamper-proof electronic transaction device

US11074588B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11074588-B2
Application numberUS-202016863134-A
CountryUS
Kind codeB2
Filing dateApr 30, 2020
Priority dateJan 26, 2016
Publication dateJul 27, 2021
Grant dateJul 27, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Tamper-proofing and secure identity validation techniques in a transaction processing system and secure electronic payment techniques are disclosed. A tamper-proof transaction processing device is provided and comprises at least two different strength adhesives to secure parts of the device together and a housing comprising at least a first and second protective layer. An electronic component comprising a secure element chip storing unique information relating to the chip is located between the first and second protective layer in the housing. In another aspect, a transaction processing system includes a payment instrument that is configured to approve only negative value and/or zero value transaction requests. Another aspect provides an identity card checking system and method where the identity card is brought into proximity of a data processing device and identity information is displayed on the screen of the data processing device for the period of time while the card is in proximity.

First claim

Opening claim text (preview).

The invention claimed is: 1. A tamper-proof transaction processing device comprising: a housing including at least a first protective layer and a second protective layer; an electronic component arranged within the housing, the electronic component comprising a secure element chip storing unique information relating to the secure element chip; and at least two different strength adhesives, the at least two different strength adhesives securing together different parts of the tamper-proof transaction processing device; wherein the electronic component is arranged between the first protective layer and the second protective layer; and wherein the electronic component is provisioned to only receive funds. 2. The device of claim 1 , wherein the secure element chip is provided in a first region of the electronic component; wherein a first strength adhesive is provided to secure at least a part of the secure element chip to at least a part of the first protective layer; wherein a second strength adhesive or no adhesive is provided to secure at least a part of the first region of the secure element chip to at least a part of the second protective layer; and wherein the electronic component is configured to detach from the device through an application of force in a direction away from the first protective layer while the secure element chip is adapted to remain attached to the first protective layer. 3. The device of claim 2 , wherein the second strength adhesive is provided to secure at least a part of a region outside the first region of the electronic component to the first protective layer. 4. The device of claim 3 , wherein the first strength adhesive is used to secure at least a part of the region outside the first region of the electronic component to the second protective layer. 5. The device of claim 2 , wherein the first strength adhesive is epoxy, methacrylate or contact bond adhesive, and/or the second strength adhesive is a removable adhesive. 6. The device of claim 1 , wherein the first protective layer is secured to a surface of a service dispensing device with a first strength adhesive. 7. The device of claim 1 , wherein a top surface of the first protective layer comprises indicia that indicates when tampering of the device has occurred. 8. The device of claim 1 , wherein the electronic component is a contactless EMV smart card. 9. A tamper-proof transaction processing device comprising: a housing including at least a first protective layer and a second protective layer; an electronic component arranged within the housing; an adhesive provided between the first protective layer and the second protective layer; and a mounting block configured to attach the tamper-proof transaction processing device to a mounting surface of a service dispensing device; wherein the electronic component is arranged between the first protective layer and the second protective layer; and wherein the electronic component is provisioned to only receive funds. 10. The device of claim 9 , further comprising: a mounting screw adapted to be inserted into the mounting block. 11. The device of claim 9 , wherein the adhesive is provided between the mounting block and the mounting surface. 12. The device of claim 9 , wherein the electronic component comprises a secure element chip storing unique information relating to the secure element chip. 13. The device of claim 12 , wherein the unique information comprises one of a primary account number (PAN) associated with a payment instrument and a tokenized PAN associated with the payment instrument. 14. The device of claim 12 , further comprising: a first strength adhesive provided on a first surface of the secure element chip; and a second strength adhesive provided on a second surface of the secure element chip. 15. The device of claim 9 , wherein the first and second protective layers comprise at least one of polyvinyl chloride, polycarbonate, polyester, or polyethylene terephthalate. 16. The device of claim 9 , further comprising: a first strength adhesive provided between the second protective layer and the mounting surface. 17. The device of claim 9 , further comprising: a first strength adhesive provided between the first protective layer and the mounting block. 18. A transaction processing system comprising: a service dispensing device; and a tamper-proof transaction processing device, the tamper-proof transaction processing device comprising: a housing including at least a first protective layer and a second protective layer; and an electronic component arranged within the housing, the electronic component comprising a secure element chip storing unique information relating to the secure element chip; wherein the service dispensing device is configured to: initiate an identity check when a payment instrument is brought into close proximity of a the tamper-proof transaction processing device to communicate with the payment instrument, the tamper-proof transaction processing device being configured to communicate with the service dispensing device. 19. The system of claim 18 , wherein the service dispensing device is configured to display identity information of a registered owner of the payment instrument on a display when the payment instrument and data processing device are in close proximity. 20. The system of claim 19 , wherein the identity information includes an image of the register owner of the payment instrument.

Assignees

Inventors

Classifications

  • G06Q20/20Primary

    Point-of-sale [POS] network systems · CPC title

  • Active cards, i.e. cards including their own processing means, e.g. including an IC or chip · CPC title

  • insuring higher security of transaction · CPC title

  • G06Q20/405Primary

    Establishing or using transaction specific rules · CPC title

  • RFID or NFC payments by means of M-devices · CPC title

Patent family

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What does patent US11074588B2 cover?
Tamper-proofing and secure identity validation techniques in a transaction processing system and secure electronic payment techniques are disclosed. A tamper-proof transaction processing device is provided and comprises at least two different strength adhesives to secure parts of the device together and a housing comprising at least a first and second protective layer. An electronic component c…
Who is the assignee on this patent?
Worldpay Ltd
What technology area does this patent fall under?
Primary CPC classification G06Q20/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).