Thermal cooling system

Patent metadata

Field	Value
Publication number	US-11073878-B2
Application number	US-201815957874-A
Country	US
Kind code	B2
Filing date	Apr 19, 2018
Priority date	Apr 19, 2018
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.

First claim

What is claimed is:

1. A device comprising:
a baseplate for a keyboard;
at least one heat source below the baseplate; and
a vapor chamber, wherein the vapor chamber is between the at least one heat source and baseplate and is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, wherein the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener.

2. The device of claim 1 , further comprising:
at least one fin array coupled to the vapor chamber.

3. The device of claim 2 , wherein the at least one fin array is soldered to the vapor chamber.

4. The device of claim 2 , further comprising:
at least one air mover.

5. The device of claim 4 , wherein the at least one air mover directs air through the at least one fin array and out of the device using an exhaust vent located in a vented foot, wherein the vented foot supports and elevates a portion of the device when the device is on a surface and allows air to pass under the device.

6. The device of claim 1 , further comprising:
a first air mover on a first side of the at least one heat source; and
a second air mover on an opposite side of the at least one heat source.

7. The device of claim 1 , further comprising:
a first air mover on a first side of the at least one heat source;
a first fin array soldered to a first side of the vapor chamber, wherein exhaust from the first air mover can pass through the first fin array and out of the device using a first exhaust vent located in a first vented foot;
a second air mover on an opposite side of the at least one heat source; and
a second fin array soldered to a second side of the vapor chamber, wherein exhaust from the second air mover can pass through the second fin array and out of the device using a second exhaust vent located in a second vented foot, wherein the first vented foot and the second vented foot support and elevate a portion of the device when the device is on a surface and allow air to pass under the device.

8. A system for thermal cooling, the system comprising:
a plurality of electronics;
a baseplate for a keyboard;
at least one heat source below the baseplate; and
a vapor chamber, wherein the vapor chamber is between the at least one heat source and baseplate and is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, wherein the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener.

9. The system of claim 8 , further comprising:
at least one fin array coupled to the vapor chamber.

10. The system of claim 9 , wherein the at least one fin array is soldered to at least one end of the vapor chamber.

11. The system of claim 9 , further comprising:
at least one air mover, wherein the air mover directs air through the fin array and away from the system using an exhaust vent located in a vented foot, wherein the vented foot supports and elevates a portion of a device that includes the system when the device is on a surface and allows air to pass under the device.

12. The system of claim 8 , further comprising:
a first air mover on a first side of the at least one heat source; and
a second air mover on an opposite side of the at least one heat source.

13. The system of claim 8 , further comprising:
a first air mover on a first side of the at least one heat source;
a first fin array soldered to a first side of the vapor chamber, wherein exhaust from the first air mover can pass through the first fin array and away from the system using a first exhaust vent located in a first vented foot;
a second air mover on an opposite side of the at least one heat source; and
a second fin array soldered to a second side of the vapor chamber, wherein exhaust from the second air mover can pass through the second fin array and away from the system using a second exhaust vent located in a second vented foot, wherein the first vented foot and the second vented foot support and elevate a portion of a device that includes the system and the first vented foot and the second vented foot allow air to pass under the device when the device is on a surface.

Assignees

• Intel Corp

Inventors

• Liu Baomin
• Escamilla Eduardo
• Utz James

Classifications

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• G06F1/206

  comprising thermal management · CPC title

• G06F1/20

  Cooling means · CPC title