Manufacturing method for shear and normal force sensor

Patent metadata

Field	Value
Publication number	US-11073434-B2
Application number	US-201916703114-A
Country	US
Kind code	B2
Filing date	Dec 4, 2019
Priority date	Jul 25, 2019
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

Provided are a method of manufacturing a shear and normal force sensor including fabricating raised and sunken polymers having a plurality of bent parts of bent shapes, forming an electrode pattern on one surface of a piezoelectric element, and embedding the piezoelectric element between the raised and sunken polymers, and a shear and normal force sensor including raised and sunken polymers having a plurality of bent parts of bent shapes, a piezoelectric element embedded between the raised and sunken polymers and having an electrode pattern on one surface, and a flexible printed circuit board (FPCB) embedded between the sunken polymer and the piezoelectric element and electrically connected to the electrode pattern.

First claim

What is claimed is:

1. A method of manufacturing a shear and normal force sensor, comprising:
fabricating raised and sunken polymers having a plurality of bent parts of bent shapes;
forming an electrode pattern on one surface of a piezoelectric element; and
embedding the piezoelectric element between the raised and sunken polymers;
wherein
the fabricating includes fabricating a sunken polymer of the sunken polymers to have at least one recess shaped to fit a raised shape of a raised polymer of the raised polymers;
the fabricating the raised polymers includes fabricating a substantially planar base portion and raised portions in a center region of the base portion,
the fabricating the raised positions includes fabricating a first sloped portion extending from the base portion, a substantially planar top portion extending from an end of the first sloped portion, and a second sloped portion extending from an end of the top portion toward the base portion, and
the fabricating the raised portions further includes fabricating a pair of the raised portions to be adjacent to each other and separated by a V-shaped recess.

2. The method of manufacturing a shear and normal force sensor according to claim 1 , further comprising:
embedding a flexible printed circuit board (FPCB) between the sunken polymer of the sunken polymers and the piezoelectric element.

3. The method of manufacturing a shear and normal force sensor according to claim 1 , wherein a bent part of the plurality of bent parts has a trapezoidal shape.

4. The method of manufacturing a shear and normal force sensor according to claim 1 , wherein shapes of the raised and sunken polymers match each other.

5. The method of manufacturing a shear and normal force sensor according to claim 1 , wherein each of the raised and sunken polymers is made of polydimethylsiloxane (PDMS).

6. The method of manufacturing a shear and normal force sensor according to claim 1 , wherein the piezoelectric element is made of polyvinylidene fluoride (PVDF).

Assignees

• Korea Inst Sci & Tech

Inventors

• Cha Youngsu
• Lee Ye Rim

Classifications

• G01L5/167

  using piezoelectric means · CPC title

• G01L1/16 Primary

  using properties of piezoelectric devices · CPC title

• G01L5/0061

  Force sensors associated with industrial machines or actuators (for the specific machine or actuator involved see relevant class, e.g. F01, F04, F16, B66, E21) · CPC title

• H01L41/1132

  Electricity · mapped topic

• H01L41/193

  Electricity · mapped topic