Surface mechanical attrition treatment (SMAT) methods and systems for modifying nanostructures

US11072867B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11072867-B2
Application numberUS-201715723822-A
CountryUS
Kind codeB2
Filing dateOct 3, 2017
Priority dateFeb 26, 2015
Publication dateJul 27, 2021
Grant dateJul 27, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

Described herein are systems and methods for performing a surface mechanical attrition treatment (SMAT) to the surface of a variety of materials including thin films, nanomaterials, and other delicate and brittle materials. In an aspect, a surface of a material is modified to a modified surface and from an original state to a modified state, wherein the modified state comprises a physical modification, a chemical modification, or a biological modification. In another aspect, a surface mechanical attrition treatment (SMAT) is applied to the modified surface of the material for a defined duration of time, wherein a condition associated with the SMAT is adjusted based on a structural composition of the material. In yet another aspect, a defined strain is imposed on the structural composition of the material based on the SMAT.

First claim

Opening claim text (preview).

What is claimed is: 1. A system, comprising: a chamber configured to hold an object therein comprising a surface layer and a substrate layer; a set of balls provided within the chamber; an ultrasonic vibration generator connected to the chamber and comprising: a converter component configured to receive an electrical signal and convert the electrical signal into an oscillating wave; and a horn component configured to emit the oscillating wave toward the set of balls at a vibrational frequency, defined by a controller, that causes the set of balls to collide with the surface layer of the object at a target impact level that results in a rearrangement of atoms of the surface layer into a lattice structure, wherein the target impact level is less than an impact level that results in more than the rearrangement of the atoms of the surface layer into the lattice structure; and an anodization component configured to pass a current through the surface layer to anodize the surface layer. 2. The system of claim 1 , wherein the target impact level does not result in structural changes to one or more layers of the object other than then surface layer, and wherein the one or more layers include the substrate layer. 3. The system of claim 1 , wherein the target impact level does not result in indentations in the surface layer. 4. The system of claim 1 , wherein the rearrangement of the atoms of the surface layer into the lattice structure increases a charge trapping property. 5. The system of claim 1 , further comprising: a heating component that applies heat according to a defined temperature to the surface layer. 6. A system, comprising: a chamber configured to contain an object comprising a surface layer and a substrate layer; a set of balls provided within the chamber; and an ultrasonic vibration generator connected to the chamber and comprising: a converter component configured to receive an electrical signal and convert the electrical signal into an oscillating wave; a horn component configured to emit the oscillating wave toward the set of balls at a defined ultrasonic vibrational force, specified by an output of a controller, that causes the set of balls to collide with the surface layer of the object at a target speed that results in a rearrangement of atoms of the surface layer into a lattice structure, wherein the target speed level is less than a speed that results in structural changes to one or more layers of the object other than then surface layer, and wherein the one or more layers comprise the substrate layer; and an anodization component configured to pass a current through the surface layer to anodize the surface layer. 7. The system of claim 6 , wherein the target speed does not result in more than the rearrangement of the atoms of the surface layer into the lattice structure. 8. The system of claim 6 , wherein the target speed does not result in indentations in the surface layer. 9. The system of claim 6 , wherein the rearrangement of the atoms of the surface layer into the lattice structure increases a charge trapping property of the surface layer. 10. The system of claim 6 , wherein the object comprises a thin film. 11. The system of claim 10 , wherein the surface layer comprises nanostructures. 12. A system, comprising: a chamber that holds an object comprising a surface layer and a substrate layer; balls provided within the chamber; and an ultrasonic vibration generator connected to the chamber and comprising: a power generator that converts a power stream to an electrical signal; a converter component that converts the electrical signal to an oscillating wave; and a horn component that emits the oscillating wave toward the balls at a target vibrational frequency, specified by a controller, that induces collision of the balls with the surface layer of the object at a target speed that results in a rearrangement of atoms of the surface layer into a lattice structure, wherein the target speed level is less than a speed that results in structural changes to one or more layers of the object other than then surface layer, and wherein the one or more layers comprise the substrate layer, an anodization component that passes a current via the surface layer to anodize the surface layer; and a heating component that applies heat according to a defined temperature to the surface layer. 13. The system of claim 12 , wherein the chamber comprises: a material housing portion connected to a ceiling of the chamber that holds the object; and a receptacle portion connected to a floor of the chamber opposite the ceiling that contains the balls, and wherein the horn component is connected to the receptacle portion. 14. The system of claim 12 , wherein the chamber has a geometrical shape selected from the group consisting of: a cylinder, a cube, a cone, a sphere, a pyramid, a cuboid, a triangular prism, a hexagonal prism, a hemisphere, a dodecahedron, an irregular three-dimensional shape, and a flat-topped three-dimensional shape. 15. The system of claim 12 , further comprising: a modification component that adjusts a dimension of the chamber to achieve the target speed. 16. The system of claim 12 , further comprising: a controller component that controls a power supply level of the power stream to control emission of the oscillating wave at the target vibrational frequency. 17. The system of claim 12 , wherein the balls are formed with a material selected from a group consisting of: a metal material, a ceramic material, a semiconductor material, and a plastic material. 18. The system of claim 12 , further comprising: an atmospheric component that adjusts an atmospheric condition within the chamber, wherein the atmospheric condition comprises at least one of a temperature, a pressure, a climate, or an atmospheric chemical composition. 19. The system of claim 12 , wherein the rearrangement of the atoms of the surface layer into the lattice structure increases a charge trapping property of the surface layer. 20. The system of claim 12 , wherein the object comprises a thin film and wherein the surface layer comprises nanostructures.

Assignees

Inventors

Classifications

  • Ultrasonics · CPC title

  • C25D11/005Primary

    Apparatus specially adapted for electrolytic conversion coating (apparatus in general for electrolytic coating C25D17/00) · CPC title

  • After-treatment · CPC title

  • Acoustic wave CVD · CPC title

  • of refractory metals or alloys based thereon · CPC title

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What does patent US11072867B2 cover?
Described herein are systems and methods for performing a surface mechanical attrition treatment (SMAT) to the surface of a variety of materials including thin films, nanomaterials, and other delicate and brittle materials. In an aspect, a surface of a material is modified to a modified surface and from an original state to a modified state, wherein the modified state comprises a physical modif…
Who is the assignee on this patent?
Univ City Hong Kong
What technology area does this patent fall under?
Primary CPC classification C25D11/005. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).