Surface-treated silica filler, and resin composition containing surface-treated silica filler

Patent metadata

Field	Value
Publication number	US-11072710-B2
Application number	US-201716474586-A
Country	US
Kind code	B2
Filing date	Nov 28, 2017
Priority date	Dec 28, 2016
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

The present invention provides a surface-treated silica filler for suppressing an increase in viscosity when added to a resin composition used for applications such as a semiconductor sealing material, and the resin composition containing the surface-treated silica filler. The surface-treated silica filler of the present invention is surface-treated with a basic substance having an acid dissociation constant (pKa) of its conjugate acid of 9.4 or more.

First claim

The invention claimed is:

1. A surface-treated silica filler, wherein a basic substance having an acid dissociation constant (pKa) of its conjugate acid of 9.4 or more is chemisorbed to an acidic silanol group present on the surface of the silica filler by surface treatment with the basic substance having the pKa of 9.4 or more, and
wherein the surface-treated silica filler has a pH of 5.3 to 7.3 after heat treatment at 150° C. for 4 hours.

2. The surface-treated silica filler according to claim 1 , wherein the basic substance having the pKa of 9.4 or more is selected from the group consisting of benzylamine, 2-methoxyethylamine, 3-amino-1-propanol, 3-aminopentane, 3-methoxypropylamine, cyclohexylamine, n-butylamine, dimethylamine, diisopropylamine, piperidine, pyrrolidine, and 1,8-diazabicyclo [5.4.0]-7-undecene (DBU), and combinations thereof.

3. The surface-treated silica filler according to claim 1 , wherein the silica filler is selected from the group consisting of spherical silica powder obtained by reacting metal silicon with oxygen, spherical silica powder obtained by melting pulverized silica, and pulverized silica.

4. The surface-treated silica filler according to claim 1 , wherein the silica filler is obtained by a method selected from the group consisting of sol-gel method, precipitation method, and aqueous solution wet method.

5. The surface-treated silica filler according to claim 1 , which is surface-treated with the basic substance having the pKa of 9.4 or more, and then further surface-treated with a silane coupling agent.

6. The surface-treated silica filler according to claim 5 , wherein the silane coupling agent is selected from the group consisting of an epoxy silane coupling agent, an amine-based silane coupling agent, a vinyl silane coupling agent, and an acrylic silane coupling agent.

7. A resin composition comprising the surface-treated silica filler according to claim 1 .

8. A semiconductor sealing material comprising the resin composition according to claim 7 .

9. A one-component adhesive comprising the resin composition according to claim 7 .

10. An adhesive film comprising the resin composition according to claim 7 .

11. The surface-treated silica filler according to claim 1 , wherein the basic substance having the pKa of 9.4 or more is selected from the group consisting of benzylamine, 3-methoxypropylamine, pyrrolidine, and combinations thereof.

12. The surface-treated silica filler according to claim 1 , wherein a sphericity of a silica filler to be surface-treated is 0.8 or more.

13. The surface-treated silica filler according to claim 1 , wherein the surface-treated silica filler is mixed to form a resin after pre-drying.

14. The surface-treated silica filler according to claim 2 , which is surface-treated with the basic substance having the pKa of 9.4 or more, and then further surface-treated with a silane coupling agent.

15. The surface-treated silica filler according to claim 2 , wherein the surface-treated silica filler is mixed to form a resin after pre-drying.

16. The surface-treated silica filler according to claim 5 , wherein the basic substance having the pKa of 9.4 or more is selected from the group consisting of benzylamine, 3-methoxypropylamine, pyrrolidine, and combinations thereof.

17. The surface-treated silica filler according to claim 5 , wherein the surface-treated silica filler is mixed to form a resin after pre-drying.

Assignees

• Namics Corp

Inventors

• Sato Ayako
• Kajita Masashi

Classifications

• H10W74/473

  containing a filler · CPC title

• C09J11/04

  inorganic · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C08K9/04

  Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)} · CPC title

• C09J7/20

  characterised by their carriers · CPC title