Method of manufacturing mold

US11072038B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11072038-B2
Application numberUS-201916255866-A
CountryUS
Kind codeB2
Filing dateJan 24, 2019
Priority dateMar 2, 2018
Publication dateJul 27, 2021
Grant dateJul 27, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a mold includes the processes of: arranging a channel member in a recessed groove formed on a surface of a mold body; irradiating an opening part of the recessed groove with a first laser, thereby performing a first build-up welding on a part in the vicinity of the opening part of the recessed groove; and irradiating a region on a surface of the mold body including a region where the first build-up welding has been performed with a second laser, thereby performing a second build-up welding on a region on the surface of the mold body including the region where the first build-up welding has been performed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a mold including a cooling passage inside therein, the method comprising the processes of: arranging a channel member, which serves as a wall part of the cooling passage, in a recessed groove formed on a surface of a mold body; irradiating an opening part of the recessed groove with a first laser at a first output and a first energy density, the first laser being set in such a way that the channel member is prevented from being damaged, thereby performing a first build-up welding on a part in the vicinity of the opening part of the recessed groove; and irradiating a region on a surface of the mold body including a region where the first build-up welding has been performed with a second laser at a second output that is higher than the first output and a second energy density that is lower than the first energy density, the second laser being set in such a way that a build-up speed becomes higher than in a case in which the first laser is applied, thereby performing a second build-up welding on a region on the surface of the mold body including the region where the first build-up welding has been performed. 2. The method of manufacturing the mold according to claim 1 , wherein the first laser is a pulsed laser, and the second laser is a continuous wave laser. 3. The method of manufacturing the mold according to claim 1 , comprising processing, after the process of performing the first build-up welding but before the second build-up welding is performed, a region on which at least the first build-up welding has been performed in a planar shape, thereby making the region in which the first build-up welding has been performed flush with the surface of the mold body. 4. The method of manufacturing the mold according to claim 1 , wherein the material of the first build-up welding is different from the material of the second build-up welding.

Assignees

Inventors

Classifications

  • B23K26/342Primary

    Build-up welding · CPC title

  • for cooling · CPC title

  • Cooling means for welding or cutting · CPC title

  • for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

  • Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass (if the particular kinds of operation are not essential B23Q37/00 - B23Q41/00; {working by laser beam combined with other working of metal B23K26/0093}) · CPC title

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What does patent US11072038B2 cover?
A method of manufacturing a mold includes the processes of: arranging a channel member in a recessed groove formed on a surface of a mold body; irradiating an opening part of the recessed groove with a first laser, thereby performing a first build-up welding on a part in the vicinity of the opening part of the recessed groove; and irradiating a region on a surface of the mold body including a r…
Who is the assignee on this patent?
Toyota Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23K26/342. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).