Composite sintered body
US-2017050886-A1 · Feb 23, 2017 · US
Wear-resistant tool
US11072008B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11072008-B2 |
| Application number | US-201615771591-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 19, 2016 |
| Priority date | Oct 30, 2015 |
| Publication date | Jul 27, 2021 |
| Grant date | Jul 27, 2021 |
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Abstract
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A wear-resistant tool includes composite polycrystalline diamond as a core, the composite polycrystalline diamond being composed of polycrystalline diamond in which particulate diamond is directly bonded and non diamond carbon. The polycrystalline diamond in the composite polycrystalline diamond is three-dimensionally continuous in composite polycrystal and primary particles have an average particle size from 10 to 500 nm.
First claim
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The invention claimed is: 1. A wear-resistant tool comprising composite polycrystalline diamond as a core, the composite polycrystalline diamond consisting essentially of polycrystalline diamond and non-diamond carbon, the polycrystalline diamond including a plurality of diamond particulates, and the plurality of diamond particulates are directly bonded to one another, the non-diamond carbon is dispersed in a surface which functions for machining of the wear-resistant tool, and a ratio of an area of non-diamond carbon to an area of the surface which functions for machining is from 0.05% to 30%. 2. The wear-resistant tool according to claim 1 , wherein the polycrystalline diamond in the composite polycrystalline diamond is three-dimensionally continuous in composite polycrystal and primary particles have an average particle size from 10 to 500 nm. 3. The wear-resistant tool according to claim 1 , wherein a ratio of the non-diamond carbon in the composite polycrystalline diamond is from 0.05% to 20% in volume ratio. 4. The wear-resistant tool according to claim 1 , wherein the non-diamond carbon is graphite-like carbon. 5. The wear-resistant tool according to claim 1 , wherein the non-diamond carbon in the composite polycrystalline diamond is compressed graphite. 6. The wear-resistant tool according to claim 1 , wherein the ratio is from 0.05 to 20%. 7. The wear-resistant tool according to claim 1 , wherein a hole is provided in the composite polycrystalline diamond, the surface which functions for machining is formed in the hole, and the surface which functions for machining has surface roughness Sa not smaller than 1 nm and not greater than 300 nm. 8. The wear-resistant tool according to claim 1 , the wear-resistant tool being a wire drawing die, wherein a bearing portion of a hole has circularity not greater than 0.2 μm. 9. The wear-resistant tool according to claim 1 , the wear-resistant tool being a wire drawing die, wherein a reduction angle of a hole profile is from 3 to 20°. 10. The wear-resistant tool according to claim 9 , the wear-resistant tool being the wire drawing die, wherein the reduction angle of the hole profile is from 3 to 10°. 11. The wear-resistant tool according to claim 1 , the wear-resistant tool being a wire drawing die, wherein a length of a bearing portion is not smaller than 0.2D and not greater than 1.0D where D represents a diameter of the bearing portion of a hole profile. 12. The wear-resistant tool according to claim 11 , wherein the bearing portion has a length not smaller than 0.6D and not greater than 1.0D.
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- What does patent US11072008B2 cover?
- A wear-resistant tool includes composite polycrystalline diamond as a core, the composite polycrystalline diamond being composed of polycrystalline diamond in which particulate diamond is directly bonded and non diamond carbon. The polycrystalline diamond in the composite polycrystalline diamond is three-dimensionally continuous in composite polycrystal and primary particles have an average par…
- Who is the assignee on this patent?
- Sumitomo Electric Industries, Almt Corp
- What technology area does this patent fall under?
- Primary CPC classification B21C3/025. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).