Pins for heat exchangers
US-2016178287-A1 · Jun 23, 2016 · US
Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling
US11071234B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11071234-B2 |
| Application number | US-201916667720-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 29, 2019 |
| Priority date | Oct 30, 2018 |
| Publication date | Jul 20, 2021 |
| Grant date | Jul 20, 2021 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A heat sink and method of making the same. The heat sink having one or more helical fins. The helical fins configured such that the pressure field on either side of the fin is asymmetric.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat sink comprising: one or more helical fins; said helical fins have a pin base, terminal end and an elongated section connecting said pin base to said terminal end; and a portion of said elongated section has a diameter larger than said terminal end and said pin base. 2. The heat sink of claim 1 wherein said one or more helical fins are configured such that fluid curves around the fin to increase heat transfer. 3. The heat sink of claim 2 wherein said one or more helical fins are configured to create vortices to disrupt the flow field. 4. The heat sink of claim 1 wherein at least said one or more helical fins has a pin base, terminal end and an elongated section connecting said pin base to said terminal end. 5. The heat sink of claim 1 wherein said pin base and said terminal end have an elliptical cross-section. 6. The heat sink of claim 5 wherein said elliptical cross-section of said pin base is larger than said elliptical cross-section of said terminal end. 7. The heat sink of claim 6 wherein said elongated section tapers from said pin base to said terminal end. 8. The heat sink of claim 7 wherein said one or more fins are metallic or non-metallic or combinations thereof.
Assignees
Inventors
Classifications
Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title
the means being wires or pins · CPC title
- H05K7/2039Primary
characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title
Article comprising helical form elements (B22F5/085 takes precedence) · CPC title
Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11071234B2 cover?
- A heat sink and method of making the same. The heat sink having one or more helical fins. The helical fins configured such that the pressure field on either side of the fin is asymmetric.
- Who is the assignee on this patent?
- Univ Arkansas, Board Of Trastees Of The Univ Of Arkansas
- What technology area does this patent fall under?
- Primary CPC classification H05K7/2039. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).